• Title/Summary/Keyword: Pin-by-Pin

Search Result 1,723, Processing Time 0.029 seconds

Tribological Properties of Pressureless-sinteed Silicon Carbide (상압소결 탄화규소 소결체의 마찰마모특성)

  • Baik, Yong-Hyuck;Choi, Woong;Seo, Young-Hean;Park, Yong-Kap
    • Journal of the Korean Ceramic Society
    • /
    • v.35 no.7
    • /
    • pp.721-725
    • /
    • 1998
  • In this study solid-phase sintered silicon caribide samples composed of SiC powder having boron and car-bon black as additives were prepared by pressureless sintering at $1950^{\circ}C$. The bending strength the frac-ture toughness and the specific werar rate of the samples were examined and the micro structures of the broken and the worn surface were observed by SEM to understand the relationship between the tri-bological charcteristics and the micro structure. Additionally the relationship between the micro struc-tures and the tribological characteristics of the samples for the frictional opponents SiC and $Al_{2}O_{3}$ pins were investigated Conclusions are as follows ; 1. The specific were rate of the samples for the SiC pin was larger than that for the $Al_{2}O_{3}$ pin. HOwever the specific wear rate for the $Al_{2}O_{3}$ pin was increased about 6,45 times as that for the SiC pin under the load increasing. 2. The specific wear rate of the SiC pin was larger than that of the $Al_{2}O_{3}$ pin. owever the specific wear rate of the $Al_{2}O_{3}$ pin was increased about 4 times as that of the SiC pin under the load increasing 3. The micro stucture of the worn surface showed a flat face without cracks in the case that the frictional opponents has the low friction coefficient but in the case of without cracks in the case that the frictional opponents has the low friction coefficient but in the case of the high friction coefficient the micro structure of the worn surface showed an uneven face having spread-ed cracks. 4. The tribological characteristics of thesolid-phase sintered SiC samples was similar to that of li-quid-phase sintered ones when the pin having the high friction coefficient was used.

  • PDF

Design of the Multi-PIN Diode Waveguide Limiter with Extended Attenuation Bandwidth (확장된 신호 감쇄대역을 갖는 다중 PIN다이오드 도파관 리미터 설계)

  • Na, Jae-Hyun;Roh, Don-Suk;Kim, Dong-Gil
    • The Journal of the Korea institute of electronic communication sciences
    • /
    • v.13 no.5
    • /
    • pp.971-978
    • /
    • 2018
  • This paper deals with the design and implementation of a limiter, which is a key component of the Ku-band radar system. The limiter design with the multi-pin diode switch was complemented by wideband signal attenuation, and realized the physical implementation. In the test result of implemented limiter, when the pin diode switch is all off, it is possible to transmit the incoming signal without distortion. Also when the pin diode switch is turned on sequentially, the input signal is attenuated about 20dB or more step by step. Finally when all of them were turned on, attenuation about 50dB or more were measured for a wide bandwidth(1000MHz) in Ku-band.

Observations of Pulsed Bi-polar Discharges in Saline Solutions with Pin to Plate Electrodes

  • Shin, Bhum Jae;Seo, Jeong-Hyun;Collins, George J.
    • Journal of Electrical Engineering and Technology
    • /
    • v.13 no.5
    • /
    • pp.2011-2016
    • /
    • 2018
  • In this study, we have been investigated pin to plate pulsed bi-polar discharges in saline solutions, where bubble generation occurs. We integrate basic I-V-t electrical characteristics with the ICCD shadowgraph images, and finally instant and time averaged I-V waveforms. We observed that the bubble formation phase dynamics is quite different corresponding to the polarity applied to the pin electrode. When the pin electrode is a cathode, the bubble tends to be periodically detached from the pin electrode and the numerous tiny voltage spikes occur related to the electron emission from a pin cathode casing via, we judge from, direct dissociation of water molecules by energetic electrons. On the contrary, the bubble tends to stick to the pin electrode, when the pin electrode is anode; the bubble grows in size throughout the pulse duration. The dynamic electrical characteristics relative to the applied polarity of a pin electrode are presented and discussed by analysis of time averaged I-V waveforms.

