• Journal of the Optical Society of Korea
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• v.20 no.1
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• pp.130-134
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• 2016

The influence of Au/Ni-based contact formed on a lightly-doped (7.3×1017cm−3, Zn-doped) InGaAsP layer for electrical compensation of surface plasmon polariton (SPP) propagation under various rapid thermal annealing (RTA) conditions has been studied. The active control of SPP propagation is realized by electrically pumping the InGaAsP multiple quantum wells (MQWs) beneath the metal planar waveguide. The metal planar film acts as the electric contact layer and SPP waveguide, simultaneously. The RTA process can lower the metal-semiconductor electric contact resistance. Nevertheless, it inevitably increases the contact interface morphological roughness, which is detrimental to SPP propagation. Based on this dilemma, in this work we focus on studying the influence of RTA conditions on electrical control of SPPs. The experimental results indicate that there is obvious degradation of electrical pumping compensation for SPP propagation loss in the devices annealed at 400℃ compared to those with no annealing treatment. With increasing annealing duration time, more significant degradation of the active performance is observed even under sufficient current injection. When the annealing temperature is set at 400℃ and the duration time approaches 60s, the SPP propagation is nearly no longer supported as the waveguide surface morphology is severely changed. It seems that eutectic mixture stemming from the RTA process significantly increases the metal film roughness and interferes with the SPP signal propagation.

• Journal of the Optical Society of Korea
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• v.18 no.5
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• pp.569-573
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• 2014

We demonstrate a low-cost, superbly efficient way of etching for the nano-, and micro-sized pyramid patterns on (100)-oriented Si wafer surfaces for use as a patterned master. We show a way of producing functional optical films for the viewing angle direction brightness-enhancement of Lambertian LED (light emitting diode)/OLED (organic light emitting diode) planar lighting applications. An optimally formulated KOH (Potassium hydroxide) wet etching process enabled random-positioned, and random size-distributed (within a certain size range) pyramid patterns to be developed over the entire (100) silicon wafer substrates up to 8" and a simple replication process of master patterns onto the PC (poly-carbonate) and PMMA (poly-methyl methacrylate) films were performed. Haze ratio values were measured for several film samples exhibiting excellent values over 90% suitable for LED/OLED lighting purposes. Brightness was also improved by 13~14% toward the viewing angle direction. Computational simulations using LightTools$^{TM}$ were also carried out and turned out to be in strong agreement with experimental data. Finally, we could check the feasibility of fabricating low-cost, large area, high performance optical films for commercialization.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.19-22
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• 2013

Recently, high speed transmission and large information demand have been increased. Also, researches of integrated optical device for large production and high-efficient planar lightwave circuit (PLC) have been increased. In this paper, integrated optical alignment is proposed which makes passive alignment between optical device and optical fiber possible. The integrated optical device consists of splitter structures which have one input and two outputs. The proposed integrated structure was fabricated by roll-to-roll (RTR) processing method. This method enables to manufacture continuously and the processing time can be shortened. Optical property of the fabricated optical device showed 3.9 dB insertion loss and 0.2 dB optical uniformity using the light source with 1550 nm wavelength.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.5
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• pp.38-45
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• 2004

As optical communication is being substituted for telecommunication, the demand of a large variety of fiber optic components is increasing. V-groove substrates, one of the module components, are used to connect optical fibers to optical planar circuits and to arrange fibers. Their applications are multi-channel optical connectors and optical waveguide fiber coupling, etc. Because these substrates are a critical part of the splitter in a multiplexer and a multi fiber connector, precise and reliable fabrication process is required. For precisely aligning core pitch between fibers, machined core pitch tolerance should be within sub-microns. Therefore, these are generally produced by state-of-the-art micro-fabrication like MEMS. However, most of the process equipment is very expensive. It is also difficult to change the process line for custom designs to meet specific requirements using various materials. For various design specifications such as different values of the V angle and low-priced process, the fabrication method should be flexible and low cost. To achieve this goal, we have suggested a miniaturized machine tool with high accuracy positioning system. Through this study, it is shown that this cutting process can be applied to produce V-groove subtracts. We also show the possibility of using a miniaturized machining system for producing small parts.

• Journal of IKEEE
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• v.21 no.4
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• pp.412-415
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• 2017

In this paper, we propose a multi license plate recognition system using high resolution $360^{\circ}$ omnidirectional IP camera. The proposed system consists of a planar division part of $360^{\circ}$ circular image and a multi license plate recognition part. The planar division part of the $360^{\circ}$ circular image are divided into a planar image with enhanced image quality through processes such as circular image acquisition, circular image segmentation, conversion to plane image, pixel correction using color interpolation, color correction and edge correction in a high resolution $360^{\circ}$ omnidirectional IP Camera. Multi license plate recognition part is through the multi-plate extraction candidate region, a multi-plate candidate area normalized and restore, multiple license plate number, character recognition using a neural network in the process of recognizing a multi-planar imaging plates. In order to evaluate the multi license plate recognition system using the proposed high resolution $360^{\circ}$ omnidirectional IP camera, we experimented with a specialist in the operation of intelligent parking control system, and 97.8% of high plate recognition rate was confirmed.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.172-173
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• 2012

