• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 춘계학술대회 논문집
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• pp.241-244
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• 2004

Microlens patterned micro-mold fabrication method for Light Guiding Plate(LGP), kernel part of LCD-BLU(Back Light Unit), was presented. Instead of erosion dot pattern for LCP optical design, microlens pattern, fabricated by LIGA-reflow process, was applied. Optical pattern design method was also developed not only for negative pattern LGP, but also positive pattern LGP. In order to achieve flow balance during the micro-injection molding process and dimensional accuracy, two LGP pattern was made in one micro-mold.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.105-108
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• 2006

It has been issued to fabricate nano-scale patterns with large-scale in the field of digital display. Also, large-scale fabrication technology of nano pattern is very important not only for the field of digital display but also for the most of applications of the nano-scale patterns in the view of the productivity. Among the fabrication technologies, UV nano imprinting process is suitable for replicating polymeric nano-scale patterns. However, in case of conventional UV nano imprinting process using flat mold, it is not easy to replicate large areal nano patterns. Because there are several problems such as releasing, uniformity of the replica, mold fabrication and so on. In this study, to overcome the limitation of the conventional UV nano imprinting process, we proposed a continuous UV nano imprinting process using a pattern roll stamper. A pattern roll stamper that has nano-scale patterns was fabricated by attaching thin metal stamper to a roll base. A continuous UV nano imprinting system was designed and constructed. As practical examples of the process, various nano patterns with pattern size of 500, 150 and 50nm were fabricated. Finally, geometrical properties of imprinted nano patterns were measured and analyzed.

• 대한산업공학회지
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• 제36권1호
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• pp.42-51
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• 2010

The semiconductor industry is highly capital and technology intensive. Technology advancement on circuit design and process improvement requires chip makers continuously to invest a new fabrication facility that costs more than 3 billion US dollars. Especially major semiconductor companies recently started to discuss 450mm fabrication substituting existing 300mm fabrication of which facilities were initiated to build in 1998. If the plan is consolidated, the yield of 450mm facility would be more than doubled compared to existing 300mm facility. In steps of this important investment, facility layout has been acknowledged as one of the most important factors to be competitive in the market. This research proposes a new concept of semiconductor facility layout using hexagonal floor plan and its compatible material flow pattern. The main objective of this proposal is to improve the productivity of the unified layout that has been popularly used to build existing facilities. In this research, practical characteristics of the semiconductor fabrication are taken into account to develop a new layout alternative based on the analysis of Chung and Tanchoco (2009). The performance of the proposed layout alternative is analyzed using computer simulation and the results show that the new layout alternative outperforms the existing layout alternative, unified layout. However, a few questions on space efficiency to the new alternative were raised in communication with industry practitioners. These questions are left for a future study.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1601-1604
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• 2005

The demand increasing of optical applications like as display devices derives interest for fabrication process. The product s development is apt to fabricate numerous thin and wide surfaces with micro pattern. Naturally that needs injection molding fabrication for the mass production. In existing manufacturing, the product quality is controlled by input fabrication condition from the outside. That can be called as a try and error method and not fundamentally solve the troubles; imperfect replication, war page, short shot, etc. To understand the cause and bring a solution, it is needed that check of changing in the cavity. This study can catch them. Data acquisition system about temperature and pressure distribution is settled and can get some data. From this research, other studies related with DAQ in cavity can start on the easier step.

• 소성∙가공
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• 제20권1호
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• pp.60-63
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• 2011

BLU(back light unit) is one of kernel parts of LCD(liquid crystal display) unit. New 3-D micro-lens pattern for LGP(light guide plate), one of the most important parts of LCD-BLU, had been researched. Instead of dot pattern made by chemical etching or laser ablation, SCS(slanted curved surface) micro-lens pattern was designed with optical CAE simulation. This study introduce the method of design using optical CAE simulation for SCS micro-lens, the new fabrication method of micro-mold with SCS micro-lens pattern.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.239-242
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• 2003

Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.

• 한국레이저가공학회지
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• 제11권1호
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• pp.1-6
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• 2008

We proposed new light guide panel (LGP) fabrication method exploiting laser-processed inner scatterers and surface pattern. The proposed method has achieved LGP performance improvement in both brightness and uniformity. The inner scatterers and surface pattern of grid type were fabricated with a 2nd harmonic Nd:YAG pulse laser engraving system and a $CO_2$ laser scanning system, respectively. In the implementation of LGP, inner scatterers was arranged in accordance with linear or curved pattern with changing density and surface pattern was engraved on the surface of an inner-scatterers embedded LGP. The increase of scatterers' density and the use of surface patterns in both linear and curved pattern provided high luminance and uniformity enhancement. While thecurved pattern incorporated with increased scatterers' density and surface patterns yielded brightness improvement with preserving good uniformity, the linear pattern showed highly localized brightness near the light entrance of the LGP. We can also observe that the uniformity was mainly determined by pattern of inner scatterers, and the brightness was improved by the higher density and the utilization of surface patterns. From the results, the use of laser-processed inner and surface patterns can be a potential alternative for efficient and simple LGP fabrication method.

• 한국정밀공학회지
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• 제21권4호
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• pp.24-31
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• 2004

The objective of this work is to suggest a mastless pattern fabrication technique using the combination of machining by Nanoindenter(equation omitted) XP and HF wet etching. Sample line patterns were machined on a borosilicate surface by constant load scratch (CLS) of the Nanoindenter(equation omitted) XP with a Berkovich diamond tip, and they were etched in HF solution to investigate chemical characteristics of the machined borosilicate surface. All morphological data of scratch traces were scanned using atomic force microscope (AFM).

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.1240-1241
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• 2008

Superconducting ceramics of YBaCuO was fabricated on SrTiO substrate by chemical fabrication method using fine powder of YBaCuO having diameter less than 1um. The pattern of the fabricated superconducting bulk was linear and the thickness of it can be controlled in the range of 50um. The structure of the surface of film by diffraction pattern and composition. The tape like YBaCuO bulk with width of 10mm was formed on substrate using similar method. Tape like film is expected to utilize as material of superconducting tape.

• 한국정밀공학회지
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• 제25권7호
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• pp.27-32
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• 2008