• Journal of Information Processing Systems
• /
• 제19권2호
• /
• pp.173-188
• /
• 2023

To improve the shock-resistance of piezoresistive high-g accelerometer, we propose a design of piezoresistive high-g accelerometer. The accelerometer employs special-shaped proof masses system with a cross gap. Four tiny sensing beams are bonded above the cross gap. The expression of the deformation, natural frequency and damping is deduced, and the structural parameters are optimized. The accelerometer structure is simulated and verified by finite element method (FEM) simulation. The results show that the range of the accelerometer can reach 200,000 g, the natural frequency is 453.6 kHz, and the cross-axis sensitivity of X-axis and Y-axis is 0.25% and 0.11%, respectively, which can apply to the measurement of high shock. Contrastively, the cross-axis sensitivity of X-axis and Y-axis is respectively, reduced by 93.2% and 96.9%. The sensitivity of our accelerometer is 0.88 μV/g. It is of great value for the application of piezoresistive high-g accelerometer with high shock-resistance.

• The Transactions of the Korean Institute of Electrical Engineers
• /
• 제43권6호
• /
• pp.1036-1038
• /
• 1994

In this paper, a silicon piezoresistive accelerometer is designed and fabricated using a silicon direct bonded wafer. The accelerometer consists of a seismic mass and four cantilevers, and is fabricated mainly by the anisotropic etching method using EPW as an etchant. The measured sensitivity and the resonant frequency are 0.02 mV/V.g and 3.4 kHz, respectively. The nonlinearity is less than $\pm$0.3% of the full scale of the output.

• Journal of the Korea Institute of Military Science and Technology
• /
• 제14권1호
• /
• pp.132-138
• /
• 2011

A micromachined silicon accelerometer capable of surviving and detecting very high accelerations(up to 200,000 times the gravitational acceleration) is necessary for a high impact accelerometer for earth-penetration weapons applications. We adopted as a reference model a piezoresistive type silicon micromachined high-shock accelerometer with a bonded hinge structure and performed structural analyses such as stress, modal, and transient dynamic responses and sensor sensitivity simulation for the selected device using piezoresistive-structural coupled-field analysis. In addition, structural optimization was introduced to improve the performances of the accelerometer against the initial design of the reference model. The design objective here was to maximize the sensor sensitivity subject to a set of design constraints on the impact endurance of the structure, dynamic characteristics, the fundamental frequency and the transverse sensitivities by changing the dimensions of the width, sensing beams, and hinges which have significant effects on the performances. Through the optimization, we could increase the sensor sensitivity by more than 70% from the initial value of $0.267{\mu}V/G$ satisfying all the imposed design constraints. The suggested simulation and optimization have been proved very successful to design high impact microaccelerometers and therefore can be easily applied to develop and improve other piezoresistive type sensors and actuators.

• Proceedings of the KIEE Conference
• /
• 대한전기학회 1993년도 정기총회 및 추계학술대회 논문집 학회본부
• /
• pp.192-194
• /
• 1993

In this paper, a silicon piezoresistive accelerometer of which the cantilevers have uniform thickness is designed and fabricated with SOI wafer. The accelerometer consists of a seismic mass and four cantilevers, and is fabricated mainly by the anisotropic etching method using EPW etchant. The fabrication processes are that of the frontside processes including the etching of the cantilevers and the doubleside alignment holes, the diffusion of the piezoresisters and patterning of the contact windows, and the metal connection process, and that of the backside processes including the etching of the shallow cavity and the seismic mass. Because of the uniformity of thickness, the performance of the accelerometer fabricated with SOI wafer is expected to be better than that of accelerometer fabricated by the time-controlled etching method.

