• 한국항해항만학회:학술대회논문집
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• 한국항해항만학회 2000년도 추계학술대회논문집
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• pp.29-32
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• 2000

Cerium oxide thin film has been proposed as a buffer layer between the ferroelectric film and the Si substrate in Metal-Ferroelectric-Insulator-Silicon (MFIS ) structures for ferroelectric random access memory (FRAM) applications. In this study, CeO$_2$thin films were etched with Cl$_2$/Ar gas combination in an inductively coupled plasma (ICP). The highest etch rate of CeO$_2$film is 230 $\AA$/min at Cl$_2$/(Cl$_2$+Ar) gas mixing ratio of 0.2. This result confirms that CeO$_2$thin film is dominantly etched by Ar ions bombardment and is assisted by chemical reaction of Cl radicals. The selectivity of CeO$_2$to YMnO$_3$was 1.83. As a XPS analysis, the surface of etched CeO$_2$thin films was existed in Ce-Cl bond by chemical reaction between Ce and Cl. The results of XPS analysis were confirmed by SIMS analysis. The existence of Ce-Cl bonding was proven at 176.15 (a.m.u.).

• 대한치과의사협회지
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• 제54권12호
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• pp.985-995
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• 2016

Titanium (Ti) has been widely used for dental implant due to great biocompatibility and bonding ability against natural alveolar bone. A lot of titanium surface modification has been introduced in dentistry and, among them, methods to introduce micro/nano-roughened surface were considered as clinically approved strategy for accelerating osseointegration of Ti dental implant. To have synergetic effect with topography oriented favors in cell attachment, chair-side surface treatment with reproducibility of micro/nano-topography is introduced as next strategy to further enhance cellular functionalities. Extensive research has been investigated to study the potential of micro/nano-topography preserved chair-side surface treatment for Ti dental implant. This review will discuss ultraviolet, low level of laser therapy and non-thermal atmospheric pressure plasma on Ti dental implant with micro/nano-topography as next generation of surface treatment due to its abilities to induce super-hydrophilicity or biofunctionality without change of topographical cues.

• 한국재료학회지
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• 제11권10호
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• pp.907-911
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• 2001

In order to improve the grindability of magnetic abrasive, Fe-WC magnetic abrasives were made by a plasma melting method after ball milling at various times. This study aims to investigate homogeneously distributed hard phases in Fe matrix and strong bonding between the Fe-matrix and the hard phase. According to XRD, SEM and OM observation, Fe-WC magnetic abrasive powders exhibit the best grindability by plasma melting for 30h ball milling. As a result of magnetic abrasive polishing, the surface roughness, R_{max}$ 5.0$\mu\textrm{m}$, before magnetic abrasive polishing, was reduced to R_{max}$ 2.4$\mu\textrm{m}$. The new magnetic abrasive polishing process is thought to be the useful methods for the automation of three dimensional surface polishing.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.217-220
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• 2001

The possibility of cerium dioxide $(CeO_2)$ thin films as insulators of metal erroelectric insulator semiconductor (MFIS) structures have been studied. The etching $CeO_2$ thin films have been perfonned in an inductively coupled $Cl_{2}/CF_{4}/Ar$ plasma. The high etch rate of the $CeO_2$ thin film was $250\AA /m$ at a 10 % addition of $Cl_2$ into the $Ar(80)/CF_{4}(20)$. The surface reaction of the etched $CeO_2$ thin films was investigated using X-ray photoelectron spectroscopy (XPS) analysis. There are Ce-Cl and Ce-F bonding by chemical reaction between Cl, F and Ce. These products can be removed by the physical bombardment of incident Ar ions.

• 한국전기전자재료학회논문지
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• 제20권8호
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• pp.701-705
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• 2007

The incorporation of N in a-C film is able to improve the friction coefficient and the adhesion to various substrates. In this study, a-C:N films were deposited on Si and steel substrates by closed-field unbalanced magnetron (CFUBM) sputtering system in $Ar/N_2$ plasma. The lubricant characteristics was investigated for a-C:N deposited with total working pressure from 4 to 7 mTorr. We obtained high hardness up to 24GPa, friction coefficient lower than 0.1 and the smooth surface of having the extremely low roughness (0.16 nm). The physcial properties of a-C:N thin film are related to the increase of cross-linked $sp^2$ bonding clusters in the film. However, the decrease of hardness, elastic modulus and the increase of surface roughness, friction coefficient with the increase of $N_2$ partial pressrue might be due to the effect of energetic ions as a result of the increase of ion bombardment with the increase of ion density in the plasma.