Voltage-Controlled PH Diode Attenuator and Temperature Compensation Circuit for Ku-band Satellite Payload (Ku-대역 위성중계기용 전압제어형 PIN 다이오드 감쇄기 및 온도보상회로 설계)

  • 장병준;염인복;이성팔
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.13 no.5
    • /
    • pp.484-491
    • /
    • 2002
  • This paper presents the results of a study of voltage-controlled PIN diode attenuators for Ku-band satellite payload and suggests the temperature-compensation method of these attenuators. The PIN diode attenuators are designed using thin-film hybrid techniques. The load resistance for maximum linear characteristics is determined by simulation and measurements. In the case of APD0805, load resistance of 150 $\Omega$ gives attenuator up to 10 dB linear attenuation range per a PIN diode. Also, measurements over temperature of these PIN diode attenuators were performed. From these measurements, designed PIN diode attenuators shows the severe temperature dependency due to forward voltage variation. A temperature compensation method using thermistor is now suggested to compensate the temperature variation of these PIN diode attenuators. This circuit shows good linear characteristics over wide temperature range

Effects of Rice Flours Prepared with Different Milling Methods on Quality of Sulgidduk (제조 방법을 달리한 쌀가루가 설기떡의 품질에 미치는 영향)

  • Park, Jae-Hee
    • Journal of the Korean Society of Food Science and Nutrition
    • /
    • v.43 no.11
    • /
    • pp.1742-1748
    • /
    • 2014
  • This study investigated the quality characteristics of commercial rice flour (CRF) and rice flours prepared by different milling methods for sulgidduk. For particle distribution, dried rice flour after the 1st roll mill using a pin mill showed a particle size of greater than $710{\mu}m$, whereas a particle size less than $250{\mu}m$ accounted for 48% of whole rice flour. This proportion was higher than CRF after the 2nd step roll mill. Crude protein, lipid, and ash contents were significantly highest in 1st roll mill samples. For color, roll & pin made up of many small particles showed a high L value. CRF and roll & pin showed significantly higher starch damage and water-holding capacity, whereas pasting temperature, peak viscosity, and setback of RVA pasting characteristics were lower than 1st roll mill. When rice cakes were made from three kinds of rice flour, roll & pin was not significantly different compared to the CRF. However, rice cakes made with 1st roll milled rice flour showed rough crumb and crust. Rice cake made with roll & pin or CRF showed similar characteristics for texture. In the quantitative descriptive analysis, rice cake made with roll & pin showed better appearance, flavor, taste, texture, and overall acceptability than CRF and 1st roll mill. Therefore, rice flour prepared by roll & pin could be applied to sulgidduk with high quality.

User authentication using touch positions in a touch-screen interface (터치스크린을 이용한 터치 위치기반 사용자 인증)

  • Kim, Jin-Bok;Lee, Mun-Kyu
    • Journal of the Korea Institute of Information Security & Cryptology
    • /
    • v.21 no.1
    • /
    • pp.135-141
    • /
    • 2011
  • Recent advances in mobile devices and development of various mobile applications dealing with private information of users made user authentication in mobile devices a very important issue. This paper presents a new user authentication method based on touch screen interfaces. This method uses for authentication the PIN digits as well as the exact locations the user touches to input these digits. Our method is fully compatible with the regular PIN entry method which uses numeric keypads, and it provides better usability than the behavioral biometric schemes because its PIN registration process is much simpler. According to our experiments, our method guarantees EERs of 12.8%, 8.3%, and 9.3% for 4-digit PINs, 6-digit PINs, and 11-digit cell phone numbers, respectively, under the extremely conservative assumption that all users have the same PIN digits and cell phone numbers. Thus we can guarantee much higher performance in identification functionality by applying this result to a more practical situation where every user uses distinct PIN and sell phone number. Finally, our method is far more secure than the regular PIN entry method, which is verified by our experiments where attackers are required to recover a PIN after observing the PIN entry processes of the regular PIN and our method under the same level of security parameters.

