• Title/Summary/Keyword: Phenol-formaldehyde resin

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Preliminary Study of Rapeseed Flour-based Wood Adhesives for Making Wood Flooring

  • Yang, In;Ahn, Sye-Hee;Choi, In-Gyu;Han, Gyu-Seong;Oh, Sei-Chang
    • Journal of the Korean Wood Science and Technology
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    • v.39 no.5
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    • pp.451-458
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    • 2011
  • Adhesives derived from renewable resources allow wood panel producers to make lower cost alternatives to formaldehyde-based adhesive resins. Among them, adhesive components extracted from industrial by-products or wastes are the most important research fields in the efficient utilization of waste and cost reduction. In our study, the rapeseed flour, which is a by product from the production of biodiesel extracted from rapeseed, was introduced to develop alternative adhesives for the production of wood flooring. The rapeseed flour was hydrolyzed with 1% sodium hydroxide solution and PF prepolymers were prepared with 3-molar ratios, 1.8, 2.1 and 2.4. The linear fracture mechanics was introduced to evaluate the glue bond quality in wood flooring composed of fancy-veneered and plywood, and the formaldehyde emission and adhesive penetration were also investigated. The formaldehyde emissions of wood flooring met the requirement of the standard of $SE_0$ specified in the KS standard. The rapeseed flour adhesive penetrated sufficiently into the vessel elements and lumens in fancy veneer and plywood and gave strong bond quality to the wood flooring. The fracture mechanics was introduced to evaluate the adhesive joint between fancy veneer and plywood. The critical stress intensity factor ($K_{IC}$) of boliva overlayed wood flooring was increased with increasing molar ratio and this was the same tendency in oak overlayed wood flooring. From the results, the formulated adhesives were efficiently used to bond fancy veneer onto the plywood to make wood flooring and showed a potential to be used as a component of environmentally friendly adhesive resin systems for production of flooring.

The Effects of the Tempered Materials on the Thermal Runaway Characteristics in the Resol Resin Synthesis Reaction (레졸수지 합성반응에서 온도조절 물질이 열폭주 특성에 미치는 영향)

  • Lee, Jung-Suk;Lee, Keun-Won
    • Journal of the Korean Institute of Gas
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    • v.18 no.4
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    • pp.27-34
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    • 2014
  • In this study, we evaluated an effect of the tempered materials on the thermal runaway characteristics in the resol resin synthesis reaction using the adiabatic calorimetry of vent sizing package 2(VSP2). The kinetic parameters, such as an activation energy and heat of reaction, were estimated using the test results. As the results, the instantaneous characteristics to express the intensity of runaway reaction decreased at the low solid content. However, the sudden loss of the tempered materials triggered the second runaway reaction rapidly. In this condition, the heat of reaction and the activation energy of phenol and p-formaldehyde were about 157 kJ/mol and 60 kJ/mol, respectively.

A Study on the Synthesis of Acrylic Phenol Resins and Their Properties as a Paint (아크릴계 페놀수지 합성과 이를 이용한 도료의 물성연구)

  • Hwang, Sue In;Kim, Young Jin;Kim, Dong Kwon
    • Applied Chemistry for Engineering
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    • v.24 no.2
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    • pp.171-176
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    • 2013
  • The need of volatile organic compound (VOC) free coating material has been increased to solve environmental problems such as the global warming. Nowadays, about 70~80% of coating materials used in the worldwide are a liquid type. Therefore, the development of non-solvent coating material that can minimize VOCs emissions is necessary to solve the global warming problem. In this study, acrylic monomers were added to develop non-solvent paints in order to improve disadvantages of the poor adhesion of a conventional phenolic resin caused by acidification. As a result, the blend resins of 2.818 Mpa phenol- formaldehyde resin/poly methyl methacrylate (PE/PMMA) has the best properties and performances for the adhesives.

