• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.39-43
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• 2009

In this paper, the flow characteristics of underfill material driven by capillary action between flip-chip and substrate were investigated. Also, the effects of viscosity level and dispensing point of underfill on flow characteristics were investigated. Flip chip package size was $5mm{\times}5mm{\times}0.65^tmm$, the diameter of solder bump was 100 ${\mu}m$, and the pitch was 150 ${\mu}m$. It was full grid area-array type with 1024 I/Os. The glass substrate was used and the gap between the chip and substrate was 50 ${\mu}m$. For the experimental study, three different underfills with different viscous properties($2000{\sim}3700$ cps), and two different types of dispensing methods(center dot and edge dot) were used. The flow characteristics and filling time of underfill were investigated by using CCD camera. The results show that the edge flow was faster than center flow due to the edge effect, which was caused by the resistance of solder bumps. In case of edge dot dispensing type, the filling time was faster due to the large edge effect, compared to center dot dispensing type. Also, it was found that the underfill flow was faster and the filling time decreased as the viscosity level of underfill was decreased.

• Journal of the Korean Vacuum Society
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• v.20 no.1
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• pp.22-29
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• 2011

An infrared thermographic imaging module of [$320{\times}256$] focal-plane array (FPA) based on [InAs/GaSb] strained-layer superlattice (SLS) was fabricated, and its images were demonstrated. The p-i-n device consisted of an active layer (i) of 300-period [13/7]-ML [InAs/GaSb]-SLS and a pair of p/n-electrodes of (60/115)-period [InAs:(Be/Si)/GaSb]-SLS. FTIR photoresponse spectra taken from a test device revealed that the peak wavelength (${\lambda}_p$) and the cutoff wavelength (${\lambda}_{co}$) were approximately $3.1/2.7{\mu}m$ and $3.8{\mu}m$, respectively, and it was confirmed that the device was operated up to a temperature of 180 K. The $30/24-{\mu}m$ design rule was applied to single pixel pitch/mesa, and a standard photolithography was introduced for [$320{\times}256$]-FPA fabrication. An FPA-ROIC thermographic module was accomplished by using a $18/10-{\mu}m$ In-bump/UBM process and a flip-chip bonding technique, and the thermographic image was demonstrated by utilizing a mid-infrared camera and an image processor.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.296-296
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• 2014

We investigate experimentally and theoretically the splitting of surface plasmon (SP) resonance peaks under TE- and TM-polarized illumination. The SP structure at infrared wavelength is fabricated with a 2-dimensional square periodic array of circular holes penetrating through Au (gold) film. In brief, the processing steps to fabricate the SP structure are as follows. (i) A standard optical lithography was performed to produce to a periodic array of photoresist (PR) circular cylinders. (ii) After the PR pattern, e-beam evaporation was used to deposit a 50-nm thick layer of Au. (iii) A lift-off processing with acetone to remove the PR layer, leading to final structure (pitch, $p=2.2{\mu}m$; aperture size, $d=1.1{\mu}m$) as shown in Fig. 1(a). The transmission is measured using a Nicolet Fourier-transform infrared spectroscopy (FTIR) at the incident angle from $0^{\circ}$ to $36^{\circ}$ with a step of $4^{\circ}$ both in TE and TM polarization. Measured first and second order SP resonances at interface between Au and GaAs exhibit the splitting into two branches under TM-polarized light as shown in Fig. 1(b). However, as the incidence angle under TE polarization is increased, the $1^{st}$ order SP resonance peak blue-shifts slightly while the splitting of $2^{nd}$ order SP resonance peak tends to be larger (not shown here). For the purpose of understanding our experimental results qualitatively, SP resonance peak wavelengths can be calculated from momentum matching condition (black circle depicted in Fig. 2(b)), $k_{sp}=k_{\parallel}{\pm}iG_x{\pm}jG_y$, where $k_{sp}$ is the SP wavevector, $k_{\parallel}$ is the in-plane component of incident light wavevector, i and j are SP coupling order, and G is the grating momentum wavevector. Moreover, for better understanding we performed 3D full field electromagnetic simulations of SP structure using a finite integration technique (CST Microwave Studio). Fig. 1(b) shows an excellent agreement between the experimental, calculated and CST-simulated splitting of SP resonance peaks with various incidence angles under TM-polarized illumination (TE results are not shown here). The simulated z-component electric field (Ez) distribution at incident angle, $4^{\circ}$ and $16^{\circ}$ under TM polarization and at the corresponding SP resonance wavelength is shown in Fig. 1(c). The analysis and comparison of theoretical results with experiment indicates a good agreement of the splitting behavior of the surface plasmon resonance modes at oblique incidence both in TE and TM polarization.

