• Title/Summary/Keyword: PbTiO$_3$(PTO) layer

Search Result 4, Processing Time 0.021 seconds

Structural and C-V characteristics of SrTiO$_3$ /PbTiO$_3$ thin film deposited on Si (Si 기판위에 증착한 SrTiO$_3$ /PbTiG$_3$ 고용체 박막의 구조적 특성 및 C-V 특성)

  • 이현숙;이광배;김윤정;박장우
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2000.07a
    • /
    • pp.71-74
    • /
    • 2000
  • Pt/Pb$TiO_3$/$SrTiO_3$/p-Si films were prepared by metallo-organic solution deposition(M0SD) method and investigated its structure and ferroelectric properties. Crystallinity of specimen as a funtions of post annealing temperature and the thickness of $SrTiO_3$(STO) buffer layer was studied using XRD and AFM. Based on C-V and P-E curve, $PbTiO_3$(PTO) capacitors showed good ferroelectric hysteresis arising from the polarization switching properties. When the thickness of ST0 buffer layer between PTO and Si substrate was 260 nrn and the post annealing temperature was $650^{\circ}C$, it was showed that production of the pyrochlore phase due to interdiffusion of Si into FTO was prevented. The dielectric constant of FTO thin films calculated from a maximum Cma in the accumulation region was 180 and the dielectric loss was 0.30 at 100 kHz frequency. The memory window in the C-V curve is 1.6V at a gate voltage of 5V.

  • PDF

Si Micromachining for MEMS-IR Sensor Application (결정의존성 식각/기판접합을 이용한 MEMS용 구조물의 제작)

  • 박홍우;주병권;박윤권;박정호;김철주;염상섭;서상회;오명환
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.11 no.10
    • /
    • pp.815-819
    • /
    • 1998
  • The silicon-nirtide membrane structure for IR sensor was fabricated through the etching and the direct bonding. The PRO($PbTiO_3$ ) layer for a IR detection was coated on the membrane and its characteristics were measured. The a attack of PTO layer during the etching of silicon wafer as well as the thermal isolation of the IR detection layer were eliminated through the method of bonding/etching of silicon wafer. The surface roughness of the membrane was measured by AFM, the micro voids and the non-contacted area were inspected by the PTO layer were measured, too.

  • PDF

Characterization of Sol-gel Coated Pb(ZrTi)O3 Thin film for Piezoelectric Vibration MEMS Energy Harvester (압전 MEMS 진동에너지 수집소자를 위한 졸겔 공법기반의 Pb(ZrTi)O3 박막의 특성 분석 및 평가)

  • Park, Jong-C.;Park, Jae-Y.
    • Proceedings of the KIEE Conference
    • /
    • 2009.07a
    • /
    • pp.1240_1241
    • /
    • 2009
  • In this paper, sol-gel-spin coated $Pb(ZrTi)O_3$ thin film with $ZrO_2$ buffer-layer and $PbTiO_3$ seed-layer was investigated for vibration MEMS energy harvester to scavenge power from ambient vibration via d33 piezoelectric mode. Piezoelectric thin film deposition techniques on insulating layer is the important key for $d_{33}$ mode of piezoelectric vibration energy harvester. $ZrO_2$ buff-layer was utilized as an insulating layer. $PbTIO_3$ seed-layer was applied as an inter-layer between PZT and $ZrO_2$ layer to improve the crystalline of PZT thin film. The fabricated PZT thin film had a remanent polarization of 5.3uC/$cm^2$ and the coercive field of 60kV/cm. The fabricated energy harvester using PZT thin film with PTO seed-layer generated 1.1uW of electrical power to $2.2M{\Omega}$ of load with $4.4V_{pvp}$ from vibration of 0.39g at 528Hz.

  • PDF

Etching-Bonding-Thin film deposition Process for MEMS-IR SENSOR Application (MEMS-IR SENSOR용 식각-접합-박막증착 기반공정)

  • Park, Yun-Kwon;Joo, Byeong-Kwon;Park, Heung-Woo;Park, Jung-Ho;Yom, S.S.;Suh, Sang-Hee;Oh, Myung-Hwan;Kim, Chul-Ju
    • Proceedings of the KIEE Conference
    • /
    • 1998.07g
    • /
    • pp.2501-2503
    • /
    • 1998
  • In this paper, the silicon-nitride membrane structure for IR sensor was fabricated through the etching and the direct bonding. The PTO layer as a IR detection layer was deposited on the membrane and its characteristics were measured. The attack of PTO layer during the etching of silicon wafer as well as the thermal isolation of the IR detection layer can be solved through the method of bonding/etching of silicon wafer. Because the PTO layer of c-axial orientation raised thermal polarization without polling, the more integration capability can be achieved. The surface roughness of the membrane was measured by AFM, the micro voids and the non-contacted area were inspected by IR detector, and the bonding interface was observed by SEM. The polarization characteristics and the dielectric characteristics of the PTO layer were measured, too.

  • PDF