Role of F/P Ratio on Curing Behavior for Phenolic Resol and Novolac Resins by FT-IR (FT-IR 분석에 의한 레졸과 노블락 페놀 수지의 경화거동에 미치는 F/P 몰비)

  • Lee, Young-Kyu;Kim, Hyun-Joong
    • Journal of Adhesion and Interface
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    • v.2 no.3
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    • pp.16-24
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    • 2001
  • The curing behavior of a phenolic resin (F/p: 1.3, 1.9, 2.5 for resol resin, F/P: 0.5, 0.7, 0.9 for novolac resin) has been studied by FT-IR spectroscopy. In this study is to synthesis of resol and novolac type phenolic resin with different F/P molar ratios and to compare the level of cure at different curing temperature conditions ($130^{\circ}C$, $160^{\circ}C$, $180^{\circ}C$ for resol resin, $160^{\circ}C$, $170^{\circ}C$, $180^{\circ}C$ for novolac resin) for 3, 5, 7, 10, 20, and 60 (min.), respectively. The conversion (${\alpha}$) was determined by the ratio of the peak area with time to the peak area of non-baked phenolic QH ($3300cm^{-1}$) at spectra. It is concluded that the initial curing rate of resol and novolac resin was increased as the molar ratio of formaldehyde/phenol increased and as the curing temperature of resin increased. According to the analysis was by the homogenous first-order model, the initial curing rate of resol and novolac resin was increased as the molar ratio of formaIdehyde/phenol increased at specific curing temperature.

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Studies on the Extending of Plywood Adhesives used Foliage Powder (낙엽분말(落葉粉末)을 이용(利用)한 합판용(合板用) 접착제(接着劑)의 증량(增量)에 관(關)한 연구(硏究))

  • Kim, Jong-Man;Bark, Jong-Yeol;Lee, Phil-Woo
    • Journal of Korean Society of Forest Science
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    • v.42 no.1
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    • pp.83-100
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    • 1979
  • It was planned and performed to study the possibility on the use of inexpensive and easily acquirable foliage powder, which processed by pulverizing after dried, instead of imported expensive wheat flour for the extending of plywood adhesives. Pine leaves of softwood trees, Poplar, Oak and Sycamore leaves of broad leaved species were selected and harvested to pulverize into the minute foliage powder. The harvested foliages from each selected species were pulverized into 40 mesh particles after dried at $100{\sim}105^{\circ}C$ condition during 24 hours in drying oven. To compare the extending effect of plywood adhesives with these foliage powders 100 mesh wheat flour using at current plywood industry was also prepared. Foliage powder and wheat flour were extended into 10, 20, 30, 50 and 100% to the urea and phenol formaldehyde resin. After plywoods were processed by the above extending method shear strength of extended plywoods were analyzed and discussed. The results obtained at this study are as follows: 1) Among 10% extensions of urea formaldehyde resin plywood, dry shear strength of plywood extended by wheat flours was the highest and that of non-extended plywood the next. Plywood extended with foliage powder showed the lowest dry shear strength. The order of dry shear strength of plywoods extended by foliage powder was that of Oak foliage powder extension, the best, that of Sycamore, that of Pine, and that of Poplar. 2) Among 20% extensions of urea formaldehyde resin plywood, plywood extended by wheat flour showed the highest dry shear strength, and the next was plywood by Poplar foliage powder. All these two showed higher dry shear strength than non-extension plywoods. Except Poplar, dry shear strength of foliage powder extension plywoods was bad, but the order of dry shear strength of plywoods extended by foliage powder was Pine, Poplar and Oak. 3) In the case of 30% extensions of urea formaldehyde resin plywood, dry shear strength of wheat flour extension was the highest and non-extension the next. Dry shear strength of foliage powder extension plywoods was poor with a rapid falling-off in strength. 4) Among 50% and 100% extensions of urea formaldehyde resin plywood, only wheat flour showed excellent dry shear strength. In the case of foliage powder extension, low dry shear strength showed at the 50% extension of Pine and Poplar, and plywoods of 50% extension of Oak foliage powder delaminated without measured strength. All plywoods of 100% foliage powder extension delaminated, and then shear strength were not measured. 5) Among wet shear strength of 10% extensions of urea formaldehyde resin plywood, wheat flour extension was the highest as in the case of dry shear strength, and non-extension plywood the next. Except Poplar foliage extension, all foliage powder extension plywoods showed low shear strength. 6) Wet shear strength of plywoods of 20% extension lowered in order of non-extension plywood, plywood of wheat flour extension and plywood of foliage powder extension, but other plywoods of foliage powder extension except plywoods of Poplar and Oak foliage powder extension delaminated. 7) Wet shear strength of 30% or more extension of urea formadehyde resin plywood were weakly measured only at 30% and 50% extension of wheat flour, and wet shear strength of plywoods extended by foliage powder were not measured because of delaminating. 8) Dry shear strength of phenol formaldehyde plywoods extended by 10% wheat flour was the best, and shear strength of plywoods extended by foliage powder were low, but the order was Oak, Poplar, and Pine. Plywood of Sycamore foliage powder extension delaminated. 9) In the case of 20% extensions of phenol formaldehyde resin, dry shear strength of plywood extended by wheat flour was the best, but plywood of Pine foliage powder extension the next, and the next order was Oak and Poplar foliage powder. Plywood of Sycamore foliage powder extension delaminated. 10) Among dry shear strength of 30% extensions of phenol formaldehyde plywood, that of Pine foliage powder extension was on the rise and more excellent than plywood of wheat flour extension, but Poplar and Oak showed the tendency of decreasing than the case of 20% extension. Plywood of Sycamore foliage powder extension delaminated. 11) While dry shear strength of 50% and 100% extension plywoods were excellent in the case of Pine foliage powder and wheat flour extension, that of hardwood such as Poplar, Oak, and Sycamore foliage powder extension were not measured because of delaminating. 12) As a filler the foliage powder extension of urea formaldehyde resin is possible up to 20% with Poplar foliage powder. And also as an extender for phenol formaldehyde resin, Pine foliage powder can be added up to the same amount as that in the case of wheat flour.

