• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.98-98
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• 2000

초고집적(ULSI) 반도체 소자의 multilevel metalization을 위한 중간 유저네로서 저 유전상수(k<)와 높은 열적안정성(>45$0^{\circ}C$)을 갖는 새로운 물질을 도입하는 것이 필요하다. 중합체 박막은 낮은 유전상수와 높은 열적 안정성으로 인하여 low-k 물질로 적당하다고 여겨진다. PECVD에 의한 plasma polymer 박막의 증착은 많이 보고되어 왔으마 고밀도 플라즈마 형성이 가능하고 기판으로 유입되는 ion의 energy 조절이 가능한 inductively coupled plasma(ICP) CVD에 의한 plasma polymer 박막에 대한 연구는 보고된 바 없다. 본 연구에서는 Mtehyl-cyclohexane precusor를 사용하여 substrate에 bias를 주면서 inductively coupled plasma(ICP)를 이용하여 플라즈마 폴리머 박막(plasma polymerized methyl-cyclohexane : 이하^g , pp MCH라 칭함)을 증착하였으며 ICP power와 substrate bias(SB) power가 증착된 박막의 특성에 어떠한 영향을 미치는지 알아보았다. 증착된 박막의 유전상 수 및 열적 안정성은 ICP power의 변화에 비해 SB power의 변화에 더 크게 영향을 받았다.^g , pp MCH 박막은 platinum(Pt) 기판과 silicon 기판위에서 같이 증착되었다. Methyl-cyclohexane precursor는 4$0^{\circ}C$로 유지된 bubbler에 담겨지고 carrier 가스 (H2:10%, He:90%)에 의해 reactor 내부로 유입된다.^g , pp MCH 박막은 증착압력 350 mTorr, 증착온도 6$0^{\circ}C$에서 \circled1SB power를 10W에 고정시키고 ICP power를 5W부터 70W까지, \circled2ICP power를 10W에 고정시키고 SB power를 5W부터 70W까지 변화하면서 증착하였다. 유전 상수 및 절연성은 Al/PPMCH//Pt 구조의 capacitor를 만들어서 측정하였으며, 열적 안정성은 Ar 분위기에서 30분간의 열처리 전후의 두께 변화를 측정함으로써 분석하였다. SB power 10W에서 ICP power가 5W에서 70w로 증가함에 따라 유전상수는 2.65에서 3.14로 증가하였다. 열적 안정성은 ICP power의 증가에 따라서는 크게 향상되지 않은 것으로 나타났다. ICP power 10W에서 SB power가 5W에서 70W로 증가함에 따라 유전상수는 2.63에서 3.46으로 증가하였다. 열적 안정성은 SB power의 증가에 따라 현저하게 향상되었으며 30W 이상에서 증착된 박막은 45$0^{\circ}C$까지 안정하였고, 70W에서 증착된 박막은 50$0^{\circ}C$까지 안정하였다. 열적 안정성은 ICP power의 증가에 따라서는 현저하게 향상되었다. 그 원인은 SB power의 인가에 의해 활성화된 precursor 분자들이 큰 에너지를 가지고 기판에 유입되어 치밀한 박막이 형성되었기 때문으로 사료된다.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.775-777
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• 2003

Several methods are available for the fabrication of electrode pattern for the plasma display panel(PDP) including screen printing and photolithographic method. Piezo type ink-jet printing method is considered to the method of choice for electrode patterning in manufacturing of PDP. Both silver ink and absorbent layer paste formulation were developed for ink-jet printing of electrode pattern. The ink-jet printing of silver electrode with preformed absorbent layer was especially suitable for the patterning of address electrode for high resolution PDP.

• Proceedings of the Materials Research Society of Korea Conference
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• 2007.05a
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• pp.32.2-32.2
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• 2007

• Polymer(Korea)
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• v.24 no.5
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• pp.673-681
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• 2000

Electrically conductive composites have been prepared by treating fabrics with oxidizing agent and exposing them to aniline, which deposited a substantial amount of conductive polymer within the interstices of the material. However the conductivity of the composite fabrics was limited by the irregular deposition of the conductive polymer layer. To improve the conductivity of polyaniline/nylon 6 composite fabrics, we modified the surface characteristics of nylon 6 fabrics by various plasma treatments and increased diffusion and adsorption of aniline by ultrasonic treatments. By the oxygen plasma treatment, attachment of functional groups such as C-O and C-OH increased on the surface of nylon 6 fiber, which promoted adhesion to polyaniline resulting in the higher add-on and electrical conductivity. Electrical conductivities of polyaniline/nylon 6 composite fabrics were highly increased by ultrasonic treatment, which assisted the diffusion of aniline into the inside of nylon fabrics by cavitation and vibration. Also, the effects of monomer concentration and the number of deposition cycles on the nylon 6 fabric conductivity Were investigated. As a result, the fabric conductivity increased with the monomer concentration and the number of polymerization deposition cycles.

• Korean Chemical Engineering Research
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• v.44 no.5
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• pp.520-527
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• 2006

A realistic surface model is presented for prediction of various surface phenomena such as polymer deposition, suppression and sputtering as a function of incidence ion energy in high density fluorocarbon plasmas. This model followed ion enhanced etching model using the "well-mixed" or continuous stirred tank reactor (CSTR) assumption to the surface reaction zone. In this work, we suggested ion enhanced polymer formation and decomposition mechanisms that can capture $SiO_2$ etching through a steady-state polymer film on $SiO_2$ under the suppression regime. These mechanisms were derived based on experimental data and molecular dynamic simulation results from literatures. The model coefficients are obtained from fits to available beam and plasma experimental data. In order to show validity of our model, we compared the model results to high density fluorocarbon plasma etching data.