Comparison of Performance Between a Circular Pin Fin and a Half Circular Pin Fin (원형 pin fin과 반원형 pin fin 사이의 성능 비교)

  • Kang, Hyung-Suk
    • Journal of Industrial Technology
    • /
    • v.36
    • /
    • pp.17-22
    • /
    • 2016
  • A circular pin fin (CPF) and a half circular pin fin (HCPF) are by using the one-dimensional analytic method. For these two fins, 90% of the maximum heat loss, Corresponding fin length for 90% of the maximum heat loss, fin effectiveness and fin efficiency are compared as functions of convection characteristic number and fin radius. Also, the ratio of heat loss from the HCPF to that from CPF listed with variation of fin length when the fin volumes are the same. One of the results shows that the efficiency of a CPF is larger than that of a HCPF while the effectiveness of a CPF is smaller than that of a HCPF when convection characteristic number, fin length and fin radius are the same.

  • PDF

Manufacturing of Micro Dotting Pin (DNA Chip 용 마이크로 핀에 관한 연구)

  • 신홍규;이영수;남권선;김병희
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
    • /
    • 2004.10a
    • /
    • pp.500-504
    • /
    • 2004
  • The bio-micro pin has been usually used for the biochemistry analysis. The manufacturing capability of the micro-pin and the their array with the effective and low-cost way is very important and it gives great economical benefits to developers. The micro-pin is composed of the sample channel for holding the liquid with the fixed volume, the flat tip which determines the printing quality and the pin head for preventing the rotation of the pin in the holder. In this study, we have manufactured newly designed micro-pins by the wire-EDM process with special jigs, and analyzed liquid holding and printing characteristics with respect to the variation of the shape and the tip size of the micro-pin.

  • PDF

Aging Effect on Femoral Stress Fracture Risk in Pin-hole after Computer-navigated Total Knee Arthroplasty (컴퓨터 네비게이션 슬관절 전치환술에서 노화에 따른 핀 홀에서의 대퇴골 골절 위험성)

  • Park, Hyung-Kyun;Park, Won-Man;Kim, Yoon-Hyuk
    • Proceedings of the KSME Conference
    • /
    • 2008.11a
    • /
    • pp.1518-1520
    • /
    • 2008
  • Recent clinical studies have shown that computer navigation for total knee arthroplasty (TKA) provides improved component alignment accuracy. However, femoral stress fracture after computernavigated TKA have been reported due to the pin hole and we hypothesized that osteoporosis would be one of the key factors in pin hole fracture after computer-navigated TKA. We investigated the von-Mises stress around the femoral pin-hole for different elastic modulli and ultimate stresses and four different pin penetration modes to understand the aging effect on femoral stress fracture risk after computer-navigated TKA by finite element analysis. In this study, aging effect was shown to increase the femoral stress fracture risk for all pin penetration modes. Especially, aging effect was shown dramatically in the transcortical pin penetration mode.

  • PDF

Inter-Pin Skew Compensation Scheme for 3.2-Gb/s/pin Parallel Interface

  • Lee, Jang-Woo;Kim, Hong-Jung;Nam, Young-Jin;Yoo, Chang-Sik
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.10 no.1
    • /
    • pp.45-48
    • /
    • 2010
  • An inter-pin skew compensation scheme is proposed, which minimizes the inter-pin skew of parallel interface induced by unequal trace length and loading of printed circuit board (PCB). The proposed scheme measures the inter-pin skew and compensates during power-up with simple hardware. The proposed scheme is applied to 3.2-Gb/s/pin DDR4 SDRAM and implemented in a 0.18 m CMOS process. The inter-pin skew is compensated in 324-cycles of 400-MHz clock and the skew is compensated to be less than 24-ps.