• Journal of the Korean institute of surface engineering
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• v.57 no.4
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• pp.225-233
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• 2024

The plastic plating process refers to coating a thin metal film onto a plastic surface. This technique has become essential for replacing costly metal products while maintaining equivalent performance, making plastic plating a critical technology. This paper presents an overview of the methods and future prospects of plastic plating.

• Transactions on Electrical and Electronic Materials
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• v.11 no.4
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• pp.174-177
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• 2010

We have developed an environment-friendly etching process, an alternative to the dichromic acid etching process, as a pretreatment of acrylonitrile-butadiene-styrene (ABS) plastic for electroless plating. In order to plate ABS plastic in an electroless way, there should be fine holes on the surface of the ABS plastic to enhance mechanically the adhesion strength between the plastic surface and the plate. To make these holes, the surface was coated uniformly with dispersed chemical foaming agents in a mixture of environmentally friendly dispersant and solvent by the methods of dipping or direct application. The solvent seeps into just below the surface and distributes the chemical foaming agents uniformly beneath the surface. After drying off the surface, the surface was heated at a temperature well below the glass transition temperature of ABS plastic. By pyrolysis, the chemical foaming agents made fine holes on the surface. In order to discover optimum conditions for the formation of fine holes, the mixing ratio of the solvent, the dispersant and the chemical foaming agent were controlled. After the etching process, the surface was plated with nickel. We tested the adhesion strength between the ABS plastic and nickel plate by the cross-cutting method. The surface morphologies of the ABS plastic before and after the etching process were observed by means of a scanning electron microscope.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.8
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• pp.658-663
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• 1998

Ferrite plating enables were grown by ferrite by plating method in solution at low temperature(<10$0^{\circ}C$). This faciltates the fabrication of new ferrite thin film devices using non- heat-resistant materials(plastic, GaAs ect) as substrates. Combining the ferrite plating with sonochemistry, application of power ultrasonic waves to stimulate chemical reactions, the crystallinity and qualities of films were improved. Modifying the reactions cell and plating conditions further improved the film quality.

• Journal of the Korean institute of surface engineering
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• v.19 no.3
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• pp.121-127
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• 1986

There are many plating methods already commercially employed in te surface technology. One of the plating methods is electroless (chemical) plating, which is deposited by auto-catalytic reduction of metallic ion with the reducing agent in the plating bath. And it has many advantages comparing with electrolytic plating in respect of properties of deposit, such as corrosion resistance, wear resistance, uniformity, hardness, adhesion and so on. So, electroless plating is the fatest growing process in metallization of plastic and electronic industry. The properties and numerous applications of electroless deposits are attracting more and more attention from finish specifies. Many metal finishers are considering set-up of new electroless line in their shops. This review will be beneficial to domestic metal finishers to understand the real status of present electroless plating technology. It will also provide some knowledge on the economic aspect of electroless plating for the commercial application of specific parts.

• Journal of the Society of Naval Architects of Korea
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• v.36 no.2
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• pp.77-93
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• 1999

The twin aims of the paper are to investigate the collapse strength characteristics of ship plating subject to impact pressure loads and to develop a simple structural design formula considering impact load effects. The general purpose nonlinear finite element program STARDYNE together with existing experimental results is used to investigate the collapse behavior of plating under impact pressure loads. The rigid plastic theory taking into account large deflection effects is applied to the development of the design formulation. In the theoretical method, the collapse strength formulation for plating subject to hydrostatic pressure is first derived using the rigid plastic theory. By including the strain rate erects in the formulation it can be applied to impact pressure problems. As illustrative examples, the collapse behavior of steel unstiffened plates and aluminum alloy stiffened panels subject to impact pressure loads is analyzed.

• Bulletin of the Society of Naval Architects of Korea
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• v.17 no.1
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• pp.1-10
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• 1980

The nonlinear analysis of ship plating with flat bar stiffners has been carried out by the finite element method based on the load incremental approach. The large deflection analysis has been done by using the Lagrangian description. The elastoplastic analysis has been performed by adopting the flow theory of plasticity and the von Mises yield condition. The layered elements are used to show the process of yielding through the plate thickness in the elasto-plastic analysis. The following results are obtained; 1) According to the large deflection analysis, it is shown that the small deflection theory to the plate is applicable in the range of the lateral deflection-the thickness ratio $w/h{\leqq}0.3$ and ship plating in the range of $w/h{\leqq}0.5$. 2) By means of the elasto-plastic analysis, it is found that the maximum load-carrying capacity of the plate increases as much as 1.8 times of the initial yield load in the case of the simply supported condition and 2.2 times in the clamped condition. It is also shown that the maximum load-carrying capacity of ship plating increase as much as 4.3 times in the simply supported condition and 4.2 times in the clamped condition. This method would be applied and extended to solve combined nonlinear problems which involve both material nonlinearity and geometric nonlinearity.

