• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2005.11a
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• pp.429-432
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• 2005

This paper investigates how the PCB power-bus structure's characteristics are influenced by the loading of decoupling capacitors that are placed close to vias, on purpose or not. It is worthwhile to see the correlated effects of the aforementioned lumped elements in that when they inevitably share one DC power-bus they will result in positive or negative changes in the PCB EMC design. The EM fields and impedance profiles are rigously calculated on the PCB power-bus cases loaded with the above components and their effects will be given to bring better PCB EMC countermeasures.

• Journal of Korean Society for Atmospheric Environment
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• v.1 no.1
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• pp.9-15
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• 1985

For the purpose of obtaining the index that represents the contaminated status due to polychlorinated biphenyls (PCB) in the human body, the authors investigated the contents of PCB in the plasma of 183 subjects who were not exposured to the massive amount of PCB occupationaly in the past. The obtained results were as follows; 1. The mean contents of PCB in plasma were 3.35 $\pm$ 1.48 ppb in male and 3.04 $\pm$ 1.06 ppb in female. $Cl_4$ and $Cl_3$ were the main isomers in both sexes. 2. The distribution of total-PCB by the age group was showed increasing tendency with the age in both sexes. 3. The tendency of freqyency distribution of total-PCB level were skewed to the higher level in malo and skewed to the lower level in female. 4. There was satistically significant interrelationship between age and total-PCB in plasma in both sexes.

• Journal of the Korean Institute of Navigation
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• v.23 no.2
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• pp.61-66
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• 1999

It is being more and more difficult to suppress emissions from electronic products using PCB(Printed Circuit Board) to the limit. Therefore, the exact evaluation of the emission from PCB has been more important to reduce the required time and the cost at the design phase of the products, especially on board ship's equipments. This research has evaluated the emission radiated from PCB based on the theoretical approach of SDA(Spectral Domain Analysis), which is available to analyze microwave stripline, coplanar line, patch antenna, etc. According to the theoretical results, it has been clearly shown that the emission radiated from PCB is reduced as the thickness of PCB is thinner, the permittivity of PCB is higher, the length of stripline is shorter, and the frequency is lower.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.209-213
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• 2008

In this work, we have proposed a method for calculating the residual stress developed during the PCB thermo-compression bonding precess. Residual stress is the most important factor that causes PCB warpage in accordance with the pattern design. In this work, a single-layed double-sided PCB, which is comprised of the dielectric (FR-4) substrate in the middle and copper cladding on the both top and bottom sides, is considered. A reference temperature, where all stress is free, is calculated by comparing the calculated and measured warapge of a PCB of which copper cladding of the top side is removed. Then, the reesidual stress values is calculated for the double-sided PCB.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.1
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• pp.111-116
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• 2001

A practical scheme to reduce failure of the PCB(Printed Circuit Board) of a monitor is introduced using deformed mode shape under mechanical shock. When the monitor is given critical shock loads, cracks are commonly initiated at the tip of a hole on the PCB. Accordingly, a deformed mode shape of the PCB is obtained using a FEM code to define a weak point on the PCB under mechanical shock, and then the position and direction of the hole is determined to prevent the failure at the critical mode shape. Also, the stress intensity factor around the weak point on the PCB is calculated to check the possibility of fracture by normal tensile stress. In conclusion, present research is useful to assist the practical design of components-layout on the PCB.

• Journal of Korea Multimedia Society
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• v.24 no.8
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• pp.988-999
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• 2021

AOI (Automatic Optical Inspection) of PCB (Printed Circuit Board) is a very important step to guarantee the product performance. The process of registering components called teaching mode is first perform, and AOI is then carried out in a testing mode that checks defects, such as recognizing and comparing the component mounted on the PCB to the stored components. Since most of registration of the components on the PCB is done manually, it takes a lot of time and there are many problems caused by mistakes or misjudgement. In this paper, A components classifier is proposed using YOLO (You Only Look Once) v2's object detection model that can automatically register components in teaching modes to reduce dramatically time and mistakes. The network of YOLO is modified to classify small objects, and the number of anchor boxes was increased from 9 to 15 to classify various types and sizes. Experimental results show that the proposed method has a good performance with 99.86% accuracy.

• Resources Recycling
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• v.24 no.1
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• pp.66-72
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• 2015

Various waste PCBs arose during disassembly of LCD TVs and monitors in which they originally functioned for transmission of imaging signal, power supply, and imaging control. In those functional PCBs, gold and copper are contained at far more acceptable level, exceeding mining grade ores. Those valuable metals and their contents widely vary with functionality and end use of PCBs. Therefore, compositional analysis of individual waste PCBs from disassembled LCD TVs and monitors were performed in the present study to classify them into three categories: high gold yield and low gold yield PCBs and those without gold contents. Besides, additional chemical analysis was made to reveal gold and copper contents in the waste PCBs arising from actual disassembly/separation of end-of-life LCD TVs and monitors.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.3
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• pp.732-737
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• 2016

Using the pyrolyzed carbon black (PCB) from waste tires, the performance of 13 mm dense-graded hot mix asphalt was evaluated. The Marshall mix design was carried out and the measured optimal asphalt content was 5.8%. The impact resonant test was conducted to obtain the elastic modulus and damping ratio of the hot mix asphalt. The elastic modulus of HMA increased with increasing amount of PCB. On the other hand, there was no significant change in the damping ratio. The Marshall mix design, indirect tensile test, permanent deformation test, and program analysis were carried out. The strength ratio of the PCB modified asphalt mixtures was within 10%. More 10% of PCB was not good for the permanent deformation of hot mix asphalt. From the pavement design program, the use of 5% PCB in hot mix asphalt showed a decrease in the top-down crack, bottom-up crack, and permanent deformation. Judging from the limited test and analysis, the use of 5% PCB is good for enhancing the pavement performance.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.11 s.353
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• pp.8-13
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• 2006

Recent RF SAW filters are made using a HTCC package with a CSP(chip scale Package) technology. This paper describes a development of a new $1.4{\times}1.1\;and\;2.0{\times}1.4mm$ RF SAW liters made by PCB substrate instead of HTCC package, and this technology can reduce the cost of materials down to 40%. We have investigated the multi-layered PCB substrate structures and raw materials to find out the optimal flip-bonding condition between the $LiTaO_3$ wafer and PCB substrates. Also the optimal materials and processing conditions of epoxy laminating film were found out through the experiments which can reduce the bending moment caused by the difference of the thermal expansion between the PCB substrate and laminating film. The new PCB SAW filter shows good electrical and reliability performances with respect to the present SAW filters.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.65-70
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• 2014

Warpage of top packages to form thin package-on-packages was measured with progress of their process steps such as PCB substrate itself, chip bonding, and epoxy molding. The $100{\mu}m$-thick PCB substrate exhibited a warpage of $136{\sim}214{\mu}m$. The specimen formed by mounting a $40{\mu}m$-thick Si chip to such a PCB using a die attach film exhibited the warpage of $89{\sim}194{\mu}m$, which was similar to that of the PCB itself. On the other hand, the specimen fabricated by flip chip bonding of a $40{\mu}m$-thick chip to such a PCB possessed the warpage of $-199{\sim}691{\mu}m$, which was significantly different from the warpage of the PCB. After epoxy molding, the specimens processed by die attach bonding and flip chip bonding exhibited warpages of $-79{\sim}202{\mu}m$ and $-117{\sim}159{\mu}m$, respectively.