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Effect of Adhesives and Finger Pitches on Bending Creep Performances of Finger-Jointed Woods

  • Park, Han-Min;Oh, Seong-Won;Byeon, Hee-Seop
    • Journal of the Korean Wood Science and Technology
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    • v.33 no.5 s.133
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    • pp.57-65
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    • 2005
  • Following our previous reports for finger-jointed woods with various finger profiles studied for the efficient use of small diameter logs and woods containing various defects, twelve types of finger-jointed woods glued with three kinds of adhesives and with two sizes of finger pitches were made with sitka spruce and red pine. The effects of the adhesives and finger pitches on bending creep performances of finger-jointed woods were investigated. The shape of creep curves differed among the used adhesives and finger pitches of finger-jointed woods for both tested species. Their creep curves showed a linear behavior beyond about one hour, and the N values fitted to power law increased with increasing finger pitches. The initial deformation increased with increasing finger pitches, regardless of the tested species and kinds of adhesives, whereas the effect of finger pitches on the creep deformation was not clear. For finger-jointed woods glued with polyvinyl acetate (PVAc) resin, creep failure occurred in 106 hours after the load was applied. And the difference of the creep compliance between finger-jointed woods glued with resorcinol-phenol formaldehyde (RPF) resin and aqueous vinyl urethane (AVU) resin was small. The ratios for creep performances of finger-jointed woods glued with RPF resin and AVU resin versus solid wood were higher in creep deformation than initial deformation for both species, and the difference between both adhesives was not found. The relative creep decreased with increasing finger pitches, and the marked differences was not found between RPF resin and AVU resin.

Examination of Newsprint Residue as a Plywood Adhesive Filler (합판의 충전제로서 신문용지 잔사의 조사)

  • Oh, Yong-Sung
    • Journal of the Korean Wood Science and Technology
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    • v.24 no.2
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    • pp.42-45
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    • 1996
  • A residue from the newsprint waste was investigated as a filler in adhesive for bonding southern pine plywood. The residue was prepared by drying the wet residue to 8% moisture content and grinding the dry material using a laboratory Wiley mitt with a 75-${\mu}m$(200-mesh) screen. The residue was compared to a commercial filler commonly used in structural plywood adhesives. A total of 48 three-ply panels. 12.7mm nominal thickness and 0.3 by 0.3 m in size, were fabricated at two press times(4 and 5 min) and three assembly times(20, 40 and 60 min). Evaluations of the residue were carried out by performance tension shear tests after two 4-hour boil accelerated aging tests on plywood. The test results included tension shear strength and estimated wood failure values. All plywood made with the residue filler were comparable to the control-bonded plywood. These results indicate that residue from the newsprint waste streams would be suitable as filler for plywood adhesives.

