• Journal of the Korean Ceramic Society
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• v.50 no.3
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• pp.238-243
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• 2013

We investigated the effect of Pb-metal filler added to a hybrid paste(PbO-$Bi_2O_3-B_2O_3$-ZnO glass frit and Pb-powder), for joining flip-chip sat lower temperatures than normal. The glass transition temperature was detected at $250^{\circ}C$ and the softening point occurred at $330^{\circ}C$. As the temperature increased, the specific density decreased due to the volatility of the Pb-metal and boron component in the glass. When the glass was heat-treated at $350^{\circ}C$ for 5 min, XRD results revealed a crystalline $Pb_4Bi_3B_7O_{19}$ phase that had been initiated by the addition of Pb-filler in the hybrid paste. The addition of the Pb-metal filler caused are action between the Pb-metal and glass that accelerated the formation of the liquid phase. The liquid phase that formed, promoted bonding between the flip-chip substrate sat lower temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.181-181
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• 2009

전자부품용 Pb-free sealing frit의 열팽창계수를 기판에 matching 시키기 위하여 음의 열팽창계수를 가지고 있는 $\beta$-Eucryptite, $\beta$-Spodumene를 합성하여 filler로 첨가하였다. 합성된 filler는 저온소성용 유리프리트의 높은 열팽창계수를 조절하기 용이하고, 유리프리트와 복합화 하여 소성하면 낮은 열팽창계수로 인한 우수한 열충격 저항성을 갖는다. Filler로써 $\beta$-Eucryptite, $\beta$-Spodumene의 결정성을 향상시키기 위해 $1250^{\circ}C$에서 5 시간 동안 유지하는 합성공정을 3회 반복 진행한 후 XRD를 사용하여 결정성을 분석하였고, TMA를 이용하여 filler 첨가량에 따른 유리프리트의 열팽장계수의 변화를 측정하였다. 또한, filler 입도와 함량에 따른 melting 특성을 분석하기 위해 Pill test를 진행하였으며, soda-lime glass 기판과의 접합면을 SEM을 사용하여 관찰하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.36-36
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• 2007

$R_2O_3$(R=Bi, B)-RO(R=Ba, Zn)를 주성분으로 하는 Pb-free유리프리트에 높은 굴절률을 가지고 있는 $TiO_2$ filler를 첨가하여 PDP용 백색유전체를 제조하였다. $TiO_2$ type, 함량에 따른 백색유전체로의 반사율 및 유전 특성을 조사하였다. 백색유전체를 소성한 결과 rutile과 anatase를 중량비로 75:25로 혼합하여 $520^{\circ}C$에서 소성한 경우 밀도 및 수축율의 변화를 거의 나타나지 않았다. 그러나 $TiO_2$함량이 15wt.%를 혼합하여 첨가했을 경우 반사율은 높고 접합특성 또한 우수하였다. 또한, 유전상수는 $TiO_2$첨가량이 증가함에 따라 증가하는 경향을 나타내었다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.117-117
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• 2002

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.8
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• pp.755-759
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• 2008

For the development of a new white dielectric layer in plasma display panel, different $TiO_2$ types as a filler was add to the $Bi_2O_3$-BaO-ZnO glass matrix. The reflectance and dielectric constant of dielectric have been investigated as a function of the mixing content (rutile and anatase), and sintering temperature. The reflectance of dielectric sintered at the 520$^{\circ}C$ appeared most highly and suitable in terms of the adhesion and reflectance of the soda-lime glasses. Also, the thermal expansion coefficient of dielectric was found to be $85.6\times10^{-7}/K$, which was similar to that of the soda-lime glasses. Especially, the dielectric constants were not increased with increasing of $TiO_2$ filler contents.

• Elastomers and Composites
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• v.41 no.1
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• pp.10-18
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• 2006

Influence of low molecular weight polybutadiene (liquid PB) treated with maleic anhydride on properties of a silica-filled SBR compounds was studied. Silica dispersion was improved by adding liquid PB. The liquid PB treated with maleic anhydride (liquid MAPB) was found to be more effective for the improvement of silica dispersion than the liquid PB without maleic anhydride (liquid NPB). Viscosity of the SBR compound decreased by adding the liquid PB. The crosslink density decreased with increase of the liquid PB content and the cure rate became slower with increasing the liquid PB content. Considering the experimental results, it was believed that addition of small amount of the liquid PB (less than 5 phr) was desirable to improve properties of silica-filled SBR compounds.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.3
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• pp.247-253
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• 2000

We evaluated the electric properties of Bi-2223 jointed tapes processed by both resistive-and superconducting-joint methods. For resistive-joint. filler materials of wood metal Pb/Sn. In and silver paste were used whereas for superconductive-joint lap joint method was used. In the resistive joint tape. critical transport property(CCR) n-value and contact resistance were observed to be in the range of 10-85% 1-8,9. and 0.71x10$\^$-6/-0.13x10$\^$-6/Ω, respectively. depending on their filler materials. Specifically it is believed that the electrical properties of resistive joint tape are significantly related to the resistivity of filler materials. On the other hand the CCR of superconductin joint type was varied 55 to 85% with uniaxial pressure probably due to the irregular microstructure in the transition region.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1245-1247
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• 2005

Glass frit was selected to be a $Bi_2O_3-RO-R_2O_3$ system as a sealing material to replace the current PbO system in PDP. Fillers such as a zircon, cordierite and ${\beta}-eucryptite$ were added for the control of thermal expansion coefficient (CTE), flowability and strength for sealing. At $450-500^{\circ}C$, reaction of frit and filler and interface were evaluated by a flow button test and SEM observation. The composite (frit and filler) showed CTE in the range of 70-83 x $10^{-7}/K$ and flowability of 14-20mm. It can be a candidate for the replacement of PbO system.

• Nuclear Engineering and Technology
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• v.48 no.6
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• pp.1396-1403
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• 2016

In this study, fast-curing shielding materials were prepared with a two-component polyurethane matrix and a filler material of PbO through a one-step, laboratory-scale method. With an increase in the filler content, viscosity increased. However, the two components showed a small difference. Curing time decreased as the filler content increased. The minimum tack-free time of 27 s was obtained at a filler content of 70 wt%. Tensile strength and compressive strength initially increased and then decreased as the filler content increased. Even when the filler content reached 60 wt%, mechanical properties were still greater than those of the matrix. Cohesional strength decreased as the filler content increased. However, cohesional strength was still greater than 100 kPa at a filler content of 60 wt%. The ${\gamma}$-ray-shielding properties increased with the increase in the filler content, and composite thickness could be increased to improve the shielding performance when the energy of ${\gamma}$-rays was high. When the filler content was 60 wt%, the composite showed excellent comprehensive properties.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.814-817
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• 2003

The sintering behavior of $BaO-B_{2}O_{3}-ZnO$, which is Pb-free glass-ceramic system, was examined as functions of the composition and the amount and particle size of $Al_{2}O_{3}$ filler. Different kinds of modifiers were added and $Al_{2}O_{3}$ fillers with different particle sizes ($1.5{\mu}m$ and $4.5{\mu}m$) were added. The glass frit-filler composites were sintered in the temperature range $520{\sim}580^{\circ}C$. X-ray diffraction results revealed that some of the composites crystallized during sintering. Dielectric constant and thermal expansion coefficient the glass-ceramics were analyzed.