• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.333-336
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• 2008

We have studied on optical properties of advanced S-IPS with a fine pitch electrode and a new finger design. Transmittance of panel increases with decreasing of width and angle of finger electrode. In order to improve transmittance, fine pitch electrode of ${\sim}2{\mu}m$ and rubbing angle of 10 degree have been adopted. Various optical performances are defined as the function of finger design and field intensify across the IPS pixel electrodes. We have developed the advanced electrode structures with a high performance. As a result, the optical properties of 42" full HD with 120Hz frequency shows high transmittance over 5%, contrast ratio of 1800:1, gray-to-gray response time of 4.4ms, respectively. And also we have studied that the moving picture quality of IPS LCD is related with design parameters of IPS cells and finger shape.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.10
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• pp.135-141
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• 2013

In this paper, we installed three high brightness red, green, and blue LED in one socket and made one pixel unit. And we also developed the full-color display board module and control unit which can express various images such as text, graphics, video image with the combination of pixel units and a number of modules. LED display driver module have a driver circuit within the combination of the RGB pixel dot on unit area. These modules of the existing form can be high priced because of implementation a fixed resolution in specific space and installation space. To overcome these shortcomings, we developed a LED driver and LED pixel modules free in array at random pitch intervals. Display board module of this paper enabled to display smoothly video image which have many data processing quantity through dragging data speed up 36 frames per second. Also there are an effect which is provided more clear image because of improving the flickering of the existing display board.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.2
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• pp.55-60
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• 2007

This paper presents a compact double resolution scheme for the optical angle sensor based on 1-dimensional CMOS photodiode pixel array. All the pixels are divided into the even pixel and the odd pixel groups. The winner take all circuit is provided for each group. The proposed interpolation scheme increases the resolution by 2 from the winner addresses and winner values. The interpolation scheme can be implemented without any additional pixels or winner take all circuits and require only a comparator and a XOR gate. The proposed pixel array chip that has 336 photodiode pixels with $5.6{\mu}m$ pitch was fabricated with $0.35{\mu}m$ CMOS process and was assembled with a $50{\mu}m$ slit to form an angle sensor. The measured resolution is $0.1{\circ}$ with the proposed interpolation. The chip consumes 35mW and provides 8k samples per second.

• Journal of the Korean Society of Radiology
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• v.2 no.4
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• pp.5-9
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• 2008

Antiscatter grids are widely used in radiography to remove scattered X-rays and thus improve the image contrast. However, the use of grids makes moir$\acute{e}$ artifact in the digital image, and this can be a critical reason for a mistaken diagnosis. In this paper, we examined that moire artifacts are how to relate with grid frequency, pixel pitch and grid rotation angle. To experiment we prepared 6 grids having different line frequencies (4.0 to 8.5lines/mm) and tested with a DR imager having a $139{\mu}m{\times}139{\mu}m$ pixel size. In the result of this experiment, we could get data about moir$\acute{e}$ artifact that could be make solution to remove the line artifact for the successful use of the grid in digital radiography. The acquired data and theory through this experiment, are expected to make contribution to the elimination of moir$\acute{e}$ artifact in the DR system.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.11
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• pp.24-32
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• 2002

In this paper we implemented various image processing filtering using the format converter. This design method is based on realized the large processor-per-pixel array by integrated circuit technology. These two types of integrated structure are can be classify associative parallel processor and parallel process DRAM(or SRAM) cell. Layout pitch of one-bit-wide logic is identical memory cell pitch to array high density PEs in integrate structure. This format converter design has control path implementation efficiently, and can be utilize the high technology without complicated controller hardware. Sequence of array instruction are generated by host computer before process start, and instructions are saved on unit controller. Host computer is executed the pixel-parallel operation starting at saved instructions after processing start. As a result, we obtained three result that 1)simple smoothing suppresses higher spatial frequencies, reducing noise but also blurring edges, 2) a smoothing and segmentation process reduces noise while preserving sharp edges, and 3) median filtering, like smoothing and segmentation, may be applied to reduce image noise. Median filtering eliminates spikes while maintaining sharp edges and preserving monotonic variations in pixel values.

