• E2M - 전기 전자와 첨단 소재
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• 제10권4호
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• pp.349-354
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• 1997

This paper aims at studying the improvement of test method for t-weight sensitive fault (t-wsf) detect. The development of RAM fabrication technology results in not only the increase at device density on chips but also the decrease in line widths in VLSI. But, the chip size that was large and complex is shortened and simplified while the cost of chips remains at the present level, in many cases, even lowering. First of all, The testing patterns for RAM fault detect, which is apt to be complicated , need to be simplified. This new testing method made use of Local Lower Bound (L.L.B) which has the memory with the beginning pattern of 0(l) and the finishing pattern of 0(1). The proposed testing patterns can detect all of RAM faults which contain stuck-at faults, coupling faults. The number of operation is 6N at 1-weight sensitive fault, 9,5N at 2-weight sensitive fault, 7N at 3-weight sensitive fault, and 3N at 4-weight sensitive fault. This test techniques can reduce the number of test pattern in memory cells, saving much more time in test, This testing patterns can detect all static weight sensitive faults and pattern sensitive faults in RAM.

• 한국기계가공학회지
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• 제13권4호
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• pp.7-12
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• 2014

A transparent poly methyl methacrylate (PMMA) optical micro-pyramid array-pattern is designed and fabricated using an injection modeling technique. The device's optical characteristics are tested and analyzed theoretically. In the optical pattern generated using the fabricated PMMA pattern, the components, due to not only refraction but also diffraction, are observed simultaneously. Wave optic modeling and analysis reveals that the energy ratio between the diffraction and refraction in the optical pattern are dependent on the critical dimension of the optical pattern such that the refraction and diffraction tend to be directly and inversely proportional to the pattern dimension, respectively.

• 한국정밀공학회지
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• 제23권8호
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• pp.178-184
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• 2006

Hot embossing is to fabricate desired pattern on the polymer substrate by pressing the patterned mold against the substrate which is heated above the glass transition temperature, and it is a high throughput fabrication method for bio chip, optical microstructure, etc. due to the simultaneous large area patterning. However, the bad pattern fidelity in large area patterning is one of the obstacles to applying the hot embossing technology for mass production. In the present study, PDMS pad was used as a cushion on the backside of the micro-patterned 4 inch Si mold to improve the pattern fidelity over the 4 inch PMMA sheet by increasing the conformal contact between the Si mold and the PMMA sheet. The pattern replicability improvement over 4 inch wafer scale was evaluated by comparing the replicated pattern height and depth for PDMS-cushioned Si mold against the rigid Si mold without PDMS cushion.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.216-219
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• 2005

In recent, LCD becomes one of the main display devices and expected to have quite good market share during the next couple of years. The demand for low cost and high performance, however, is becoming severe as the competition among other display devices like PDP, OLED increases. To satisfy this demand from market, we need to optimize the parts or modules of the LCD, reduce the number of the assemble and enhance the process for the high brightness and uniformity of the LCD. The LCD consists mainly of LCD panel and Backlight unit(BLU). BLU, which takes big portion of the cost for LCD, consists of light source, light guide panel and many kinds of functional film. Recently light guide panel or film for BLU has micro patterns on its surface and consequently to reduce the number of parts and enhace the brightness and its uniformity. In this study, some methodologies for the fabrication of the master/stamper and molding the light quide panel are introduced for 50um pitch of prizm patterned substrate. Mechanical machining process is adapted and optimized to fabricate micro patterned stamper using the micro cutting tool. Injection molding technology is also developed to obtain uniformly replicated micro patterned products.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.728-731
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• 2005

A light guide panel (LGP) is an element of the LCD back light unit, which is used for display devices. In this study, a laser marking process is applied to the fabrication of light guide panels as the new fabrication process. In order to obtain a light guide panel which has high luminance and uniformity, four principal parameters such as power, scanning speed, ratio of line gap, and number of line were selected as important factors. A Web-based design tool was developed to generate patterns of light guide panel, and the tool may assist the designer to develop optimized patterns. Topcon-BM7 was used for luminance measurement of each specimen 100mm$\times$100mm area. By Taguchi method optimized levels of each parameters such as 40W of power, 30mm/s of scanning speed, 100:50 ratio of pattern gap, and 90 line of pattern were found by Taguchi method.

