• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.11
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• pp.1287-1293
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• 2008

Antenna switch module(ASM) for quad-band was developed. This module was integrated by RFIPD(RF integrated passive device) and transistor switch instead of LTCC-type device using low pass filters, diodes and passive elements in RF front end module for cellular phone. This module leads to low cost and miniaturization(The area is $5{\times}5\;mm$ and the thickness is 0.8 mm). The insertion loss and the return loss of each band were averagely measured as 1.0 dB(insertion loss), 15.1 dB(GSM/EGSM return loss) and 19 dB(DCS/PCS return loss), respectively.

• Journal of Industrial Technology
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• v.15
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• pp.137-146
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• 1995

The reference model for UNI (User Network Interface) of B-ISDN is consisted of three function groups (B-NTI, B-NT2 and B-TE). In this study, we constructed passive B-NT1 module which can be utilized for optical link management and repair, one of main functions of B-NT1. For the convenience of installation and management, this module is only consisted of passive optical devices. And at a local exchange center linked with the module, the broken zone of optic link is able to be monitored without interrupting services. In addition, we performed the power burget analysis for the design of efficient optic link including this module.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.02a
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• pp.1-14
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• 2006

[ $\blacklozenge$ ] PCB에 있어서 Embedded passive 는chip을 직접 내장하는 방법과 특별한 특성을 갖는 재료 및 공법을 사용하여 chip 응 대치하는 방법이 있다. $\blacklozenge$ Embedded passive PCB가 적용될 수 있는 유력한 적용 분야는 소형화가가 요구되는 분야와 고속 특성이 요구되는 분야를 들 수 있고, 따라서, Module, SOP/SIP, Package substrate 등이 우선적으로 적용될 수 있는 분야다. $\blacklozenge$ Embedded capacitor를 적용한 경우, 일반적인 chip capacitor를 적용한 경우보다 더 좋은 전기적인 특성(SRF, Q)을 얻을 수 있으며, solder joint 등의 영향을 포함하면 더욱 좋은 특성이 얻어질 수 있다. $\blacklozenge$ Embedded passive 의 상용화를 위해서, 공차를 관리하는 방법의 개발과 공차에 대한 합리적인 규격을 설정하는 것이 우선 과제이다. $\blacklozenge$ Embedded resistor 의 경우, Laser trim을 적용하여 ${\pm}\;5\%$ 또는 그 이하의 공차를 실현할 수 있고, $30\;K\Omega/sq$. 의 고저항의 적용까지 가능하다. $\blacklozenge$ 고속 신호에서의 noise 감소, module, SIP/SOP 의 소형화를 실현하는데 Embedded passive(혹은 active)PCB 가 기여 할 수 있을 것이고, 이를 위하여 Set 업체, PCB 업체, 재료 업체간의 지속적인 협조가 필요할 것이다.

• Convergence Security Journal
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• v.11 no.1
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• pp.19-24
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• 2011

This paper describes a passive SID sensor tag that provide physical security functions based on a sensor interface module. It elementarily consists of a serial I/O interface, control module, and sensor module. In this paper, it show tamper-proof security functions by comparison and encryption with the sensor signal data using the physical resistors. The passive SID sensor tag can be realized by the real time management for the safety, forgery, and so on. The proposed SID tag embedded with a sensor module is expected to find wide physical security applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.270-270
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• 2007

전자 산업의 발달로 인해 전자기기에 소형화, 경량화 및 다기능화가 요구되면서 민쇄회로기판(PCB)에도 고밀도화, 고집적회가 필요하게 되었다. 이에 따라 embedded passive 기술을 이용하여 기판 내부에 가능한 많은 수동소자들을 실장시키려는 노력이 진행되어지고 있다. 가장 수요가 많은 capacitor의 경우 부피와 전기적 특성 측면에서 내장 효과가 가장 큰 passive 소자에 해당한다. 본 연구에서는 내장형 capacitor의 유전재료로서 중요한 $BaTiO_3$ powder를 filler로 사용하여 epoxy/BT 복합체에서 filler의 분율에 따른 유전상수률 측정하고, filler의 열처리에 따른 유전상수의 변화를 관찰하였다. 그러고 이들 복합체의 mixing rule과 미세구조 관찰을 통하여 기판용 RCC 소재로서의 적용성을 평가하고자 하였다.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.13-18
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• 2000