• Korean Journal of Optics and Photonics
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• v.12 no.1
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• pp.61-66
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• 2001

Defocused Fourier plane holograms are stored in disk-type holographic memories where thin recording media are used, the areal storage density per hologram and the intensity uniformity of the signal beam at the recording plane are studied. As the pixel pitch of the spatial light modulator that represents binary data increases, the storage density per hologram increases if exact Fourier holograms are stored. When defocused Fourier plane holograms are stored, however, we show that there exists an optimal pixel pitch that maximizes the area storage density per hologram in general, to increase the areal storage density per hologram, f/# of the Fourier transform lens that focuses the data image should be as small as possible. In this case, not only the intensity distribution at the recording plane but also the recording area becomes very sensitive to the degree of defocusing. Therefore, even if the exact Fourier plane holograms are stored, the defocusing effect owing to the medium thickness should be taken into account to achieve the maximal areal storage density per hologram.logram.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.11
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• pp.7-13
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• 2002

BSCT 320${\times}$240 IRFPA detector module is implemented, which is a key component in uncooled thermal imaging systems. The detector module consists of two parts, infrared sensitive pixel array and read-out integrated circuit(ROIC). The BSCT 320${\times}$240 pixels are made by laser scribe process and 10-${\mu}m$ micro-bump to satisfy 50-${\mu}m$ pitch and 95-% fill-factor. The ROIC has been designed to electrically address the pixels sequentailly and to improve signal-to-noise ratio with single transistor amplifier, HPF, tunable LPF and clamp circuit. The fabricated hybrid chip of detector and ROIC has been mounted on the TEC built-in ceramic package for more stable operation and tested for lots of electrical and optical properties. The IRFA sample has shown successful properties and met with good results of fill-factor, detectivity and responsivity.

• Korean Journal of Optics and Photonics
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• v.11 no.1
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• pp.58-64
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• 2000

Assuming that the performance of holographic storage media is ideal, we estimate the area storage density of disk-type holographic memories, when the method of either angle multiplexing, or rotational multiplexing, or both are used. The area storage density is strongly dependent on the f numbers (ratio of focal length to diameter) of both the Fourier transform lens in the signal arm, denoted by $F/#_2$, and the angle range over which the reference beam is incident (or, the equivalent f number corresponding to the angle range denoted by $F/#_1$). The area storage density is largely independent of the pixel pitch of the spatial light modulator when the Fourier plane holograms are recorded, while it is sensitive to the pixel pitch when the image plane holograms are recorded. In general, to obtain high area storage density, the Fourier or at least near Fourier plane holograms rather than the image plane holograms should be recorded. In addition, when the thickness of the recording materials are less than approximately $500\mu\extrm{m}$, rotational multiplexing gives higher area storage densities than angle multiplexing does. To increase the storage density further, however, it is desirable to use both of the two multiplexing methods in combination.nation.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.65-80
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• 2020

In this article, we review the study trends of three-dimensional (3D) displays that can display stereoscopic images from the perspective of a display device. 3D display technology can be divided into light field, holographic, and volume displays. Light field display is a display that can reproduce the intensity and direction of light or 'ray' in each pixel. It can display stereoscopic images with less information than a holographic display and does not require coherence of the light source. Therefore, it is expected that it will be commercialized before the holographic display. Meanwhile, the holographic display creates a stereoscopic image by completely reproducing the wavefront of an image using diffraction in terms of wave characteristics of light. This technology is considered to be able to obtain the most complete stereoscopic image, and the digital holographic display using a spatial light modulator (SLM) is expected to be the ultimate stereoscopic display. However, the digital holographic display still experiences the problem of a narrow viewing angle due to the finite pixel pitch of the SLM. Therefore, various attempts have been made at solving this problem. Volumetric display is a technology that directly creates a stereoscopic image by forming a spatial pixel, which is known as a volumetric pixel, in a physical space, and has a significant advantage in that it can easily solve the problem of the viewing angle. This technology has already been tested for commercial purposes by several leading companies. In this paper, we will examine recent research trends regarding these 3D displays and near-eye display that is emerging as a significant application field of these technologies.

• Current Optics and Photonics
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• v.1 no.2
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• pp.143-149
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• 2017

LED arrays with pixel numbers of $3{\times}3$, $4{\times}4$, and $5{\times}5$ have been studied in this paper in order to enhance the optical output power and decrease heat dissipation of an AlGaInP-based light emitting diode display device (pixel size of $280{\times}280{\mu}m$) fabricated by micro-opto-electro-mechanical systems. Simulation results showed that the thermal resistances of the $3{\times}3$, $4{\times}4$, $5{\times}5$ arrays were $52^{\circ}C/W$, $69.7^{\circ}C/W$, and $84.3^{\circ}C/W$. The junction temperature was calculated by the peak wavelength shift method, which showed that the maximum value appears at the center pixel due to thermal crosstalk from neighboring pixels. The central temperature would be minimized with $40{\mu}m$ pixel pitch and $150{\mu}m$ substrate thickness as calculated by thermal modeling using finite element analysis. The modeling can be used to optimize parameters of highly integrated AlGaInP-based LED arrays fabricated by micro-opto-electro-mechanical systems technology.