• 제목/요약/키워드: Plasma Sensor

검색결과 175건 처리시간 0.025초

Dual-hop Routing Protocol for Improvement of Energy Consumption in Layered WSN Sensor Field

  • Song, Young-Il;LEE, WooSuk;Kwon, Oh Seok;Jung, KyeDong;Lee, Jong-Yong
    • International Journal of Advanced Culture Technology
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    • 제4권2호
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    • pp.27-33
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    • 2016
  • This paper proposes to increase the node energy efficiency, which rapidly drops during the transmission of L-TEEN (Layered Threshold sensitive Energy Efficient sensor Network protocol), using the method of DL-TEEN (Dual-hop Layered TEEN). By introducing dual-hop method in the data transmission, the proposed single-hop method for short-range transmission and multi-hop transmission method between the cluster heads for remote transmission was introduce. By introducing a partial multi-hop method in the data transmission, a single-hop method for short range transmission method between the cluster heads for remote transmission was introduces. In the proposed DL-TEEN, the energy consumption of cluster head for remote transmission reduces and increases the energy efficiency of sensor node by reducing the transmission distance and simplifying the transmission routine for short-range transmission. As compared the general L-TEEN, it was adapted to a wider sensor field.

레이저 미세 가공 공정에서 광센서를 이용한 선폭 예측을 위한 통계적 모델의 개발 (Development of Statistical Model for Line Width Estimation in Laser Micro Material Processing Using Optical Sensor)

  • 박영환;이세헌
    • 한국정밀공학회지
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    • 제22권7호
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    • pp.27-37
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    • 2005
  • Direct writing technology on the silicon wafer surface is used to reduce the size of the chip as the miniature trend in electronic circuit. In order to improve the productivity and efficiency, the real time quality estimation is very important in each semiconductor process. In laser marking, marking quality is determined by readability which is dependant on the contrast of surface, the line width, and the melting depth. Many researchers have tried to find theoretical and numerical estimation models fur groove geometry. However, these models are limited to be applied to the real system. In this study, the estimation system for the line width during the laser marking was proposed by process monitoring method. The light intensity emitted by plasma which is produced when irradiating the laser to the silicon wafer was measured using the optical sensor. Because the laser marking is too fast to measure with external sensor, we build up the coaxial monitoring system. Analysis for the correlation between the acquired signals and the line width according to the change of laser power was carried out. Also, we developed the models enabling the estimation of line width of the laser marking through the statistical regression models and may see that their estimating performances were excellent.

Gas sensor based on hydrogenated multilayer graphene

  • 박성진;박민지;유경화
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.273.1-273.1
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    • 2016
  • Graphene exhibits a number of unique properties that make it an intriguing candidate for use in sensor. Here, we report graphene-based gas sensor. Graphene was grown using CVD. Then, the sensor was made using standard lithography techniques. The sensor conductance increased upon exposure to NH3, whereas it decreased upon NO2, suggesting that NH3 and NO2 might be discriminated using the graphene-based sensor. To improve the sensitivity, graphene was treated with hydrogen plasma. After hydrogen treatment, the electrical properties of graphene changed from ambipolar to p-type semiconductors. In addition, the sensor performance was improved probably due to an opening of bandgap.

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ICP-RIE를 이용한 저압용 실리콘 압력센서 제작 (Fabrication of a silicon pressure sensor for measuring low pressure using ICP-RIE)

  • 이영태
    • 센서학회지
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    • 제16권2호
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    • pp.126-131
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    • 2007
  • In this paper, we fabricated piezoresistive pressure sensor with dry etching technology which used ICP-RIE (inductively coupled plasma reactive ion etching) and etching delay technology which used SOI (silicon-on-insulator). Structure of the fabricated pressure sensor shows a square diaphragm connected to a frame which was vertically fabricated by dry etching process and a single-element four-terminal gauge arranged at diaphragm edge. Sensitivity of the fabricated sensor was about 3.5 mV/V kPa at 1 kPa full-scale. Measurable resolution of the sensor was not exceeding 20 Pa. The nonlinearity of the fabricated pressure sensor was less than 0.5 %F.S.O. at 1 kPa full-scale.

미소 유량 센서에 관한 실험적 연구 (Experimental Study on a Micro Flow Sensor)

  • 김태훈;김성진
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2004년도 춘계학술대회
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    • pp.1783-1788
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    • 2004
  • In the present paper, a micro flow sensor, which can be used at bio-delivery systems and micro heat pumps, is developed. For this, the micro flow sensor is integrated on a quartz wafer ($SiO_2$) and is manufactured by simple and convenient microfabrication processes. The micro flow sensor aims for measuring mass flow rates in the low range of about $0{\sim}20$ SCCM. The micro flow sensor is composed of temperature sensors, a heater, and a flow microchannel. The temperature sensors and the heater are manufactured by the sputtering processes in this study. In the microfabrication processes, stainless steel masks with different patterns are used to deposit alumel and chromel for temperature sensors and nichrome for the heater on the quartz wafer. The microchannel is made of Polydimethylsiloxane(PDMS) easily. A deposited quartz wafer is bonded to the PDMS microchannel by using the air plasma. Finally, we confirmed the good operation of the present micro flow sensor by measuring flow rate.