Currently GaN based LED is known to show high internal or external efficiency at low current range. However, this LED operation occurs at high current range and in this range, a significant performance degradation known as 'efficiency droop' occurs. Auger process, carrier leakage process, field effect due to lattice mismatch and thermal effects have been discussed as the causes of loss of efficiency, and these phenomena are major hindrance in LED performance. In order to investigate the main effects of efficiency loss and overcome such effects, it is essential to obtain relative proportion of measurements of internal quantum efficiency (IQE) and various radiative and nonradiative recombination processes. Also, it is very important to obtain radiative and non-radiative recombination times in LEDs. In this research, we measured the IQE of InGaN/GaN multiple quantum wells (MQWs) LEDs with PSS and Planar substrate using modified ABC equation, and investigated the physical mechanism behind by analyzing the emission energy, full-width half maximum (FWHM) of the emission spectra, and carrier recombination dynamic by time-resolved electroluminescence (TREL) measurement using pulse current generator. The LED layer structures were grown on a c-plane sapphire substrate and the active region consists of five 30 ${\AA}$ thick In0.15Ga0.85N QWs. The dimension of the fabricated LED chip was $800um{\times}300um$. Fig. 1. is shown external quantum efficiency (EQE) of both samples. Peak efficiency of LED with PSS is 92% and peak efficiency of LED with planar substrate is 82%. We also confirm that droop of PSS sample is slightly larger than planar substrate sample. Fig. 2 is shown that analysis of relation between IQE and decay time with increasing current using TREL method.

• Journal of the Korean Magnetics Society
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• v.25 no.1
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• pp.4-9
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• 2015

This study was carried out to investigate a influence of humidity variation (%) on the magnetic properties and the surface flaws in the fabrication of Fe-based $Fe_{78}Si_9B_{13}$ amorphous alloy ribbon by Planar Flow Casting process. As a result, the size of the air pocket and the droplet which is observed in the contact surface and the free face of the amorphous alloy ribbon becomes large when the humidity increases and the size highly increases with the surface roughness at the same time. Especially, the surface roughness value which is made in the 65 % of the humidity is the lowest in the contact surface ($Ra=0.60{\mu}m$, $Rz=3.11{\mu}m$) and the free face ($Ra=0.47{\mu}m$, $Rz=3.00{\mu}m$). Also, in case of the soft magnetic property of the magnetic core which is made with the toroidal core of $23(OD)^*20(ID)^*20(H)$ size, in the sample of the amorphous alloy ribbon which is made in 65% of the humidity, the most excellent value is gained as $B_s(B_{700})=1.055T$, $H_c=0.083Oe$, permeability = 1,197 and core loss = 0.276W/kg.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.8 no.3
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• pp.1093-1104
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• 2014

The High Efficiency Video Coding (HEVC) is a new video coding standard that can provide much better compression efficiency than its predecessor H.264/AVC. However, it is computationally more intensive due to the use of flexible quadtree coding unit structure and more choices of prediction modes. In this paper, a fast intraframe coding scheme is proposed for HEVC. Firstly, a fast bottom-up pruning algorithm is designed to skip the mode decision process or reduce the candidate modes at larger block size coding unit. Then, a low complexity rough mode decision process is adopted to choose a small candidate set, followed by early DC and Planar mode decision and mode filtering to further reduce the number of candidate modes. The proposed method is evaluated by the HEVC reference software HM8.2. Averaging over 5 classes of HEVC test sequences, 41.39% encoding time saving is achieved with only 0.77% bitrate increase.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.1
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• pp.154-163
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• 1997

Thermally-induced deformation in SMC(Sheet Molding Compound) products is analyzed using three dimensional finite element method. Planar fiber orientation, which causes the anisotropic material properties, is calculated through the flow analysis during the compression stage of the mold. Also curing process is analyzed to predict temperature profile which has significant effects on warpage of SMC products. Through the developed procedure, effects of various process conditions such as charge location, mold temperature, fiber contents, and fiber orientations on deformation of final products are studied. and processing strategies are proposed to reduce the warpage and the shrinkage.

• Journal of the Korean Vacuum Society
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• v.2 no.4
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• pp.474-479
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• 1993

Submicron contact hole filling with aluminum alloys has been achieved with a multistep metallization method, which utilizes a metal " flow" or self-diffusion process at elevated temperatures after the metal was sputter-deposited. A multi-chamber, modular sputtering system was employed to deposit aluminum alloys and subsequently to anneal the deposited metal films under vacuum at high temperatures. The film were deposited on 200 mm wafers with planar, dc magnetron sputtering sources without anysubstrate bias. The basic process steps studied for the multistep metallization include an initial layer deposition at low temperatures less than $100^{\circ}C$, and an annealin gstep at elevated temperatures, between 450 and $550^{\circ}C$. The degree of planarization or step coverage was dependent strongly upon the temperature and time of the flow step and complete filling of the submicron contacts with aluminum alloys was achieved. Responsible mechanisms for the enhancement in step coverge and factros determining uniform and reproducible flow of aluminum alloys during the high temperauture step are discussed.discussed.