• Maxillofacial Plastic and Reconstructive Surgery
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• v.32 no.2
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• pp.126-131
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• 2010

Objectives: This study is aimed to determine any differences in the postoperative stability between absorbable and titanium plate systems for fixation in orthognathic surgery with simultaneous maxillomandibular procedures especially including maxillary posterior impaction and advancement. Study Design: Forty patients with dentofacial deformities were randomly assigned into titanium (4 males and 6 females) and absorbable (17 males and 13 females) fixation group. All patients had undergone surgical alterations of maxilla with posterior impaction and advancement. A comparison study of the change in the maxillary position after the simultaneous surgery was performed with 1-day, 6-months postoperative lateral cephalograms compared to preoperative lateral cephalogram by tracing. Wilcoxon rank sum test was used for statistical analysis. Result: The position of the maxilla was stable after surgery and was not changed significantly from 1 day to 6 month after the simultaneous maxillomandibular surgery both in the experimental (absorbable plates) and control (titanium plates). Conclusion: This study suggests that application of absorable plating system in the fixation of maxillary segment in the simultaneous maxillomandibular procedures, leads to a predictable short-term postoperative skeletal stability comparable to the titanium plating system. Long term follow-up and further studies will be needed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.708-711
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• 1999

The Cu/Ni/Au lamellar structure is extensively used as an under bump metallization on silicon file, and on printed circuit board(PCB) pads. Ni is plated Cu by either electroless Ni plating, or electrolytic Ni plating. Unlike the electrolytic Ni plating, the electroless Ni plating does not deposit pure Ni, but a mixture of Ni and phosphorous, because hypophosphite Is used in the chemical reaction for reducing Ni ions. The fracture crack extended at the interface between solder balls of plastic ball grid (PBGA) package and conducting pads of PCB. The fracture is duets to segregation at the interface between Ni$_3$Sn$_4$intermetallic and Ni-P layer. The XPS diffraction results of Cu/Ni/Au results of CU/Ni/AU finishs showed that the Ni was amorphous with supersaturated P. The XPS and EDXA results of the fracture surface indicated that both of the fracture occurred on the transition lesion where Sn, P and Ni concentrations changed.

• Journal of the Korean Society of Marine Environment & Safety
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• v.23 no.3
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• pp.313-319
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• 2017

Cylindrical shells are often used in ship structures at deck plating with a camber, side shell plating at fore and aft parts, and bilge structure part. It has been believed that such curved shells can be modelled fundamentally by a part of a cylinder under axial compression. From the estimations with the usage of cylinder models, it is known that, in general, curvature increases the buckling strength of a curved shell subjected to axial compression, and that curvature is also expected to increase the ultimate strength. We conduct series of elasto-plastic large deflection analyses in order to clarify the fundamentals in buckling and plastic collapse behaviour of cylindrical shells under axial compression. From the numerical results, we derive design formula for predicting the ultimate strength of cylindrical shell, based on a series of the nonlinear finite element calculations for all edges, simply supporting plating, varying the slenderness ratio, curvature and aspect ratio, as well as the following design formulae for predicting the ultimate strength of cylindrical shell. From a number of analysis results, fitting curve can be developed to use parameter of slenderness ratio with implementation of the method of least squares. The accuracy of design formulae for evaluating ultimate strength has been confirmed by comparing the calculated results with the FE-analysis results and it has a good agreement to predict their ultimate strength.

• Journal of Electrochemical Science and Technology
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• v.14 no.1
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• pp.85-95
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• 2023

In recent years, solid-state Li metal batteries (SSLBs) have attracted significant attention as the next-generation batteries with high energy and power densities. However, uncontrolled dendrite growth and the resulting pulverization of Li during repeated plating/stripping processes must be addressed for practical applications. Herein, we report a plastic-crystal-based polymer/ceramic composite solid electrolyte (PCCE) to resolve these issues. To fabricate the one-side ceramic-incorporated PCCE (CI-PCCE) film, a mixed precursor solution comprising plastic-crystal-based polymer (succinonitrile, SN) with garnet-structured ceramic (Li₇La₃Zr₂O₁₂, LLZO) particles was infused into a thin cellulose membrane, which was used as a mechanical framework, and subsequently solidified by using UV-irradiation. The CI-PCCE exhibited good flexibility and a high room-temperature ionic conductivity of over 10^-3 S cm^-1. The Li symmetric cell assembled with CI-PCCE provided enhanced durability against Li dendrite penetration through the solid electrolyte (SE) layer than those with LLZO-free PCCEs and exhibited long-term cycling stability (over 200 h) for Li plating/stripping. The enhanced Li⁺ transference number and lower interfacial resistance of CI-PCCE indicate that the ceramic-polymer composite layer in contact with the Li anode enabled the uniform distribution of Li⁺ flux at the interface between the Li metal and CI-PCCE, thereby promoting uniform Li plating/stripping. Consequently, the Li//LiFePO₄ (LFP) full cell constructed with CI-PCCE demonstrated superior rate capability (~120 mAh g^-1 at 2 C) and stable cycle performance (80% after 100 cycles) than those with ceramic-free PCCE.