Low temperature co-fired ceramics on metal (LTCC-M) is efficient for embedding passive components with good tolerance in a module due to the dimensional stability in x and y directions by the constraint of metal core during the firing. In addition, the radiation noise can be reduced by metal core. In this paper, embedded passive components were introduced and a power amplifier module (PAM) fabricated by using the passive components was explained. The embedded passive components in test patters showed the tolerance of 10~20% and the good repeatability in tolerance of embedded passives was maintained in module fabrication. The shortened traces in multi chip modules (MCMs) make the signal delay time decreased and the embedded passives simplify the packaging processes owing to the less solder points, which enhance the electrical performance and increase the reliability of the modules. The LTCC-M technology is one of the promising candidates for RF application and is expected to expand its applications to power and high performance devices.

• The Journal of the Convergence on Culture Technology
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• v.6 no.2
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• pp.349-355
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• 2020

Social robots are attracting attention as an alternative to social problems in modern society, and the need for modularization has been raised to efficiently manage various robots. The study aims to reestablish the concept of 'Personal social service robot' and propose a new modularization method to apply it. For this study, literature research about the definition of social robots and service robots is conducted. In addition, we investigated the modularization of robots and analyzed the modularization cases of service robots. Based on this, we have deducted considerations for applying social service robot modularization and proposed a new modularization. This study divided the module into active module and passive module according to whether it is electric or electronic component of the module, and the active module was again classified into basic module and additional module according to the basic and replacement type of the robot. The modularization was verified by making the prototype of the actual robot.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.6
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• pp.609-617
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• 2014

Even though the variable pitch control of a wind turbine blade is known as an effective component for power control over the rated wind speed, it has limited applicability to small wind turbines because of its relatively high cost on the price of small wind turbine. Instead, stall control is generally applied in the blade design without any additional cost. However, stall delay can frequently be caused by high turbulence around the turbine blade, and it can produce control failures through excessive rotational speed and overpowering the electrical generator. Therefore, a passive pitch control module should be considered, where the pitch moves with the aerodynamic forces of the blade and returns by the elastic restoring force. In this study, a method to calculate the pitch moment, torque, and thrust based on the lift and drag of the rotating blade wing was demonstrated, and several effective wing shapes were reviewed based on these forces. Their characteristics will be estimated with variable wind speed and be utilized as basic data for the design of the passive pitch control module.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1673-1675
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• 2004

The design, modeling and measurement of RF switch module for GSM applications is presented in this paper. RF switch module is constructed using a LTCC multi-layer switching circuit and integrated low pass filter. Insertion and return loss of the low pass filter were designed less than 0.3 dB and better than 12.7 dB at 900 MHz. The RF switch module contained 10 embedded passives and 3 surface mount components integrated on $4.6{\times}4.8{\times}1.2$ mm, 6-layer multi-layer integrated circuit. The insertion loss of switch module was measured at 900 MHz was 11 dB.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.11 s.242
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• pp.1173-1181
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• 2005

The cooling effect of a mobile phone using PCM(Phase Change Material) module has been numerically investigated. A transient three-dimensional numerical analysis of heat and fluid flow with natural convection is performed in this study. Governing conservation equations for mass, momentum and energy are solved by an implicit finite volume method. An enthalpy-porosity technique has been used for modeling of the melting process. Two different ways of placing the PCM module are considered. One is to place a PCM module between the substrate and battery pack, and the other is to place a PCM module between MCM(multichip module) and battery pack. Three different types of PCMs are used to predict the performance of PCM. The results show that passive cooling with PCM can reduce the temperature rise and the effect of natural convection in PCM module considered in this study is negligible.