• 한국진공학회지
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• 제5권4호
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• pp.309-314
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• 1996

VLSI 공정에 평탄화를 위하여 사용되는 SOG과 AFM lithography에 resist 재료로서 이용되는 것이 확인되었다. 이에 기초하여, 본 연구는, SOG가 VLSI lithography 공정에 이용되기 위한 coating막 두께의 가변, 현상을 위한 etching time 및 etching selectivity의 가변, 패턴의 크기에 따르는 적정 공급전압을 선택 등으로 공정의 여유도를 크게 개선하였다. 공급전압 60V, FE 전류량 5nA로서 800$\AA$의 fine 패턴을 얻었다. 차세대 DRAM 제작공정 기술을 위한 AFM lithography에 있어서, SOG의 사용은 공정 여유도가 양호함에 의하여 크게 전망되는 기술이 될 것이다.

• 소성∙가공
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• 제20권1호
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• pp.17-22
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• 2011

Recently, analyzing system is studying for applying to biomedical engineering field, actively. Micro fluidics control system has been manufactured using LIGA (Lithographie Galvanoformung und Abformung), Etching, Lithography and Laser etc. However, it is difficult that above-mentioned methods are applied to fabrication of precision mold master efficiently because of long processing time and rising cost of equipments. Therefore, in this study, micro EDM and micro WEDG system were developed to analyze machining characteristics with tool wear, surface roughness and process time. Then, optimal machining conditions could be obtained from the results of analysis. As the results, mold master of staggered herringbone mixer which has a high mixing efficiency, one of passive mixer of Lab-on-a-chip, could be fabricated from micro pattern(< 50um) using micro EDM successfully.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1073-1077
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• 2003

This study aims to investigate the fabrication process of nano silicon mold using electron beam lithography (EBL) to generate the nanometer level patterns by nano-imprinting technology. the nano-patterned mold including 100mm pattern size has been fabricated by EBL with different doses ranged from 22 to 38 ${\mu}C/cm^2$ on silicon using the conventional polymethylmetharcylate(PMMA) resist. The silicon mold is fabricated with various patterns such as circles, rectangles, crosses, oblique lines and mixed forms, The effect of dosage on pattern density in EBL is discussed based on SEM (Scannning Electron Microscopy) analysis of fabricated molds. The mold surface is modified by hydrophobic fluorocarbon (FC) thin films to avoid the stiction during nano-imprinting process.

• 대한기계학회논문집B
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• 제26권7호
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• pp.991-996
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• 2002

This paper presents the fabrication method of a micro-riblet film (MRF) using MEMS technology and the experimental results of the drag reduction of an airfoil with MRFs. Riblets having grooved surface in the streamwise direction has been proven as an effective passive control technique of the drag reduction. A V-grooved pattern on (100) silicon wafer is etched with anisotropic bulk micromachining. The MRF is completed by replicating the V-grooved pattern with polydimethylsiloxane (PDMS). Experiments were performed by measuring a velocity field behind the trailing edge of a NACA 0012 airfoil with and without MRFs in a closed-type subsonic wind tunnel using particle image velocimetry (PlV) technique. The MRF provides about 3.8 % drag reduction compared to the drag on a smooth airfoil when the freestream velocity of wind tunnel is 3.3 m/s.

• 한국정밀공학회지
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• 제27권9호
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• pp.11-15
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• 2010

In this study, to fabricate a low-resistance and high optical transparency electrode film, the following steps were performed: the design and manufacture of electroforming stamp, the fabrication of a thermal roll-imprinted polycarbonate (PC) patterned films, the filled low-resistance Ag paste using doctor blade process on patterned PC films and spin coating by conductive polymers. As a result of PC films imprinted line width of $26.69{\pm}2\;{\mu}m$, channel length of $247.57{\pm}2\;{\mu}m$, and pattern depth of $7.54{\pm}0.2\;{\mu}m$. Ag paste to fill part of the patterned film with conductive polymer coating and then the following parameters were obtained: a sheet resistance of $11.1\;{\Omega}/sq$ optical transparency values at a wavelength of 550 nm was 80.31 %.