• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.925-928
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• 2004

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. This paper was carried out some experiments and verifications of mechanism on FIB-CVD using SMI8800 made by Seiko. FIB-CVD has in fact proved to be commercially useful for repair processes because the beam can be focused down to 0.05$\mu\textrm{m}$ dimensions and below and because the same tool can be used to sputter off material with sub-micrometer precision simply by turning off the gas ambient. Recently the chemical vapour deposition induced ion beam has been required more deposition rate and accurate pattern because of trying to manufacture many micro and nano parts. Therefore this paper suggested the optimization parameters and discussed some mechanism of chemical vapour deposition induced ion beam on FIB-CVD for simple pattern.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.871-874
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• 2004

Fabrication of a high-resolution shadow mask, or called nanostencil, is presented. This high-resolution shadowmask is fabricated by a combination of MEMS processes and focused ion beam (FIB) milling. 500 nm thick and 2x2 mm large membranes are made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. Subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to high resolution of FIB milling process, nanoscale apertures down to 70 nm could be made into the membrane.

• Proceedings of the KAIS Fall Conference
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• 2002.05a
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• pp.106-108
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• 2002

반도체 physical layout design rule이 작아짐에 따라 Proximity effect와 overlay가 Pattern 구현에 크게 영향을 미치고 있다. Metal layer와 contact의 부족한 overlay margin으로 overlay 불량이 발생하고, 감소한 space margin으로 인해 bridge와 같은 문제가 나타난다. 따라서, resolution을 향상시키고, 최소한의 overlay margin을 확보함으로써 미세 pattern의 구현을 가능하게 한다. 이를 위해 OPC와 attPSM 같은 분해능향상기술이 사용된다. 그러나 attPSM의 사용은 원하지 않는 pattern이 생성되는 sidelobe와 같은 문제가 발생한다. 따라서 serial image simulation올 통해 추출한 rule을 rule-based correction에 적용하여 sidelobe현상을 방지한다. 그리고 overlay margin 부족으로 나타나는 문제는 metal layer와 contact overlap되는 영역의 line edge를 확장하고, rule checking을 통해 최소한의 space margin을 확보하여 해결한다 따라서 overlay error를 rule-based correction을 사용하여 효과적으로 방지한다.

• Proceedings of the Korea Society for Simulation Conference
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• 2001.10a
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• pp.269-273
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• 2001

Semiconductor wafer fabrication is a business of high capital investment and fast changing nature. To be competitive, the production in a fab needs to be effectively planned and scheduled starting from the ramping up phase, so that the business goals such as on-time delivery, high output volume and effective use of capital intensive equipment can be achieved. In this paper, we propose Stand Alone layout and In-Line layout are analyzed and compared while varying number of device variable changes. The comparison is performed through simulation using ProSys; a window 98 based discrete system simulation software, as a tool for comparing performance of two proposed layouts. The comparison demonstrates that when the number of device variable change is small, In-Line layout is more efficient in terms of production quantity. However, as the number of device variable change is more than 14 titles, Stand Alone layout prevails over In-Line layout.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1629-1632
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• 2006

A novel column spacer with concaved top surface has been made through conventional photolithography process. The mechanical characteristics of this spacer were also investigated by using load-unload cycle test. According to the experimental results, the deformation ratio of this new designed spacer is larger than that of conventional column spacers about two times in the lower loading stage. At the higher loading stage there is no obviously difference in deformation ratio between the new designed spacer and the conventional spacer.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1546-1548
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• 1998

Dual mode ring resonators(DMRR) have been fabricated using laser ablated $YBa_2Cu_3O_{7-x}$ superconducting thin films. The transition temperature of YBCO thin films were 85 - 88 K and the film thicknesses were about 5,000 $\AA$. Dual mode ring resonators were patterned by standard photolithography process and wet-etching. Then two-layer metal thin films (Ti/Ag) have been deposited for the ground plane on the back side of substrate by e-beam and thermal evaporation. The input/output feedline angles of each resonator were $60^{\circ}$, $100^{\circ}$, $180^{\circ}$. A network analyzer was used for testing the performance of the resonators in the frequency range of 6-13 GHz at 77 K.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.1
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• pp.108-113
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• 2011

There are a lot of PDP TV for a plasma discharge pulse voltage generated by the use of electromagnetic waves. EMI mesh film is near Infrared ray caused by malfunction of the remote control intended to prevent this phenomenon. In this study, the formation of fine pattern by making the mold is imprinted on the film sheet. EMI mesh film has been granted by filling in the conductive material region imprinted with electroforming in the manufacture of resistance. The fine patterns fabricated with electroforming facility thickness of homogenization process technology were established to optimize the working conditions.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.934-937
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• 2001

It is well-known that the micro fabrication technology of micro parts are the high energy beam or silicon-based micro machining method such as LIGA Process, Laser machining, photolithography and etching technology. But, for fabricating complex 3-D structure it is better to use mechanical machining. This machining method by the mechanical machine tool with nanometer accuracy is getting attention in some field-especially micro optics machining such as grating, holographic lens, micro lens array, fresnel lens, encoder disk etc.. In this study, we survey the micro fabrication by mechanical cutting method and set up the mechanical micro machining system. And we carried out micro cutting experiments for micro parts with v-shape groove.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.3
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• pp.443-451
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• 2001

This paper addresses an on-line scheduling method for track systems in semiconductor fabrication. A track system is a clustered equipment performing photolithography process in semiconductor fabrication. Trends toward high automation and flexibility in the track systems accelerate the necessity of the intelligent controller that can guarantee reliability and optimize productivity of the track systems. This paper proposes an-efficient on-line scheduling method that can avoid deadlock inherent to track systems and optimize the productivity. We employ two procedures for the on-line scheduling. First, we define potential deadlock set to apply deadlock avoidance policy efficiently. After introducing the potential deadlock set, we propose a deadlock avoidance policy using an on-line Gantt chart, which can generate optimal near-optimal schedule without deadlock. The proposed on-line scheduling method is shown to be efficient in handling deadlock inherent to the track systems through simulation.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.245-250
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• 2011

A high-resolution shadow mask, a nanostencil, is widely used for high resolution lithography. This high-resolution shadowmask is often fabricated by a combination of MEMS processes and focused ion beam (FIB) milling. In this study, FIB milling on 500-nm-thin SiN membrane was tested and characterized. 500 nm thick and $2{\times}2$ mm large membranes were made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. A subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to the high resolution of the FIB milling process, nanoscale apertures down to 60 nm could be made into the membrane. The nanostencil could be used for nanoscale patterning by local deposition through the apertures.