• Title/Summary/Keyword: Plasma processing

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Plasma electrolytic processing for polishing of stainless steel surfaces

  • Van, Thanh Dang;Kim, Sung-W.;Kim, Jong-R.;Kim, Sang-G.
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2008.11a
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    • pp.137-137
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    • 2008
  • This paper presents the ability of plasma electrolytic polishing technology to polish surface of stainless steel materials. The results show that the surface of its can be polished clearly using potentiostatic regimes in various concentration of $(NH_4)_2SO_4$ solution that had been warmed to a certain initial temperature. The equipment and deposition produces for polishing process are described and the effect of processing parameters on the characterizations polishedsamples has been has been investigated.

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Diagnosis of $BCl_3$ and $BCl_3$/Ar Plasmas with an Optical Emission Spectroscopy during High Density Planar Inductively Coupled Dry Etching (평판형 고밀도 유도결합 건식 식각시 Optical Emission Spectroscopy를 이용한 $BCl_3$$BCl_3$/Ar 플라즈마의 분석)

  • Cho, Guan-Sik;Wantae Lim;Inkyoo Baek;Seungryul Yoo;Park, Hojin;Lee, Jewon;Kuksan Cho;S. J. Pearton
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.03a
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    • pp.88-88
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    • 2003
  • Optical Emission Spectroscopy(OES) is a very important technology for real-time monitoring of plasma in a reactor during dry etching process. OES technology is non-invasive to the plasma process. It can be used to collect information on excitation and recombination between electrons and ions in the plasma. It also helps easily diagnose plasma intensity and monitor end-point during plasma etch processing. We studied high density planar inductively coupled BCl$_3$ and BCl$_3$/Ar plasma with an OES as a function of processing pressure, RIE chuck power, ICP source power and gas composition. The scan range of wavelength used was from 400 nm to 1000 nm. It was found that OES peak Intensity was a strong function of ICP source power and processing pressure, while it was almost independent on RIE chuck power in BCl$_3$-based planar ICP processes. It was also worthwhile to note that increase of processing pressure reduced negatively self-induced dc bias. The case was reverse for RIE chuck power. ICP power and gas composition hardly had influence on do bias. We will report OES results of high density planar inductively coupled BCl$_3$ and BCl$_3$/Ar Plasma in detail in this presentation.

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Effect of Processing Parameters and Powder Size on Microstructures and Mechanical Properties of Y2O3 Coatings Fabricated by Suspension Plasma Spray

  • Kim, Sun-Joo;Lee, Jung-Ki;Oh, Yoon-Suk;Kim, Seongwon;Lee, Sung-Min
    • Journal of the Korean Ceramic Society
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    • v.52 no.6
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    • pp.395-402
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    • 2015
  • The suspension plasma spray (SPS) technique has been used to obtain dense $Y_2O_3$ coatings and to overcome the drawbacks of the conventional air plasma spray (APS). SPS uses suspensions containing micrometer or sub-micrometer sized powders dispersed in liquid media. In this study, microstructure developments and mechanical properties have been investigated as functions of particle size of source material and plasma processing parameters such as plasma power and stand-off distance. The microstructure of the coating was found to be highly related to the particle size and the plasma processing parameters, and it was directly reflected in the hardness and the adhesion strength. When fine powder (BET $16.4m^2/g$) was used as a raw material in the suspension, there was, with increasing stand-off distance, a change from a dense structure with a slightly bumpy surface to a porous structure with a cauliflower-like surface. On the other hand, when a coarse powder (BET $2.8m^2/g$) was used, the coating density was lower, with microscopic splats on the surface. Using fine $Y_2O_3$ powders, the coating layer with an optimum short stand-off distance showed a high hardness of approximately 90% of that of sintered $Y_2O_3$ and an adhesion strength several times higher than that of the coating by conventional APS.

Plasma Surface Treatment of the Polymeric Film with Low Temperature Process (저온프로세스를 이용한 고분자필름의 플라즈마 표면처리)

  • Cho, Wook;Yang, Sung-Chae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.5
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    • pp.486-491
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    • 2008
  • The plasma processing is applied to many industrial fields as thin film deposition or surface treatment technique. In this study, we investigated large-area uniformed surface treatment of PET film at low temperature by using Scanning Plasma Method(SPM). Then, we measured difference and distribution of temperature on film's surface by setting up a thermometer. We studied the condition of plasma for surface treatment by examining intensity of irradiation of uniformed plasma. And we compared contact angles of treated PET film by using Ar and $O_2$ plasma based low temperature. In our result, surface temperature of 3-point of treating is low temperature about $22^{\circ}C$, in other hands, there is scarcely any variation of temperature on film's surface. And by using Ar plasma treatment, contact angle is lower than untreatment or $O_2$ plasma treatment. In case of PET film having thermal weak point, low temperature processing using SPM is undamaged method in film's surface and uniformly treated film's surface. As a result, Ar plasma surface treatment using SPM is suitable surface treatment method of PET film.