• 한국결정성장학회지
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• 제10권1호
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• pp.1-4
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• 2000

Thin films of hydrogenated amorphous silicon carbide compounds ($a-Si_{x}C_{1-x}:H$) of different compositions were deposited on Si substrate by RF plasma-enhanced chemical vapor deposition (PECVD). Experiments were carried out using silane (SiH$_4$) and methane ($CH_4$) as the gas precursors at 1 Torr and at a low substrate temperature ($250^{\circ}C$). The gas flow rate was changed with the other parameters (pressure, temperature, RF power) fixed. The substrate was Si(100) wafer and all of the films obtained were amorphous. The bonding structure of $a-Si_{x}C_{1-x}:H$films deposited was investigated by X-ray photoelectron spectroscopy (XPS) for the film compositions. In addition, the surface morphology of films was investigated by atomic force microscopy (AFM).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.217-220
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• 2001

The possibility of cerium dioxide (CeO$_{7}$ ) thin films as insulators of metal erroelectric insulator semiconductor (MFIS) structures have been studied. The etching CeO$_2$ thin films have been performed in an inductively coupled C1$_2$/CF$_4$/Ar plasma. The high etch rate of the CeO$_2$ thin film was 250 ${\AA}$/m at a 10% addition of Cl$_2$ into the Ar(80)/CF$_4$(20). The surface reaction of the etched CeO$_2$ thin films was investigated using X-ray photoelectron spectroscopy (XPS) analysis. There are Ce-Cl and Ce-F bonding by chemical reaction between Cl, F and Ce. These products can be removed by the physical bombardment of incident Ar ions.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2000년도 추계학술대회 논문집
• /
• pp.29-32
• /
• 2000

Cerium oxide thin film has been proposed as a buffer layer between the ferroelectric film and the Si substrate in Metal-Ferroelectric-Insulator-Silicon (MFIS ) structures for ferroelectric random access memory (FRAM) applications. In this study, CeO$_2$ thin films were etched with Cl$_2$/Ar gas combination in an inductively coupled plasma (ICP). The highest etch rate of CeO$_2$ film is 230 $\AA$/min at Cl$_2$/(Cl$_2$+Ar) gas mixing ratio of 0.2. This result confirms that CeO$_2$ thin film is dominantly etched by Ar ions bombardment and is assisted by chemical reaction of Cl radicals. The selectivity of CeO$_2$ to YMnO$_3$ was 1.83. As a XPS analysis, the surface of etched CeO$_2$ thin films was existed in Ce-Cl bond by chemical reaction between Ce and Cl. The results of XPS analysis were confirmed by SIMS analysis. The existence of Ce-Cl bonding was proven at 176.15 (a.m.u.).

• 한국전기전자재료학회논문지
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• 제15권5호
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• pp.388-392
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• 2002

In this work, the etching of $CeO_2$ thin films has been performed in an inductively coupled $Ar/CF_4/Cl_2$ plasma. The highest etch rate of the $CeO_2$ thin film ws 250 ${\AA}/min$ and the selectivity of CeO$_2$to SBT was 0.4 at a 10% additive $Cl_2$ into Ar/($Ar+CF_4$)gas mixing ratio of 0.8. From result of X-ray photoelectron spectroscopy (XPS) analysis, there are Ce-Cl and Ce-F bonding by chemical reaction between Cl, F and Ce. During the etching of $CeO_2$ thin films in $Ar/CF_4/Cl_2$ plama, Ce-Cl and Ce-F bond is formed, and these prodcuts can be removed by the physical bombardment of Ar ions. The 10% additive $Cl_2$ into the Ar/($Ar+CF_4$)gas mixing ratio of 0.8 could enhance the reaction between Cl, F and Ce.

• 공업화학
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• 제30권6호
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• pp.719-725
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• 2019

본 실험에서는 활성탄소섬유에 산소플라즈마 처리를 실시하여 산소작용기 도입 함량에 따른 유독성 화학작용제의 모사 가스인 dimethyl methylphosphonate (DMMP) 감응특성에 대하여 고찰하였다. 산소플라즈마 처리 유량이 증가할수록 활성탄소섬유 표면에 산소가 6.90%에서 최대 36.6%까지 도입되어 DMMP 가스 감응특성에 영향을 미치는 -OH가 증가하였다. 그러나 유량이 증가할수록 산소플라즈마 처리 시 발생한 산소 활성종으로 인하여 활성탄소섬유 표면에 식각이 발생하여 비표면적은 감소하는 경향을 보였다. DMMP 가스센서의 저항변화율은 산소플라즈마 처리 유량이 증가함에 따라 4.2%에서 최대 25.1%까지 증가하였다. 이는 산소플라즈마 처리로 인하여 활성탄소섬유에 발달된 -OH와 DMMP 가스의 수소결합으로 인한 것이라 여겨진다. 따라서 산소플라즈마 처리는 상온에서 유독성화학작용제 가스를 감지하기 위한 중요한 표면처리 방법 중 하나라고 판단된다.