• Journal of Adhesion and Interface
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• v.21 no.1
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• pp.1-5
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• 2020

Heated tool joining is a popular method for joining parts made from plastics and composite materials. The method is commonly known as butt fusion in the plastic pipe industry and this paper provides a short introduction to the basics of producing a good butt fusion joint. The function of each of the essential parts of the butt fusion equipment is described followed by a presentation of the important parameters of the bonding process in reference to a well-established interfacial pressure versus time curve. The butt fusion procedure is then outlined with good practices that detail the preparation of equipment and pipes to be joined as well as the fusion joining process.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.05a
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• pp.29-32
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• 2002

The mechanical joining process of a sheet metal pair has been developed in order to replace the resistance spot welding process in case that joining of mechanically unweldable materials and coated sheet metals with different thickness are needed. Form-joining or clinching, a kind of mechanical joining process, is defined as joining process of a sheet metal pair by geometric constraint imposed by plastic deformation of workpieces without any additive part. It has been reported that the joining strength by commercial form-joining apparatus is 50∼70 percent of that by resistance spot welding. Therefore, a two-step form-joining process with a secondary punch is proposed. The device is designed to improve the joining strength by increasing the geometric constraint of the deformed shape by combining a primary punch, a secondary punch and a female die. In order to verify the improved joining strength by the designed process, the tensile-shear strength, the peel-tension strength and the asymmetric peel-tension strength are compared with those by the TOX process and resistance spot welding.

• Journal of Welding and Joining
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• v.21 no.1
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• pp.54-59
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• 2003

In the present work, a formula for plate deformation produced by line heating, in terms of process parameters such as heat input and plate dimensions, is developed analytically using an eigenstrain concept. The residual deformation that was due to thermal process was depends on the magnitude and region of plastic strains at heating zone. The magnitude of plastic strains was determined by disk model and its region was calculated using the Rosenthal"s solution. The vertical displacement of the plate was analyzed by using an infinite laminated plate theory to consider a cuboidal inclusion with an eigenstrain. Comparison of the calculated results and experimental data shows the accuracy and validity of proposed method.thod.

• Journal of Welding and Joining
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• v.10 no.1
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• pp.35-42
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• 1992

In this study, the stress concentration phenomenon for the dissimilar joints(ceramic-metal) bonded by thermal treating using a soft-insert metal(copper) was investigated with the aid of FEM(finite element method) under the load condition of uniform tension. The analysis was carried out by the supposing that stress states are plane stress or plane strain and elastic or elastic-plastic. And the Von Mises yield criterion and the incremental theory as plastic flow were adopted in this analysis. As the summarized results obtained, the stress concentration phenomenon was severer as the soft insert metal was thicker, in plane strain than in plane stress and in elastic-plastic state than in elastic state. Furthermore, the inducing mechanism of stress concentration was well expressed by the constraint forces(Fc) generated between the soft and the hard material.

• Journal of Welding and Joining
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• v.18 no.4
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• pp.64-69
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• 2000

Reliability of PBGA(Plastic Ball Grid Array) package is very weak compared with normal plastic packages. The reliability are the lower resistance to popcorn cracking, which is reduced by moisture absorption in PCB(Printed Circuit Board). This paper adapts plasma treatment process and analyzes their effect. The contents of C and Cl decrease after plasma treatment but O, Ca and N relatively increase. The Plasma treatment to improve the adhesion between EMC(Epoxy Molding Compound) and PCB(solder mask). The degree of improvement was over 100% Max., which is depend on the properties of EMC. Ar+H$_2$as plasma gas show good result. There is a little difference in RF power and treatment time.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• v.18 no.2
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• Journal of Welding and Joining
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• v.17 no.2
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• pp.91-96
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• 1999

The problems of welding distortion in a welded structures are major concern in heavy industry. Weld-induced angular distortion's formula, composed weld parameter such as heat input and plate thickness, is developed analytically by the use of an elliptic cylindrical inclusion with an eigenstrain in an infinite laminated plate theory. The source of angular distortion in weldments is the plastic strains, which are caused by non-uniform temperature gradient. The distributions of the plastic strain corresponding eigenstrain are assumed by the use of Rosenthal's solution expressing thermal history. Comparison of calculated results with experimental data shows the accuracy and validity of the proposed method.

• Journal of Welding and Joining
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• v.21 no.3
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• pp.68-77
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• 2003

It is important to understand the characteristics of material strength and fracture under the dynamic loading like as earthquakes to assure the integrity of welded structures. The characteristics of dynamic strength and fracture in structural steels and their welded joints should be evaluated based on the effects of the strain rate and the service temperature. It is difficult to predict or measure temperature rise history with the corresponding stress-strain behavior. In particular, material behaviors beyond the uniform elongation can not be precisely evaluated, though the behavior at large strain region after the maximum loading point is much important for the evaluation of fracture. In this paper, the coupling phenomena of temperature and stress-strain fields under the dynamic loading was simulated by using the finite element method. The modified rate-temperature parameter was defined by accounting for the effect of temperature rise under the dynamic deformation, and it was applied to the fully-coupled analysis between heat conduction and thermal elastic-plastic behavior. Temperature rise and stress-strain behavior including complicated phenomena were studies after the maximum loading point in structural steels and their undermatched joints and compared with the measured values.

• Journal of Welding and Joining
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• v.12 no.1
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• pp.73-79
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• 1994

Low cycle fatigue test was performed by companion specimens method to compare the properties of cyclic strain for the weldments of controlled rolling steel CR60 and welding structural steel SM58Q. And the result does not showed any difference of low cycle fatigue life between weldments. Especially, the values of coefficient of cyclic plastic strain $C_{p}$ and exponent of cyclic plastic strain $K_{p}$ of heat affected zones of CR60 steel and SM58Q steel were same. And $C_{p}$ and $K_{p}$ of CR60 steel were equal to the values of weld it means a good combination between the base metal, the heat affected zone and the weld of CR60 steel.eel.eel.