Plasma etching behavior of RE-Si-Al-O glass (RE: Y, La, Gd)

  • Lee, Jeong-Gi;Hwang, Seong-Jin;Lee, Seong-Min;Kim, Hyeong-Sun
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2010.05a
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    • pp.49.1-49.1
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    • 2010
  • The particle generation during the plasma enhanced process is highly considered as serious problem in the semiconductor manufacturing industry. The material for the plasma processing chamber requires the plasma etching characteristics which are homogeneously etched surface and low plasma etching depth for preventing particulate contamination and high durability. We found that the materials without grain boundaries can prevent the particle generation. Therefore, the amorphous material with the low plasma etching rate may be the best candidate for the plasma processing chamber instead of the polycrystalline materials such as yttria and alumina. Three glasses based on $SiO_2$ and $Al_2O_3$ were prepared with various rare-earth elements (Gd, Y and La) which are same content in the glass. The glasses were plasma etched in the same condition and their plasma etching rate was compared including reference materials such as Si-wafer, quartz, yttria and alumina. The mechanical and thermal properties of the glasses were highly related with cationic field strength (CFS) of the rare-earth elements. We assumed that the plasma etching resistance may highly contributed by the thermal properties of the fluorine byproducts generated during the plasma exposure and it is expected that the Gd containing glass may have the highest plasma etching resistance due to the highest sublimation temperature of $GdF_3$ among three rare-earth elements (Gd, Y and La). However, it is found that the plasma etching results is highly related with the mechanical property of the glasses which indicates the cationic field strength. From the result, we conclude that the glass structure should be analyzed and the plasma etching test should be conducted with different condition in the future to understand the plasma etching behavior of the glasses perfectly.

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N2 plasma treatment of pigments with minute particle sizes to improve their dispersion properties in deionized water

  • Zhang, Jingjing;Park, Yeong Min;Tan, Xing Yan;Bae, Mun Ki;Kim, Dong Jun;Jang, Tae Hwan;Kim, Min Su;Lee, Seung Whan;Kim, Tae Gyu
    • Journal of Ceramic Processing Research
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    • v.20 no.6
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    • pp.589-596
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    • 2019
  • Pigments with minute particle sizes, such as carbon black (CB) and pigment red 48:2 (P.R.48:2), are the most important types of pigment and have been widely used in many industrial applications. However, minute particles have large surface areas, high oil absorption and low surface energy. They therefore tend to be repellent to the vehicle and lose stability, resulting in significant increases in viscosity or reaggregation in the vehicle. Therefore, finding the best way to improve the dispersion properties of minute particle size pigments presents a major technical challenge. In this study, minute particle types of CB and P.R.48:2 were treated with nitrogen gas plasma generated via radio frequency-plasma enhanced chemical vapor deposition (RF-PECVD) to increase the dispersion properties of minute particles in deionized (DI) water. The morphologies and particle sizes of untreated and plasma treated particles were evaluated using scanning electron microscopy (SEM) and atomic force microscopy (AFM). The average distributions of particle size were measured using a laser particle sizer. Fourier transform infrared spectroscopy was carried out on the samples to identify changes in molecular interactions during plasma processing. The results of our analysis indicate that N2 plasma treatment is an effective method for improving the dispersibility of minute particles of pigment in DI water.

Universal Plasma-chemical Module for Carbon-containing Raw Materials Treatment

  • Park, Hyun-Seo;Zasypkin, I.M.
    • Resources Recycling
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    • v.13 no.1
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    • pp.59-67
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    • 2004
  • A universal plasma-chemical module (PChM) for the industrial processing of different hydrocarbon raw material pyrolysis was designed and tested. Laboratory investigations for the plasma-chemical method of acetylene production from natural gas and different coals were made. Similar laboratory tests on the industrial production of acetylene as a raw material for organic syn-thesis were developed using the PChM. A comparison of the suggested plasma-chemical method with the traditional process of acetylene production were carried out. The outlook of the plasma-chemical method was shown.

Electron collision cross sections of molecules relevant to plasma processing

  • Jo, Hyeok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.34-34
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    • 2010
  • Absolute electron-impact cross sections for molecular targets including their radicals are important in developing plasma reactors and testing various plasma processing gases. However, low-energy electron collision data for these gases are sparse and only the limited cross section data are available. In this presentation, the methods and the status of measurements of, mainly, absolute elastic cross sections for electron-polyatomic molecule collisions will be discussed with recent results from Chungnam National University. Elastic cross sections are essential for the absolute scale conversion of inelastic cross sections, as well as for testing computational methods.

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