Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Characterization of resistive-and supercodncuting-joint of Bi-2223 superconductor tape

Bi-2223 초전도선재의 상전도- 및 초전도-접합부 특성평가

  • 김정호 (성균관대학교 금속재료공학부) ;
  • 지봉기 (성균관대학교 금속재료공학부) ;
  • 박형상 (성균관대학교 금속재료공학부) ;
  • 임준형 (성균관대학교 금속재료공학부) ;
  • 오승진 (성균관대학교 금속재료공학부) ;
  • 주진호 (성균관대학교 금속재료공학부) ;
  • 황보훈 (성균관대학교 전기전자컴퓨터공학부) ;
  • 나완수 (성균관대학교 전기전자컴퓨터공학부)
  • Published : 2000.03.01
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Abstract

We evaluated the electric properties of Bi-2223 jointed tapes processed by both resistive-and superconducting-joint methods. For resistive-joint. filler materials of wood metal Pb/Sn. In and silver paste were used whereas for superconductive-joint lap joint method was used. In the resistive joint tape. critical transport property(CCR) n-value and contact resistance were observed to be in the range of 10-85% 1-8,9. and 0.71x10$\^$-6/-0.13x10$\^$-6/Ω, respectively. depending on their filler materials. Specifically it is believed that the electrical properties of resistive joint tape are significantly related to the resistivity of filler materials. On the other hand the CCR of superconductin joint type was varied 55 to 85% with uniaxial pressure probably due to the irregular microstructure in the transition region.

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References

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