• Journal of the Korean Society for Precision Engineering
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• v.16 no.9
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• pp.89-95
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• 1999

The compression behavior of semi-solid materials in studied from a viewpoint of yield criteria and analysis methods. To describe the behavior of materials in semi-solid state, several theories have been proposed by extending the concept of plasticity of porous compressible materials. in the present work, the upper-bound method and the finite element method are used to model the simple compression process using yield criteria of Kuhn and Doraivelu. Segregation between solid and liquid which cause defect of product is analysed for Sn-15%Pb alloy is compared with the experimental result of Charreyron et al..

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.05a
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• pp.252-255
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• 1996

Superconducting current lead is one of the promising applications of the oxide high-Tc superconductors, because they have the advantage of decreasing heat conduction to low temperature region, comparing with a conventional cooper alloy lead. High critical current density is a key factor for the applications such as current lead. (Bi,Pb)$_2$Sr$_2$Ca$_2$Cu$_3$O$\_$x/ high Tc superconductor haute been investigated in terms of critical current density. Bi-2223 superconducting current lead made by CIP and solid state sintering process. Bi-2223 current lead that heat treated at 836$^{\circ}C$ for 240 h in 1/13 P$\_$O$_2$/ had over 150 A/$\textrm{cm}^2$ of critical current density at 77K. We knew that the superconducting properties of tube type current leads were better than rods type of them. And we investigated the relation of Bi-2223 formation and heat treatment condition by XRD and SEM analysis.

• Transactions of Materials Processing
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• v.6 no.4
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• pp.319-328
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• 1997

A flow stress involving strain, solid fraction, and breakage ratio, and solid fraction updating algorithm were proposed to depict the deformation behavior of materials at the semi-solid state. In case of isothermally simple upsetting of Sn-15%Pb alloy at the semi-solid state, by comparing the results of finite element analysis with the existing experimental results, the reliability of both the developed flow stress and updating algorithm were investigated. It was found that the verified program can effectively be used in the rigid-viscoplastic finite element analysis of the semi-solid forging processes.

• The Transactions of the Korean Institute of Power Electronics
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• v.4 no.3
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• pp.294-303
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• 1999

Resistance spot welding is commonly used for welding products of high quality because of clean welding and short w welding-time. But. conventional spot welders bring about the depreciation of welding products, iuespective of dynamic r resistance characteristics during welding time. This paper discussed dynamic resistance database implementation in t terms of welding performance improvement. On different welding conditions, we compared dynamic resistance, r respectively, about pure iron and Sn-Pb alloy on Copper. Also, it investigated the relation of tensile shear strength and d dynamic resistance in welded workpiece.

• Journal of the Korean Society for Heat Treatment
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• v.35 no.2
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• pp.82-87
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• 2022

The PZT piezoelectric ceramic on the copper alloy plate shows a extraordinary pattern resulted from the electromagnetic and thermal radiation induced by copper coil. The Eddy current or magnetic field by the polarization of PZT grains contained Pb, Zr, Ti with oxide is performed to show the change of array pattern at piezoelectric grains, especially wave-shaped or wrinkled configuration along with lines of electromagnetic field are becoming larger than before while applying the coil induction.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Conservation Science in Museum
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• v.16
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• pp.32-45
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• 2015

The bronze incense burner, discovered in Chungung-dong, Hanam, Gyeonggi-do in 1971, is a hanging incense burner dating from the Goryeo period. The incense burner was covered with a thick layer of clay. The object was in a severely deteriorated state, affected by bronze disease which resulted in extensive corrosion. Numerous cracks were present across its surface, and some parts had been broken off. To preserve and display the bronze incense burner in a stable condition, deposits of foreign material were removed from the surface, and the weakened metal was strengthened. Cracked and broken areas were reinforced using woven glass fiber, followed by the application of epoxy resin to restore the shape. To investigate the method of production, a chemical analysis was performed, and the microstructure was examined. The chemical analysis revealed that the body of the incense burner as well as the ear, loop, lid and the knob were cast in a ternary alloy of Cu-Sn-Pb. Moreover, copper nails with high copper content were used to securely join the ear to the body of the incense burner. The microstructure was mainly α-phase, and non-intermetallic inclusions composed of Cu and S were detected.

• Corrosion Science and Technology
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• v.6 no.2
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• Journal of Conservation Science
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• v.32 no.1
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• pp.11-19
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• 2016

Seungja Chongtong is a small korean tubular arm that made by particular arm-making way imitating a chinese arm. This study organizes scientific analysis results with results of inscriptions reading of Seungja Chongtong in the Central museum of Kyunghee University. Three of Seungja Chongtongs are made with Cu-Sn-Pb ternary alloy which is not much differ in contents and the results of microstructure analysis of Seungja Chongtong 1 which could investigate a microstructure among the Chongtongs were found out that Seungja Chongtong is made by general casting, with no evidences of an additional heat-treatment and tempering. Furthermore, in results of lead isotope ratio analysis to find out a source of lead using during the production of Seungja Chongtong, It seems that Seungja Chongtong is made with a lead ore from northern Gyeongsangbuk-do Province and southern Gangwon-do Province called Korea southern zone 2 area.