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Low Temperature Debinding Process Using Oxygen Plasma for Flexible Printed Electronics

  • Lee, Young-In
    • 한국분말재료학회지
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    • 제19권5호
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    • pp.343-347
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    • 2012
  • In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.

웨이블렛과 신경망을 이용한 플라즈마-유도 X-Ray Photoelectron Spectroscopy 고장 패턴의 인식 (Recognition of Plasma- Induced X-Ray Photoelectron Spectroscopy Fault Pattern Using Wavelet and Neural Network)

  • 김수연;김병환
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 심포지엄 논문집 정보 및 제어부문
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    • pp.135-137
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    • 2006
  • To improve device yield and throughput, faults in plasma processing equipment should be quickly and accurately diagnosed. Despite many useful information of ex-situ sensor measurements, their applications to recognize plasma faultshave not been investigated. In this study, a new technique to identify fault causes by recognizing X-ray photoelectron spectroscopy (XPS) using neural network and continuous wavelet transformation (CWT). The presented technique was evaluated with the plasma etch data. A totalof 17 experiments were conducted for model construction. Model performance was investigated from the perspectives of training error, testing error, and recognition accuracy with respect to various thresholds. CWT-based BPNN models demonstrated a higher prediction accuracy of about 26%. Their advantages over pure XPS-based models were conspicuous in all three measures at small networks.

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광 센서를 이용한 레이저 가공공정의 모니터링 (Monitoring of Laser Material Processing Using Photodiodes)

  • 박영환
    • 한국산학기술학회논문지
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    • 제10권3호
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    • pp.515-520
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    • 2009
  • 본 논문에서는 알루미늄 레이저 용접에서 발생하는 플라즈마의 빛을 계측하여 용접공정을 모니터링할 수 있는 시스템을 개발하였다. 분광분석을 통해 용접 시 플라즈마의 파장대를 계측하고 이를 근거로 하여 모니터링 시스템에 적합한 포토다이오드를 선정하였다. 이를 다양한 용접 조건에 대하여 적용하였고, 센서 신호의 특성은 플라즈마의 강도와 안정성에 밀접하게 연관되어 있음을 신호의 평균값과 FFT분석을 통하여 알 수 있었다. 이러한 신호 변동의 원인은 플라즈마와 키홀의 거동과 용접 비드의 형상과도 밀접한 관계가 있음을 분석하였다.

박막트랜지스터에 의해 구동되는 이미지센서 (The Image Sensor Operating by Thin Film Transistor)

  • 허창우
    • 한국정보통신학회논문지
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    • 제10권1호
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    • pp.111-116
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    • 2006
  • 본 연구에서는 비정질 실리콘 박막 트랜지스터를 스위칭소자로 포토센서를 구동 하는 방식의 이미지 센서를 구현하고자 한다. 먼저 PECVD(Plasma Enhanced Chemical Vapor Deposition) 진공 증착장비로 최적의 비정질실리콘 박막을 형성하고, 이 박막을 이용하여 스위칭소자인 박막트랜지스터와 광전변환소자인 광다이오드를 제조한다. 또한 이들을 결합하여 이미지 센서를 형성하고 그 특성 및 동작을 분석하고 최적의 동작특성을 이끌 수 있는 밀착이미지 센서를 제조한다. 제작한 이미지 센서를 측정한 결과 광전변환소자인 photodiode는 암전류의 경우 $\~10^{-l2}A$정도였으며, 광전류 $\~10^{-9}A$정도로서 Iphoto/Idark ${\ge}10^3$ 이상을 이루어 좋은 광전변환 특성을 갖고 있었다. 또한 a-Si:H TFT의 경우 Ioff ${\le}10^{-l2}A$, Ion ${\le}10^{-6}A$ 으로서 Ion/Ioff ${le}10^6$ 이상을 나타냈으며 Vth는 $2\~4$ volts였고, Id는 수 ${\mu}A$ 정도로 photodiode를 스위치하기에 충분한 전류-전압특성을 나타내고 있다. 이미지 센서 전체 동작 특성을 측정하기 위하여 photodiode의 ITO쪽에 -5volts의 역 bias를 가한 상태에서 TFT의 gate에 $70\;{\mu}sec$의 pulse를 가하여 photodiode에서 생성된 광전류 와 암전류를 측정하였다. 이렇게 하여 측정된 전압은 암상태에서 수십 mvolts이고, 광상태에서는 수백 mvolts로 나타나 우수한 이미지센서 특성을 갖고 있음을 확인하였다.

Improvement of CH selection of WSN Protocol

  • Lee, WooSuk;Jung, Kye-Dong;Lee, Jong-Yong
    • International journal of advanced smart convergence
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    • 제6권3호
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    • pp.53-58
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    • 2017
  • A WSN (Wireless Sensor Network) is a network that is composed of wireless sensor nodes. There is no restriction on the place where it can be installed because it is composed wirelessly. Instead, sensor nodes have limited energy. Therefore, to use the network for a long time, energy consumption should be minimized. Several protocols have been proposed to minimize energy consumption, and the typical protocol is the LEACH protocol. The LEACH protocol is a cluster-based protocol that minimizes energy consumption by dividing the sensor field into clusters. Depending on how you organize the clusters of sensor field, network lifetimes may increase or decrease. In this paper, we will improve the network lifetime by improving the cluster head selection method in LEACH Protocol.