• 한국해양공학회지
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• 제10권4호
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• pp.51-57
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• 1996

A standard method for the evalution of the fracture toughness of the high polymer materials has not been fully developed in comparison with that for metallic materials, and has not yet established. In this paper, fracture toughness tests using polycarbonate specimens were carried out. The fracture thughness tests using polycabonate specimens were carried out. The fracture toughness of commercial polycarbonate were dependent on the specimen thickness. The specimen thickness is necessary above 8mm to obtain the valid $K_{IC}$. A cumulative counts were slightly dependent on specimen thickness.

• Transactions on Electrical and Electronic Materials
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• 제11권4호
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• pp.178-181
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• 2010

An automotive IC voltage regulator which consists of one-chip based on a metal-oxide semiconductor field effect transistor (MOSFET) is investigated experimentally with three types of packaging. The closed type is filled with thermal silicone gel and covered with a plastic lid on the MOSFET. The half-closed type is covered with a plastic case but without thermal silicone gel on the MOSFET. Opened type is no lid without thermal silicone gel. In order to simulate the high temperature condition in engine bay, the operating circuit of the MOSFET is constructed and the surrounding temperature is maintained at $100^{\circ}C$. In the overshoot the maximum was mainly found at the half-closed packaging and the magnitude is dependent on the packaging type and the surrounding temperature. Also the impressed current decreased exponentially during the MOSFET operation.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1995년도 추계 학술발표 강연 및 논문개요집
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• pp.3-3
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• 1995

Plastic IC encapsulation utilizing lead on chip(LOC) die attach technique allows higher device density per unit package area, and faster current speed and easter leadframe design. Nevertheless, since the top surface of the chip is directly attached to the area of the leadframe with a double-sided adhesive tape in the LOC package, it tends to be easily damaged by the leadframe, leading to limitation in its utilization. In this work, it is detailed how the damage of the chip surface occurs, and it is influenced and improved by the LOC construct.

• 한국안전학회지
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• 제10권2호
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• pp.3-9
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• 1995

Several piping material test methods have been developed as a result of advances in elastic-plastic fracture mechanics. It's known that, crack propagation of the materials strongly governed by the $J_{Ic}$ value. But the value is still difficult to be obtained because of it's complicate and troble-some determination process. In this paper, to prove the validity of the developed test procedure a series of tests were peformed at various temperatures and for different material directions. directions.

• E2M - 전기 전자와 첨단 소재
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• 제10권6호
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• 대한토목학회논문집
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• 제7권1호
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• pp.75-82
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• 1987

본(本) 연구(硏究)는 소규모강복범위(小規模降伏範圍)를 벗어나는 대규모강복조건하(大規模降伏條件下)에서 구조안정성(構造安定性)에 관(關)한 중요(重要)한 문제(問題)인 불안정연성파괴(不安定延性破壞)를 평가(評價)할 수 있는 파괴역학인자(破壞力學因子)로서의 J 적분(積分)을 수치해(數値解)로서 구하는데 그 목적(目的)을 두었다. 이를 위해 균열재(龜裂材)의 균열선단요소(龜裂先端要素)로 8절점등방특이요소(節點等方特異要素)를 사용(使用)하고, 균열발생(發生)은 파괴인성(破壞靭性) $J_{IC}$를 초과할 때 일어나도록 하였으며, 그리고 균열성장(成長)의 취급(取級)은 균열개구각(龜裂開口角)을 이용(利用)했다. 본(本) 연구(硏究)에 의해 해석(解析)된 J 적분치(積分値)를 사용(使用)하여 균열재의 균열발생 과 안정성장(安定成長), 불안정(不安定) 발생점(發生點)을 찾은 결과(結果) 다른 연구결과(硏究結果)와 잘 일치(一致)하고 있어 탄소성(彈塑性)을 고려(考慮)한 J 적분치(積分値)가 균열의 안정성장(安定成長) 및 불안정연성파괴(不安定延性破壞) 문제(問題)를 다루는 파괴역학인자(破壞力學因子)로서 직접(直接) 이용(利用)될 수 있음을 보였다.

