• 대한기계학회논문집A
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• 제24권4호
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• pp.848-857
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• 2000

A pick-and-place operation in 3-dimensional environment is basic operation for human and multi-purpose manipulators. However, there may be a difficult problem for such manipulators. Especially, if the object cannot be moved with a single grasp, regrasping, which can be a time-consuming process, should be carried out. Regrasping, given initial and final pose of the target object, is a construction of sequential transition of object poses that are compatible with two poses in the point of grasp configuration. This paper presents a novel approach for solving regrasp problem. The approach consists of a preprocessing and a planning stage. Preprocessing, which is done only once for a given robot, generates a look-up table which has information of kinematically feasible task space of end-effector through all the workspace. Then, using the table planning automatically determines possible intermediate location, pose and regrasp sequence leading from the pick-up to put-down grasp. Experiments show that the presented is complete in the total workspace. The regrasp planner was combined with existing path.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• 무역상무연구
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• 제66권
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• pp.75-94
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• 2015

The aim of this study is to examine the obligations of delivery of the goods focusing on the methods of delivery under the Incoterms 2010, comparing with CISG. The Incoterms 2010 provides various methods of delivery of the goods under the each rule(11 rules). And it is a little confusing for the parties of the contract of sales. This study reviewed specific methods of delivery of the goods with the view of practitioner. The purpose of Incoterms is to avoid misunderstanding of the contract of sales and to promote the international transactions. The uncertainties of the Incoterms 2010 shall cause disputes between the parties. Especially, when vehicles are used to pick up and deliver the goods, which party is responsible for the loading and unloading the goods. Under the D-term, which party is responsible for unloading the goods from the vehicle reached at the named place of destination is a little confusing. This study suggest some ideas on the specific methods of delivery to mitigate uncertainties and accept current practices at the field. Firstly, under the EXW rule, the seller must deliver the goods on the arriving means of transport at the seller's premises. Secondly, under the FCA rule, the seller must deliver the goods unloaded at the other place except seller's premises. Thirdly, under the CPT, CIP rules, the seller must deliver the goods unloaded irrespective of the mode of transport at the place of destination. Fourthly, the FOB, CFR, CIF rules must adapt the container transport practice.

• 제어로봇시스템학회논문지
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• 제6권8호
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• pp.697-702
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• 2000

The paper considers the problem of improving the productivity of surface mounting in the printed circuit board(PCB) assembly line. This problem is generally divided into two problems ; real assignment problem and pick-and -place sequencing problem which are known to have no polynomial time algorithms. In the last ten years algorithm designers have been trying to solve them separately. However they need to be solved jointly because they are highly interrelated. This paper proposes an evolutionary algorithm which can consider the two problems jointly and thus yield a better solution. In order to evaluate the proposed algorithm computer simulation is performed on real-life surface mounting machines. The proposed algorithm is expected to reduce the assembly time of surface mounting machines and thus improve the productivity.

• 로봇학회논문지
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• 제6권1호
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• pp.78-85
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• 2011

This article investigates kinematic characteristics of a Sch$\ddot{o}$nflies motion generator which represents a mechanism having translational three Degree-of-Freedom (DOF) and rotational one-DOF motion about a fixed axis. The mechanism consists of the base plate and the moving plate, and four identical limbs connecting them. Each limb employs two revolute joints (RR), one parallelogram (Pa), and two revolute joints (RR) from the base plate to the moving plate. The mechanism is driven by four actuators which are placed on the base plate to minimize dynamic loads. It is shown through simulations that the mechanism can be designed to secure large dexterous workspace and thus has very high potential for actual applications such as haptic devices and high-speed requiring tasks such as pick-and-place operations, riveting, screwing tasks, etc.

