• Title/Summary/Keyword: Passive Layer

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Determination of Electrode Potential in Micro Electrochemical Machining of Nickel (니켈의 미세 전해 가공 시 전극 전위의 선정)

  • Nam H.S.;Park B.J.;Kim B.H.;Chu C.N.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.585-588
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    • 2005
  • The dissolution characteristic of metal shows the different tendency according to the applied electrical potential, the kind of electrolyte and pH value, etc. In the micro electrochemical machining (ECM), unfavorable oxide/passive layer formation and overall corrosion of electrodes must be prevented. The anodic polarization curve of nickel has distinct three dissolution regions, i.e. two active regions and the transpassive dissolution region. In this paper, the stable electrode potentials of workpiece and tool were determined in sulfuric acid and hydrochloric acid solution, respectively. In each solution, different machining property was shown and possible electrochemical reactions were discussed. On the basis of this experiment, the methodology to obtain the proper electrode potential was suggested.

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Hybrid Damping Treatment for Vibration control of an Automotive Roof using Viscoelastic and Piezoelectric material (하이브리드 방법을 이용한 자동차 루프의 진동제어)

  • Na, Jung-Kee;Moon, Sung-Jin;Kim, Chan-Mook;Kang, Young-Kyu
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2004.11a
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    • pp.994-998
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    • 2004
  • Hybrid method is used to suppress vibration of an automotive roof surface. The hybrid method proposed in this paper is implemented experimentally using both viscoelastic and piezoelectric material. The piezoelectric material is used to control the vibration of automotive structure for lower range of frequencies and the experiment of vibration control using viscoelastic material has been carried out suppress vibrations of high frequency range mark. At first the plate controlled by using hybrid method has been .implemented to verify the performance for suppressing vibration. Then the experiment has been applied to the automotive roof structure.

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NEW RESULTS CONCERNING THE INFLUENCE OF HEAT TINGS DURING WELDING ON THE CORROSION RESISTANCE OF STAINLESS STEELS

  • Wohlfahrt, H.;Pries, H.;Saggau, R.
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.29-37
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    • 2002
  • High alloyed stainless steels stand out for a high corrosion resistance due to a protective passive layer which is formed when the content of chromium exceeds 13%. When welding these steels, heat tints arise in the area of the weldment. They may occur from flint yellow to intensive blue in the spectrum depending on the applied welding process and the quality of the backing gas used. Due to their structures, they partly drastically reduce the corrosion resistance of stainless steels so that they may lead to damages of the technical application of welded components. In the following the pitting resistance by different backing gases and the chemical composition of the stainless steel itself are described.

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Design of single-chip NFC transceiver (단일 칩 NFC 트랜시버의 설계)

  • Cho, Jung-Hyun;Kim, Shi-Ho
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.1
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    • pp.68-75
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    • 2007
  • A single chip NFC transceiver supporting not only NFC active and passive mode but also 13.56MHz RFID reader and tag mode was designed and fabricated. The proposed NFC transceiver can operate as a RFID tag even without external power supply which has dual antenna structure for initiator and target. The area increment due to additional target antenna is negligible because the target antenna is constructed by using a shielding layer of initiator antenna. The analog front end circuit of the proposed NFC transceiver consists of a transmitter and receiver of reader/writer block supporting NFC initiator or RFID reader mode, and a tag circuit for target of passive NFC mode or RFID tag mode. The maximum baud rate of the proposed NFC device is 212kbps by using UART serial interface. The chip has been designed and fabricated using a Magnachip's $0.35{\mu}m$ double poly 4-metal CMOS process, and the effective area of the chip is 2200um by 3600um.

Experiment of an ABS-type control strategy for semi-active friction isolation systems

  • Lu, Lyan-Ywan;Lin, Ging-Long;Lin, Chen-Yu
    • Smart Structures and Systems
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    • v.8 no.5
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    • pp.501-524
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    • 2011
  • Recent studies have discovered that a conventional passive isolation system may suffer from an excessive isolator displacement when subjected to a near-fault earthquake that usually has a long-period velocity pulse waveform. Semi-active isolation using variable friction dampers (VFD), which requires a suitable control law, may provide a solution to this problem. To control the VFD in a semi-active isolation system more efficiently, this paper investigates experimentally the possible use of a control law whose control logic is similar to that of the anti-lock braking systems (ABS) widely used in the automobile industry. This ABS-type controller has the advantages of being simple and easily implemented, because it only requires the measurement of the isolation-layer velocity and does not require system modeling for gain design. Most importantly, it does not interfere with the isolation period, which usually decides the isolation efficiency. In order to verify its feasibility and effectiveness, the ABS-type controller was implemented on a variable-friction isolation system whose slip force is regulated by an embedded piezoelectric actuator, and a seismic simulation test was conducted for this isolation system. The experimental results demonstrate that, as compared to a passive isolation system with various levels of added damping, the semi-active isolation system using the ABS-type controller has the better overall performance when both the far-field and the near-fault earthquakes with different PGA levels are considered.

Embedded Inductors in MCM-D for RF Appliction (RF용 MCM-D 기판 내장형 인덕터)

  • 주철원;박성수;백규하;이희태;김성진;송민규
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.3
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    • pp.31-36
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    • 2000
  • We developed embedded inductors in MCM-D substrate for RF applications. The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need fur mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. The proposed MCM-D substrate was based on Cu/photosensitive BCB multilayer and Ti/Cu is used to form the interconnect layer. Seed metal was formed with 1000 $\AA$ Ti/3000 $\AA$ Cu by sputtering method and main metal was formed with 3 $\mu\textrm{m}$ Cu by electrical plating method. The multi-turn sprial inductors were designed in coplanar fashion. This paper describe the manufacturing process of integrated inductors in MCM-D substrate and the results of electrical performance test.