• Progress in Superconductivity
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• v.13 no.1
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• pp.58-63
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• 2011

Recently, superconductor flywheel energy storage systems (SFESs) have been developed for application to a regenerative power of train, a power quality improvement, the storage of distributed power sources such as solar and wind power, and a load leveling. As the high temperature superconductor (HTS) bearings offer dynamic stability without the use of active control, accurate analysis of the HTS bearing is very important for application to SFESs. Mechanical property of a HTS bearing is the main index for evaluating the capacity of an HTS bearing and is determined by the interaction between the HTS bulks and the permanent magnet (PM) rotor. HTS bearing rotor consists of PM and iron collector and the proper dimension design of them is very important to determine a supporting characteristics. In this study, we have optimized a rotor magnet array, which depends on the limited bulk size and performed various dimension layouts for thickness of the pole pitch and iron collector. HTS bearing rotor was installed into a single axis universal test machine for a stiffness test. A hydraulic pump was used to control the amplitude and frequency of the rotor vibration. As a result, the stiffness result showed a large difference more than 30 % according to the thickness of permanent magnet and iron collector. This is closely related to the bulk stiffness controlled by flux pining area, which is limited by the total bulk dimension. Finally, the optimized HTS bearing rotor was installed into a flywheel system for a dynamic stability test. We discussed the dynamic properties of the superconductor bearing rotor and these results can be used for the optimal design of HTS bearings of the 10kWh SFESs.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.86-86
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• 2012

The new approaches for silicon solar cell of new concept have been actively conducted. Especially, solar cells with wire array structured radial p-n junctions has attracted considerable attention due to the unique advantages of orthogonalizing the direction of light absorption and charge separation while allowing for improved light scattering and trapping. One-dimenstional semiconductor nano/micro structures should be fabricated for radial p-n junction solar cell. Most of silicon wire and/or pillar arrays have been fabricated by vapour-liquid-solid (VLS) growth because of its simple and cheap process. In the case of the VLS method has some weak points, that is, the incorporation of heavy metal catalysts into the growing silicon wire, the high temperature procedure. We have tried new approaches; one is electrochemical etching, the other is noble metal catalytic etching method to overcome those problems. In this talk, the silicon pillar formation will be characterized by investigating the parameters of the electrochemical etching process such as HF concentration ratio of electrolyte, current density, back contact material, temperature of the solution, and large pre-pattern size and pitch. In the noble metal catalytic etching processes, the effect of solution composition and thickness of metal catalyst on the etching rate and morphologies of silicon was investigated. Finally, radial p-n junction wire arrays were fabricated by spin on doping (phosphor), starting from chemical etched p-Si wire arrays. In/Ga eutectic metal was used for contact metal. The energy conversion efficiency of radial p-n junction solar cell is discussed.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.59-65
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• 2011

According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.21 no.1
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• pp.165-173
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• 1997