• Journal of Adhesion and Interface
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• v.2 no.2
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• pp.1-10
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• 2001

Silica for Epoxy Molding Compound (EMC) was coated via plasma-polymerization with RF plasma (13.56 MHz) as a function of treatment time, power and pressure. 1,3-diaminopropane, allylamine, pyrrole, 1,2-epoxy-5-hexene, allylmercaptan or allylalcohol were utilized for plasma polymerization coating and adhesion of coated silica was evaluated by measuring flexural strength. CTE and water absorption of EMC were also measured, and fracture surface of flexural specimen was analyzed by SEM in order to elucidate the failure mode. The plasma polymer coated silica was analyzed by FT-IR and reactivity of plasma polymer coating with epoxy resin was evaluated with DSC in order to investigate the adhesion mechanism. The EMC prepared from the silica coated with 1,3-diaminopropane or allylamine exhibited high flexural strength, low CTE, and low water absorption compared with the control sample, and also exhibited 100% cohesive failure mode. These results can be attributed to the chemical reaction between the functional groups in the plasma polymer coating and epoxy resin, and also consistent with the results from FT-IR and DSC analysis.

• Proceedings of the Korean Environmental Sciences Society Conference
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• 2003.11b
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• pp.269-270
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• 2003

• Polymer(Korea)
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• v.24 no.1
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• pp.82-89
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• 2000

The blood compatibilities of PU/PVA polymer blends with different mixing ratios were evaluated using various methods, such as fibrinogen adsorption, plasma recalcification time, platelet adhesion, whole blood clotting time, and complement activation. In addition, PVA on the surface of the polymer blends was crosslinked by glutaraldehyde to restrain the mobility of PVA molecules for characterizing the effect of PVA in the polymer blends on blood compatibility. The fibrinogen adsorption on the polymer blends decreased with the increase of PVA amount in the polymer blends. The plasma recalcification times of the polymer blends with 10-50 wt% PVA were longer than those of PU, PVA, and polymer blends with higher amount of PVA. The morphological changes and adhesion of platelets on the polymer blends with 30-50 wt% PVA were less than those on the other materials. The blood clotting times and complement activation on the polymer blends with 30-50 wt% PVA were reduced, compared to the other materials. On the other hand, the blood compatibility of the crosslinked polymer blends was relatively decreased, compared to the non-crosslinked ones. According to these experimental results, the blood compatibility of the polymer blends with 30-50 wt% PVA was better than that of the other materials and such a blood compatibility of the polymer blends might be related to the mobility of PVA molecules on the surface.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.196.1-196.1
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• 2013

반도체의 device design rule이 shrink 됨에 따라 공정이 난이도가 높아지고 이에 따른 관리가 어려워지고 있다. 특히 미세 particle에 대한 제어의 필요성은 보다 커졌다. 진공 chamber 발생하는 미세 particle의 주요 원인으로는 공정 중 발생한 polymer, chamber 내 부품의 식각 및 스퍼터링에 의한 부산물 등이 있다. Plasma 공정 도중 발생한 particle은 plasma 내 전자에 의해 대전되어 음의 전하량을 가지게 된다. 음의 전하량을 가진 particle은 plasma와 wafer의 경계면에서 형성되는 sheath 때문에 wafer에 도달하지 못하고 plasma 내에 부유하게 된다. 이러한 particle은 plasma가 꺼지게 되면 sheath가 사라지면서 wafer에 도달하게 되고 wafer의 오염을 유발하게 되고 생산 수율을 저하시키는 요인이 된다. 이러한 이유로 최근 plasma 공정에서는 공정 중 발생하는 부유성 particle에 대한 관리가 중요해졌다. 이를 관리하기 위해 plasma를 끄기 전 부유성 particle을 제거하는 방안을 고안하고 평가를 진행하였다. 공정이 끝나고 plasma가 꺼지기 전 plasma를 유지하여 부유성 particle이 wafer에 도달하지 못하는 상태에서 gas purge를 실시한다. 이러한 과정 후 plasma를 끄게 되면 부유성 particle이 wafer에 도달하는 것을 감소시키게 된다. 이번 평가를 통해 부유성 particle에 대해서 대략 20%의 감소 효과를 볼 수 있었다. 이를 토대로 향후 조건 최적화 후 적용 시 particle 감소뿐 만 아니라 수율 향상에도 기여할 수 있을 것이라 기대된다.

• Bulletin of the Korean Chemical Society
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• v.31 no.2
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• pp.335-338
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• 2010

In this study, the atmospheric plasma treatment with $He/O_2$ was conducted to modify the surface chemistry of carbon fibers. The effects of plasma treatment parameters on the surface energetics of carbon fibers were experimentally investigated with respect to gas flow ratio, power intensity, and treatment time. Surface characteristics of the carbon fibers were determined by X-ray photoelectron spectroscopy (XPS), scanning electron microscope (SEM), Fourier transform infrared (FT-IR), Zeta-potential, and contact angle measurements. The results indicated that oxygen plasma treatment led to a large amount of reactive functional groups onto the fiber surface, and these groups can form together as physical intermolecular bonding to improve the surface wettability with a hydrophilic polymer matrix.