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Studies on Nanostructured Amorphous Carbon by X-ray Diffraction and Small Angle X-ray Scattering

  • Dasgupta, K.;Krishna, P.S.R.;Chitra, R.;Sathiyamoorth, D.
    • Carbon letters
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    • v.4 no.1
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    • pp.10-13
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    • 2003
  • The structural studies of amorphous isotropic carbon prepared from pyrolysis of phenol formaldehyde resin have been carried out using X-ray diffraction. X-ray diffraction from as prepared sample at $1000^{\circ}C$ and a sample treated at $1900^{\circ}C$ revealed that both are amorphous even though there are small differences in short range order. It is found that both are graphite like carbon (GLC) with predominantly $sp^2$ hybridization. Small angle X-ray scattering results show that as prepared sample mainly consists of thin two dimensional platelets of graphitic carbon whereas they grow in thickness to become three dimensional materials of nano dimensions.

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Synthesis and Photocharacteristics of Trihydric Phenol Photoresist (Trihydric Phenol계 Photoresist의 합성과 그 감광 특성)

  • Hong, Eui-Suk;Ko, Jae-Yong;Park, Hong-Soo
    • Journal of the Korean Applied Science and Technology
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    • v.13 no.1
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    • pp.47-54
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    • 1996
  • Cinnamoyl ester(PGEFC) of poly(phloroglucinol-formaldehyde) glycidyl ether which has photosensitive functional group was prepared to apply to photoresist. Photosensitivity of PGEFC was estimated by the solubility difference in organic solvent before and after exposure to light. The yield of residual film was calculated by immersing the sample-coated quartz plates in the solvent which was used in coating. The yield of the residual film which was closely related to the sensitivity of the film, was affected by the degree of polymerization of the backbone resin, sensitizers and their concentration. The sensitivity was depended upon the degree of polymerization. Most of effective sensitizer for PGEFC among the sensitizers was 2, 6-dichloro-4-nitroaniline.

Characteristics of Low Density Fiberboards Bonded with Different Adhesives for Thermal Insulation (II) - Formaldehyde·Total Volatile Organic Compounds Emission Properties and Combustion Shapes - (다양한 접착제로 제조한 단열재용 저밀도섬유판의 특성(II) - 폼알데하이드·총휘발성유기화합물 방출 특성 및 연소 형상 -)

  • Jang, Jae-Hyuk;Lee, Min;Kang, Eun-Chang;Lee, Sang-Min
    • Journal of the Korean Wood Science and Technology
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    • v.45 no.5
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    • pp.580-587
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    • 2017
  • Woodfiber insulation board can be considered as a one of the key material for low energy consumption, comfortable and safety construction of residential space because of its eco-friendly and high thermal insulation performance. This study was carried out to investigate the formaldehyde (HCHO) total volatile organic compounds (TVOC) emission properties and combustion shapes by flame test of low density fiberboards (LDFs) prepared with different adhesives. HCHO TVOC emission and combustion properties of LDFs prepared by melamine urea formaldehyde (MUF), phenol formaldehyde (PF), emulsified methylene diphenyl diisocyanate (eMDI) and latex resin adhesives were measured by desiccator method, 20 L chamber method, and flame test, respectively. As results, LDFs manufactured by MUF, eMDI and latex resin adhesives satisfied the Super $E_0$ grade of HCHO emission performance except PF resin. Furthermore, TVOC emission of all LDFs were satisfied the Korean indoor air quality standard (below $400{\mu}g/m^2{\cdot}h$). Especially, LDF with eMDI resin adhesive showed the lowest HCHO and TVOC emissivity, that $0.14mg/{\ell}$, $12{\mu}g/m^2{\cdot}h$, respectively. However, eMDI emitted the small amount ($3{\mu}g/m^2{\cdot}h$) of toluene in VOC components. In the flame test, LDF with MUF resin adhesives showed the most favorable shape after flame test compare to LDFs prepared other adhesives. Based on HCHO and TVOC emission, and combustion shapes, MUF resin adhesive may be recommended to prepare LDF for insulation purpose.