• 반도체디스플레이기술학회지
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• 제12권1호
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• pp.53-59
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• 2013

Chip mounter which is used to pick chips from the pre-specified position and place them on the target location of PCB is an essential device in semiconductor and LCD industries. Quick and high precision positioning is the key technology needed to increase productivity of chip mounters. As increasing acceleration and deceleration of placing motion, structural vibration induced from inertial reactive force and flexibility of mounter structure becomes a serious problem degrading positioning accuracy. Motivated from these, this paper proposed a new control design algorithm which combines a mounter structure acceleration feedforward compensation and an extended sliding mode control for fine positioning and suppression of structural vibration, simultaneously. The feasibility of the proposed control design was verified along with some simulation results.

• Journal of Welding and Joining
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• 제29권3호
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• pp.19-26
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• 2011

본 논문에서는 액체의 표면장력을 이용하여 복수의 KGD 들을 웨이퍼 상태에서 일괄접합함으로써, 높은 수율의 삼차원적층칩을 빠른 생산성으로 제작할 수 있는, 고속 고정밀 접합기술인 자기조직화정합 (Selfassembly) 기술에 대해 소개를 하였다. 본 연구실에서 개발한 self-assembly 기술을 적용하여 5mm 각(角) 크기의 칩 500개를 1초 이내에 평균 $0.5{\mu}m$ 정도의 높은 정밀도로 8인치 웨이퍼상에 일괄접합시키는데 성공하였다. Self-assembly 기술에 의한 삼차원 칩 적층방식은, 기존의 pick-and-place 적층방식에서 높은 정밀도의 접합특성을 확보하는데 필요한 공정시간을 혁신적으로 단축하는 것이 가능하고, 웨이퍼 레벨에서 복수의 KGD 들을 일괄접합하는 것이 가능하므로, 향후 TSV 기술의 양산화를 실현하는데 적합한 고속 고정밀 접합 기술로서 기대가 크다. 현재 본 연구실에서는 두께가 $50{\mu}m$ 이하의 얇은 LSI 칩 및 메탈범프가 형성된 LSI 칩 등을 이용하여, self-assembly 기술에 의한 삼차원 적층형 집적회로 구현을 위한 접합기술을 개발 중에 있다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.733-737
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• 1996

This paper presents a method to measure tile position and orientation of a prismatic polyhedral object (of unknown width, length, height, and number of vertices) using machine vision. The width, length, and origin of workplace where an object is lying are defined as Preliminary operation. The edges of an object are detected from captured image using least sum of square error. The information of an object is determined from the geometric relationships between edges. As an user interface, a versatile image processing program is developed in several modules, and renders a very useful 3D measurement at a limited constraints when adopted in automation of production process. The flexibility of camera position from the algorithm developrf can be used for automated pick and place operations and feeding workpiece u: ;ing assembly robot.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1994년도 추계학술대회 논문집
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• pp.543-548
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• 1994

This is the paper on the development of assemnly automation and visual inspection system for smart card reader connector. The automation consists of 3 main process injection, assembly and inspection. During the injection, the main pin of a reel. transferred under uniform tension, is cut with an injection interval and positioned precisely to an injection mold by roll feeder after injection. The main base is stacked to a magazine for main pin's exact positionning to a mold . For last effective production, The turn table and pick & place are driver with gears and came by a single monter. We developed the small parts handling technigue for stable supply of micro ist pin and 2nd pin and could determine the orientation and position of those pins. For reliable inspection, We used the vision system which examins the guality of arranged pins with a CCD camera. The connector models which can be manufactured with this system are 8 pin and 10 pin type. The user can select the connector model for production and adjust the torerable error range during the inspection of arranged pins.

• 한국정밀공학회지
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• 제16권5호통권98호
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• pp.124-131
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• 1999

DVD(Digital Versatile Disk) is the data storage media devised to make high storage density and high speed data input/output possible. For example, a whole length movie can be stored in a disk as large as a CD(Compact Disk). Therefore higher rotational speed and better accuracy in optical pick-up are required compared with the existing optical storage device. Without these operational functional requirements being satisfied DVD will lose its place as the high capacity storage device. This paper evaluated whether the currently developed DVD satisfies the requirements and provides improved methods with the Axiomatic Approach which is superb in evaluating and designing newly concepted designs.