The present study investigates heat/mass transfer for flow through perforated plates for application to combustor wall and turbine blade film cooling. The experiments are conducted for hole length to diameter ratios of 0.68 to 1.5, for hole pitch-to-diameter ratios of 1.5 and 3.0, for gap distance between two parallel perforated plates of 1 to 3 hole diameters, and for Reynolds numbers of 60 to 13, 700. Local heat/mass transfer coefficients near and inside the cooling holes are obtained using a naphthalene sublimation technique. Detailed knowledge of the local transfer coefficients is essential to analyze thermal stress in turbine components. The results indicate that the heat/mass transfer coefficients inside the hole surface vary significantly due to flow separation and reattachment. The transfer coefficient near the reattachment point is about four and half times that for a fully developed circular tube flow. The heat/mass transfer coefficient on the leeward surface has the same order as that on the windward surface because of a strong recirculation flow between neighboring jets from the array of holes. For flow through two perforated plate layers, the transfer coefficients on the target surface (windward surface of the second wall) affected by the gap spacing are approximately three to four times higher than that with a single layer.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.3
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• pp.171-181
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• 2017

Two-phase cross flow exists in many shell-and-tube heat exchangers such as condensers, evaporators, and nuclear steam generators. The drag force acting on a tube bundle subjected to air/water flow is evaluated experimentally. The cylinders subjected to two-phase flow are arranged in a normal square array. The ratio of pitch to diameter is 1.35, and the diameter of the cylinder is 18 mm. The drag force along the flow direction on the tube bundles is measured to calculate the drag coefficient and the two-phase damping ratio. The two-phase damping ratios, given by the analytical model for a homogeneous two-phase flow, are compared with experimental results. The correlation factor between the frictional pressure drop and the hydraulic drag coefficient is determined from the experimental results. The factor is used to calculate the drag force analytically. It is found that with an increase in the mass flux, the drag force, and the drag coefficients are close to the results given by the homogeneous model. The result shows that the damping ratio can be calculated using the homogeneous model for bubbly flow of sufficiently large mass flux.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.6
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• pp.481-486
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• 2010

ENIG (electroless Ni immersion gold) is one of surface finishing which has been most widely used in fine pitch SMT (surface mount technology) and BGA (ball grid array) packaging process. The reliability for package bondability is mainly affected by interfacial reaction between solder and surface finishing. Since the behavior of IMC (intermetallic compound), or the interfacial reaction between Ni and solder, affects to some product reliabilities such as solderability and bondability, understanding behavior of IMC should be important issue. Thus, we studied the properties of ENIG with P contents (9 wt% and 13 wt%), where the P contents is one of main factors in formation of IMC layer. The effect of P content was discussed using the results obtained from FE-SEM(field-emission scanning electron microscope), EPMA(electron probe micro analyzer), EDS(energy dispersive spectroscopy) and Dual-FIB(focused ion beam). Especially, we observed needle type irregular IMC layer with decreasing Ni contents under high P contents (13 wt%). Also, we found how IMC layer affects to bondability with forming continuous Kirkendall voids and thick P-rich layer.

• Journal of Astronomy and Space Sciences
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• v.31 no.2
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• pp.177-186
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• 2014

The Immersion Grating Infrared Spectrometer (IGRINS) is a near-infrared wide-band high-resolution spectrograph jointly developed by the Korea Astronomy and Space Science Institute and the University of Texas at Austin. IGRINS employs three HAWAII-2RG Focal Plane Array (H2RG FPA) detectors. We present the design and fabrication of the detector mount for the H2RG detector. The detector mount consists of a detector housing, an ASIC housing, a Field Flattener Lens (FFL) mount, and a support base frame. The detector and the ASIC housing should be kept at 65 K and the support base frame at 130 K. Therefore they are thermally isolated by the support made of GFRP material. The detector mount is designed so that it has features of fine adjusting the position of the detector surface in the optical axis and of fine adjusting yaw and pitch angles in order to utilize as an optical system alignment compensator. We optimized the structural stability and thermal characteristics of the mount design using computer-aided 3D modeling and finite element analysis. Based on the structural and thermal analysis, the designed detector mount meets an optical stability tolerance and system thermal requirements. Actual detector mount fabricated based on the design has been installed into the IGRINS cryostat and successfully passed a vacuum test and a cold test.