• Proceedings of the KIEE Conference
• /
• 대한전기학회 1996년도 하계학술대회 논문집 C
• /
• pp.1994-1996
• /
• 1996

This paper presents the fabrication and testing of a polysilicon piezoresistive accelerometer with p+ silicon diaphragm by simple process such as two step photolithography for the RIE process to form the cantilevers and a deep anisotropic etch process for the complete fabrication of the accelerometer. The fabricated accelerometer consists of a seismic mass and four cantilevers on which polysilicon piezoresistors are formed. The measurement of the output signal from the bridge circuit of the fabricated accelerometer is carried out with the HP 3582A spectrum analyzer. The analysis of the experimental result is showed in terms of the sensitivity and the resonant frequency. At atmospheric condition, the measurement values of the sensitivity and the resonant frequency are $11\;{\mu}V/Vg$ and 475 Hz, respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• 제49권2호
• /
• pp.1-8
• /
• 2012

This paper presents the accelerometer which is a key component of TPMS(Tire Pressure Monitoring System). Generally a piezoresistive accelerometer has characteristics of lower cost, better linearity and better immunity about the environmnet noise than a capacitive one. Three types of piezoresistive accelerometers are degined and simulated using ANSYS program. The best one is a piezoresistive sensor which is supported by four beams located at the center of the edge of the mass after comparing the characteristics of resonant frequency of the three types. Considering the sensor size and a simulated maximum stress and maximum displacement, the length of beams is set as $200{\mu}m$. The size of a piezoresistive accelerometer is $3.0mm{\times}3.0mm{\times}0.4mm$. The sensor output is characterized by measuring the output characteristic depending on angle. As a result the offset voltage of the accelerometer is 43.2 mV and its sensitivity is $42.5{\mu}V/V/g$. The temperature bias drift is measured. The shock durability of the sensor is 1500g and the measuring range is 0 ~ 60 g.

• Journal of the Institute of Electronics and Information Engineers
• /
• 제52권2호
• /
• pp.83-88
• /
• 2015

In this paper, $2mm{\times}2mm$ sized piezoresistive accelerometers were designed and fabricated. Two kinds of accelerometers with different spring structure are designed. One is an accelerometer with 4 beam spring located in the center of the mass, the other is an accelerometer with 8 beam spring located in the vertices of the mass. The modal analysis of the accelerometers and the structural analysis were performed using ANSYS program. The former has the superior sensitivity characteristics of $21.38{\mu}V/V/g$ and the lower offset drift of $154.45ppm/^{\circ}C$ than the latter.

• Proceedings of the KIEE Conference
• /
• 대한전기학회 1994년도 추계학술대회 논문집 학회본부
• /
• pp.416-418
• /
• 1994

In this study, a silicon piezoresistive accelerometer is designed and fabricated using $p^+$ etch stop layer. The accelerometer consists of a seismic mass and tour cantilevers, and is fabricated mainly by the anisotropic etching method using EPW as an etchant. Eight piezoresistors are properly arranged and connected to make a bridge circuit so that acceleration in only one direction may be measured. The etch stop method is adequate to the mass-production and the precise thickness control of the diaphragms as well, whet compared with the electrochemecal etch stop method.

• Proceedings of the KIEE Conference
• /
• 대한전기학회 1998년도 하계학술대회 논문집 G
• /
• pp.2504-2508
• /
• 1998

In this paper, we propose the new detecting method for three dimensional piezoresistive silicon accelerometer. Furthermore the accelerometer is formed to have endurance for high temperature by perfect isolation of the piezoresistors using Silicon On Insulator(SOI) wafer. Sensor size are optimized with analytical formulae and extended with FEM simulation for the more detailed results. The accelerometer was fabricated by bulk micromachining techonology. We measured the temperature characteristics and the output characteristics, and the both characteristics were compared with the simulated results

• Proceedings of the KIEE Conference
• /
• 대한전기학회 1991년도 추계학술대회 논문집 학회본부
• /
• pp.274-277
• /
• 1991

A piezoresistive silicon resonator which can be used as an accelerometer is designed and fabricated using silicon micromachining techniques. The device consists of a seismic mass and four deflection beams in which eight piezoresistors are diffused. The structure is fabricated by EPW etching process. The piezoresistors are properly arranged and connected to make a bridge circuit, with which acceleration in only one direction can be measured. According to the experimental results, the first resonant frequency of this resonator is above 15 kHz, and this transducer has a sensitivity of 5.56 ${\mu}V/Vg$.