• ETRI Journal
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• v.34 no.2
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• pp.226-234
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• 2012

The novelty of this study resides in the fabrication of stoichiometric and stress-reduced $Si_3N_4/SiO_2/Si_3N_4$ triple-layer membrane sieves. The membrane sieves were designed to be very flat and thin, mechanically stress-reduced, and stable in their electrical and chemical properties. All insulating materials are deposited stoichiometrically by a low-pressure chemical vapor deposition system. The membranes with a thickness of 0.4 ${\mu}m$ have pores with a diameter of about 1 ${\mu}m$. The device is fabricated on a 6" silicon wafer with the semiconductor processes. We utilized the membrane sieves for plasma separations from human whole blood. To enhance the separation ability of blood plasma, an agarose gel matrix was attached to the membrane sieves. We could separate about 1 ${\mu}L$ of blood plasma from 5 ${\mu}L$ of human whole blood. Our device can be used in the cell-based biosensors or analysis systems in analytical chemistry.

• Journal of the Korean Ceramic Society
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• v.53 no.6
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• pp.700-706
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• 2016

Etch rate, surface roughness and microstructure as plasma resistance were evaluated for six kinds of oxide glass with different compositions. Borosilicate glass (BS) was found to be etched at the highest etch rate and zinc aluminum phosphate glass (ZAP) showed a relatively lower etch rate than borosilicate. On the other hand, the etching rate of calcium aluminosilicate glass (CAS) was measured to be similar to that of sintered alumina while yttrium aluminosilicate glass (YAS) showed the lowest etch rate. Such different etch rates by mixture plasma as a function of glass compositions was dependent on whether or not fluoride compounds were formed on glass and sublimated in high vacuum. Especially, in view that $CaF_2$ and $YF_3$ with high sublimation points were formed on the surface of CAS and YAS glasses, both CAS and YAS glasses were considered to be a good candidate for protective coating materials on the damaged polycrystalline ceramics parts in semi-conductor and display processes.

• Journal of Environmental Science International
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• v.23 no.9
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• pp.1627-1634
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• 2014

Odor control technology include absorption, adsorption, incineration and biological treatments. But, most of processes have some problems such as secondary organic acids discharge at the final odor treatment facility. In order to solve the problems for effective treatment of organic acids in odor, it is necessary to develop a new type advanced odor control technology. Some of the technology are plasma only process and plasma hybrid process as key process of the advanced technology. In this study, odor removal performance was compared DBD(Dielectric Barrier Discharge)plasma process with PCHP(plasma catalysis hybrid process) by gaseous ammonia, formaldehyde and acetic acid. Plasma only process by acetic acid obtained higher treatment efficiency above 90%, and PCHP reached its efficiency up to 96%. Acetic acid is relatively easy pollutant to control its concentration other than sulfur and nitrogen odor compounds, because it has tendency to react with water quickly. To test of the performance of DBD plasma process by applied voltage, the tests were conducted to find the dependence of experimental conditions of the applied voltage at 13 kV and 15 kV separately. With an applied voltage at 15 kV, the treatment efficiency was achieved to more higher than 13 kV from 83% to 99% on ammonia, formaldehyde and acetic acid. It seems to the odor treatment efficiency depends on the applied voltage, temperature, humidity and chemical bonding of odors.

• Journal of Surface Science and Engineering
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• v.49 no.2
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• pp.152-158
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• 2016

We investigated the effect of capacitively coupled Ar plasma treatment on contact resistance ($R_c$) and channel sheet resistance ($R_{sh}$) of graphene field effect transistors (FETs), by varying their channel length in the wide range from 200 nm to $50{\mu}m$ which formed the transfer length method (TLM) patterns. When the Ar plasma treatment was performed on the long channel ($10{\sim}50{\mu}m$) graphene FETs for 20 s, $R_c$ decreased from 2.4 to $1.15k{\Omega}{\cdot}{\mu}m$. It is understood that this improvement in $R_c$ is attributed to the formation of $sp^3$ bonds and dangling bonds by the plasma. However, when the channel length of the FETs decreased down to 200 nm, the drain current ($I_d$) decreased upon the plasma treatment because of the significant increase of channel $R_{sh}$ which was attributed to the atomic structural disorder induced by the plasma across the transfer length at the edge of the channel region. This study suggests a practical guideline to reduce $R_c$ using various plasma treatments for the $R_c$ sensitive graphene and other 2D material devices, where $R_c$ is traded off with $R_{sh}$.