• 한국토양비료학회지
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• 제48권2호
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• pp.105-118
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• 2015

This study was carried out to investigate the effects of profile disturbance with different artificial accumulation history on physico-chemical properties of soil under plastic film house. The investigations included soil profile description using soil column cylinder auger F10cm x h110cm, in situ and laboratory measurements of soil properties at five sites each at the cucumber (Site Ic ~ Vc) and grape (Site Ig ~ Vg) plastic film houses with artificial soil accumulation. The sites except sites Ic, IVc, IVg and Vg, belong to ex-paddy area. The types of accumulates around root zone included sandy loam soil for 3 sites, loam soil for 1 site, saprolite for 2 sites, and multi-layer with different accumulates for 3 sites. Especially, Site IIg has mixed plow zone (Ap horizon) with original soil and saprolite, whereas disturbed soil layers of the other sites are composed of only external accumulates. The soil depth disturbed by artificial accumulation ranged from 20 cm, for Site IIg, to whole measured depth of 110 cm, for Site IVc, Vc, and Site IVg. Elapsed time from artificially accumulation to investigation time ranged from 3 months, Site IIc, to more than 20 years, Site Vg, paddy-soil covering over well-drained upland soil during land leveling in 1980s. Disturbed top layer in all sites except Site Vg had no structure, indicating low structural stability. In situ infiltration rate had no correlation with texture or organic matter content, but highest value with highest variability in Site IIIc, the shortest elapsed time since sandy loam soil accumulation. Relatively low infiltration rate was observed in sites accumulated by saprolite with coarse texture, presumably because its low structural stability in the way of weathering process could result in relatively high compaction in agro-machine work or irrigation. In all cucumber sites, there were water-transport limited zone with very low permeable or impermeability within 50 cm under soil surface, but Site IIg, IIIg, and Vg, with relatively weak disturbance or structured soil, were the reverse. We observed the big change in texture and re-increase of organic matter content, available phosphate, and exchangeable cations between disturbed layer and original soil layer. This study, therefore, suggest that the accumulation of coarse material such as saprolite for cultivating cash crop under plastic film house might not improve soil drainage and structural stability, inversely showing weaker disturbance of original soil profile with higher drainage.

• 한국의학물리학회지:의학물리
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• 제8권2호
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• pp.45-57
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• 1997

속중성자선을 임상에 이용하기 위해서는 속중성자선의 선량 및 선량분포를 정확히 측정하는 것이 매우 중요하다. 현재 속중성자선의 측정법은 크게 나누어 American Associations of Physicists in Medicine, European Clinical Neutron Dosimetry Group 및 International Commission on Radiation Units and Measurements에 의하여 제시되고 있으나 측정의 복잡함으로 인하여 서로 약간씩 다른 방법을 제시하고 있다. 따라서 본 연구에서는 중성자 치료장치에서 방출되는 속중성자선의 방출선량 및 물질 내 선량분포 등의 측정을 통하여 독자적인 측정기술을 확보하고, 우리 실정에 알맞은 표준측정법을 개발하고자 하였다. 속중성자선의 선량 및 물질 내 선량 분포 측정에는 조직등가물질인 A-150 플라스틱으로 제작된 IC-17 및 IC-18 이온함, 마그네슘으로 제작된 IC-17M 이온함, TE 기체, Ar 기체 및 RDM 2A electrometer 등을 사용하였다. 연구 결과 중성자선에 혼합되어 있는 ${\gamma}$선의 오염도는 기준조사면 깊이 5cm에서 약 13% 로 나타났으며, 깊이가 깊어질수록 증가하였다. 기준 조사면에 대하여 중심축선상의 최대 선량 깊이는 1.32cm 이었으며, 50% 선량 깊이는 14.8cm로 나타났다. 표면선량율은 전 조사면에 걸쳐서 41.6%～54.1%이었으며 조사면가 커질수록 증가하였다. Beam profile 은 2.5cm 깊이에서 7.5% 정도 horne effect가 나타났으며 10cm 깊이에서 가장 평탄하였다.

• 한국정보처리학회논문지
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• 제7권7호
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• pp.2179-2187
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• 2000

This paper provides a heuristic analysis technique which determines an optimal number of V\ulcorner/V\ulcorner pads meeting allowable Simultaneous Switching Noise(SN) budget, early in the design phase. Until now, in determining the number of V\ulcorner/V\ulcorner pads, designers had to simulate packaging models case by case in the design phase or roughly allocate the power/ground pins in an inaccurate way according to typical design rules. However, due to the high density and frequency trends of IC technologies, the V\ulcorner/V\ulcorner pads allocation method can affect an adverse effect on IC operations, which requires more accurate and efficient methods be devised. Thus, this paper proposes an analytic V\ulcorner/V\ulcorner pads calculation method that gives a practical help for packaging designs early in the design phase. The proposed method is applied to a design example of a 1/8x208 pin plastic quad flat package (PQFP) and the results are verified through simulation using HSPICE.

• 대한기계학회논문집
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• 제9권2호
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• pp.135-139
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• 1985

본 논문에서는 이러한 점을 감안하여 SCM4(KS규격)재에 대해서 Unloading Co- mpliance법 및 초음파법에 의한 크랙개시점검출을 시도한 결과로부터 파괴인성시험에 있어서 초음파법의 유요성을 밝히고저 한다.