• Bulletin of the Korean Chemical Society
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• v.31 no.7
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• pp.1833-1834
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• 2010

• Laser Solutions
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• v.6 no.1
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• pp.1-8
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• 2003

A molten metal droplets are deposited onto solid substrate for solid freeform fabrication, Collision dynamic and substrate heat transfer associated with solidification determine the final shape of molten metal droplets. In this study, the experimental model, based on the variational condition with substrate temperature and falling height, was produced reliable optimal data of droplet pattern.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.39-40
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.191-192
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• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.243-244
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• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.297-298
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.279-280
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• 2009

• Proceedings of the Optical Society of Korea Conference
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• 1989.02a
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• pp.222-224
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• 1989

A new fabrication method of proton-diffused LiNbO3 channel waveguides with self-aligned SiO2-Cladding structures are reported, which provides easy control of mode pattern shapes and sizes.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1532-1536
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• 2007

A plastic substrate with tiny rectangular pillars less than 100nm is injection molded to study pattern replication in injection molding. The size of the substrate is 50mm ${\times}$ 50mm and 1mm thick. The substrate has 9 patterned areas of which size is 2mm ${\times}$ 2mm respectively. The lengths of the pillars are 50nm, 100nm, 150nm and 200nm and the width and height are 50nm and about 100nm respectively. A pattern master is fabricated by e-beam writing using positive PR(photo resist) and then a nickel stamper replicated from the PR master by nickel electro-plating. Cr is deposited on the PR pattern master before nickel electro-plating as a conducting layer. Using this nickel stamper, several injection molding experiments are done to investigate effects of the injection molding parameters such as mold temperature, injection rate, packing pressure or pattern location on the replication of the patterns under 100nm.

• 한국금형공학회:학술대회논문집
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• 2008.06a
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• pp.35-38
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• 2008

A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.