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Passive Device Library Implementation of LTCC Multilayer Board for Wireless Communications (무선통신용 LTCC 다층기판의 수동소자 라이브러리 구현)

  • Cho, Hak-Rae;Koo, Kyung Heon
    • Journal of Advanced Navigation Technology
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    • v.23 no.2
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    • pp.172-178
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    • 2019
  • This paper has designed, fabricated, and analyzed the passive devices realized using low temperature co-fired ceramic (LTCC) multi layer substrates by dividing into the shrinkage process and the non-shrinkage process. Using two types of ceramic materials with dielectric constant 7 or 40, we have fabricated the same shape of various elements in 2 different processes and compared the characteristics. For the substrate of dielctric constant 40, compared with the shrinkage process which has 17% shrink in the X and Y directions with 36% shrink in the Z direction, the non-shrinkage process has 43% shrink in the Z direction without shrink in the X and Y directions, so high dimensional accuracy and surface flatness can be obtained. The inductances and capacitances of the fabricated elements are estimated from measurement using empirical analysis equations of parameters and implemented as a design library. Depending on the substrate and the process, the inductance and capacitance depending on the turn number of winding and unit area have been measured, and empirical polynomials are proposed to predict element values.

Mechanism of Seismic Earth Pressure on Braced Excavation Wall Installed in Shallow Soil Depth by Dynamic Centrifuge Model Tests (동적원심모형실험을 이용한 얕은 지반 굴착 버팀보 지지 흙막이 벽체의 지진토압 메커니즘 분석)

  • Yun, Jong Seok;Park, Seong Jin;Han, Jin Tae;Kim, Jong Kwan;Kim, Dong Chan;Kim, DooKie;Choo, Yun Wook
    • Journal of the Earthquake Engineering Society of Korea
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    • v.27 no.5
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    • pp.193-202
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    • 2023
  • In this paper, a dynamic centrifuge model test was conducted on a 24.8-meter-deep excavation consisting of a 20 m sand layer and 4.8 m bedrock, classified as S3 by Korean seismic design code KDS 17 10 00. A braced excavation wall supports the hole. From the results, the mechanism of seismically induced earth pressure was investigated, and their distribution and loading points were analyzed. During earthquake loadings, active seismic earth pressure decreases from the at-rest earth pressure since the backfill laterally expands at the movement of the wall toward the active direction. Yet, the passive seismic earth pressure increases from the at-rest earth pressure since the backfill pushes to the wall and laterally compresses at it, moving toward a passive direction and returning to the initial position. The seismic earth pressure distribution shows a half-diamond distribution in the dense sand and a uniform distribution in loose sand. The loading point of dynamic thrust corresponding with seismic earth pressure is at the center of the soil backfill. The dynamic thrust increased differently depending on the backfill's relative density and input motion type. Still, in general, the dynamic thrust increased rapidly when the maximum horizontal displacement of the wall exceeded 0.05 H%.

Giga WDM-PON based on ASE Injection R-SOA (ASE 주입형 R-SOA 기반 기가급 WDM-PON 연구)

  • Shin Hong-Seok;Hyun Yoo-Jeong;Lee Kyung-Woo;Park Sung-Bum;Shin Dong-Jae;Jung Dae-Kwang;Kim Seung-Woo;Yun In-Kuk;Lee Jeong-Seok;Oh Yun-Je;Park Jin-Woo
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.43 no.5 s.347
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    • pp.35-44
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    • 2006
  • Reflective semiconductor optical amplifiers(R-SOAs) were designed with high gain, wide optical bandwidth, high thermal reliability and wide modulation bandwidth in TO-can package for the transmitter of wavelength division multiplexed-passive optical network(WDM-PON) application. Double trench structure and current block layer were introduced in designing the active layer of R-SOA to enable high speed modulation. The injection power requirement and the viable temperature range of WDM-PON system are experimentally analysed in based on Amplified Spontaneous Emission(ASE)-injected R-SOAs. The effect of the different injection spectrum in the gain-saturated R-SOA was experimentally characterized based on the measurements of excessive intensity noise, Q factor, and BER. The proposed spectral pre-composition method reduces the bandwidth of injection source below the AWG bandwidth and thereby avoids spectrum distortion impeding the intensity noise reduction originated from the amplitude squeezing.

Effect of SUS316L Bipolar Plate Corrosion on Contact Resistance and PEMFC Performance (SUS316L 분리판 부식에 의한 접촉저항 및 고분자전해질 연료전지 성능에 미치는 영향)

  • Kim, Junseob;Kim, Junbom
    • Applied Chemistry for Engineering
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    • v.32 no.6
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    • pp.664-670
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    • 2021
  • Stainless steel was applied as bipolar plate (BP) of polymer electrolyte membrane fuel cell (PEMFC) due to high mechanical strength, electrical conductivity, and good machinability. However, stainless steel was corroded and increased contact resistance resulting PEMFC performance decrease. Although the corrosion resistance could be improved by surface treatment such as noble metal coating, there is a disadvantage of cost increase. The stainless steel corrosion behavior and passive layer influence on PEMFC performance should be studied to improve durability and economics of metal bipolar plate. In this study, SUS316L bipolar plate of 25 cm2 active area was manufactured, and experiments were conducted for corrosion behavior at an anode and cathode. The influence of SUS316L BP corrosion on fuel cell performance was measured using the polarization curve, impedance, and contact resistance. The metal ion concentration in drained water was analyzed during fuel cell operation with SUS316L BP. It was confirmed that the corrosion occurs more severely at the anode than at the cathode for SUS316L BP. The contact resistance was increased due to the passivation of SUS316L during fuel cell operation, and metal ions continuously dissolved even after the passive layer formation.