• Food Science of Animal Resources
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• v.43 no.6
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• pp.1087-1110
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• 2023

The growing demand for sustainable food production and the rising consumer preference for fresh, healthy, and safe food products have been driving the need for innovative methods for processing and preserving food. In the meat industry, this demand has led to the development of new interventions aimed at extending the shelf life of meats and its products while maintaining their quality and nutritional value. Cold plasma has recently emerged as a subject of great interest in the meat industry due to its potential to enhance the microbiological safety of meat and its products. This review discusses the latest research on the possible application of cold plasma in the meat processing industry, considering its effects on various quality attributes and its potential for meat preservation and enhancement. In this regard, many studies have reported substantial antimicrobial efficacy of cold plasma technology in beef, pork, lamb and chicken, and their products with negligible changes in their physicochemical attributes. Further, the application of cold plasma in meat processing has shown promising results as a potential novel curing agent for cured meat products. Understanding the mechanisms of action and the interactions between cold plasma and food ingredients is crucial for further exploring the potential of this technology in the meat industry, ultimately leading to the development of safe and high-quality meat products using cold plasma technology.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.526-526
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• 2013

Plasma technology isbeing developed for a range of medical applications including wound healing. However, the effect of plasma on many cells and tissues is unclear. Cell migration and cell proliferation are very important biological processes which are affected by plasma exposure and might be a potential target for plasma therapy during wound healing treatment. In this study, we confirmed the plasma exposure time and incubation time after plasma treatment in skin fibroblast (L-929 cells) to evaluate the optimal conditions forplasma exposure to the cell in-vitro. In addition, we used a scratch method to generate artificial wound for evaluating the cell migration by plasma treatment. Where, the cells were treated with plasma and migration rate was observed by live-cell imaging device. To find the cell proliferation, cell viability assay was executed. The results of this study indicate the increased cell proliferation and migration on mild plasma treatment. The mechanisms for cell migration and cell proliferation after plasma treatment for future studies will be discussed.

• Journal of the Semiconductor & Display Technology
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• v.2 no.4
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• pp.13-17
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• 2003

An adaptor is designed for chamber impedance measurement of plasma process. Copper rod, fixed board and compensation circuit are the major components of the adaptor. An adaptor can be to measure chamber impedance on time unless stopping a process and Data to measure can do the database. We can use it to a criteria data for a failure diagnosis. So developed adaptor could be used for diagnosis the plasma process chamber in semiconductor industry.

• Applied Science and Convergence Technology
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• v.26 no.5
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• pp.114-117
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• 2017

Plasma characteristics of two-dimensional inductively coupled discharge simulation is investigated. Impedance of an inductively coupled plasma discharge was considered. Voltage drops across antenna coils and current variation between coils made different profiles of plasma characteristics. Importance of the capacitive field effect in some case was analyzed.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.77-77
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• 2012

As interest has increased in the interaction between low-temperature plasmas and materials, the role of modeling and simulation of processing in plasma has become important in understanding the effects of charged particles and radicals in plasma applications. Thus in this presentation, we present the theoretical and experimental studies of electron impact cross section for plasma processing gas, such as plasma etching and deposition processes. Also, here the work conducted at the Data Center for Plasma Properties (DCPP) over last 7 years on the systematic synthesis and assessment of fundamental knowledge on low-energy electron interactions with plasma processing gases is briefly summarized and discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.121.1-121.1
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• 2014

Recently, much attention has been given to plasma production under liquid and its applications [1]. However, most of plasma production techniques reported so far utilize high voltage dc, ac, rf or microwave power [2], where damage to discharge electrodes and small discharge volume are remained issues. As an alternative of plasma production method under liquid, we have proposed pulsed microwave excited plasma using slot antenna, where damage to the slot electrode can be minimized and plasma volume can be increased. We have also reported improvement of treatment efficiency with use of reduced-pressure condition during the discharge [3]. To realize low pressure conditions in liquid, various alternative technique can be considered. One possible technique is simultaneous injection of microwave power and ultrasonic wave. Ultrasonic wave induces pressure fluctuation with the wave propagation and is so far used for cavitation production in the water. We propose utilization of reduced pressure induced by ultrasonic cavitation for improvement of the plasma production. Correlation between the plasma production and the ultrasonic power will be discussed.