• Korean Chemical Engineering Research
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• 제44권3호
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• pp.294-299
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• 2006

백-형상 필터의 투과율에 따른 필터 표면에서의 유동속도와 입자궤적을 수치해석 하였다. 필터의 투과율이 널리 사용되는 저급의 부직포 백필터의 투과율 이하의 조건에서는, 투과율에 따른 필터 표면에서의 유동속도와 입자궤적 분포의 변화가 아주 미미하였다. 필터의 바닥면 모서리와 출구 근처를 제외한 필터 표면에서 유선들과 반경 방향 유속들이 균일하게 분포하였다. 필터 표면으로의 입자궤적은 필터의 바닥면 모서리 근처에 더 조밀하게 분포하여 그 위치에 도달하는 입자의 수가 가장 많았고, 필터의 출구 쪽으로 향함에 따라 필터 표면에 위치하는 입자의 수는 점점 감소하는 추세를 보였다.

• 설비공학논문집
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• 제15권8호
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• pp.619-629
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• 2003

A grease filter is used to remove grease generated from a cooking appliance in a kitchen. Since the inertial impaction is a dominant particle removal mechanism of the grease filter, the performance of the filter is greatly affected by the geometry. This numerical study has been conducted to investigate the effect of geometry on the performance of grease filters for four models having nominal flowrate of 100 m$^3$/h. Four models were designed by changing the shape of impaction surface, the length of eyelid, and the number of eyelids of the grease filter. The flow field and particle trajectories in the grease filter with a flow chamber were simulated using the commercial code of STAR-CD. The difference of air velocity and pressure distributions among four models was discussed in detail. The collection efficiency curves and the pressure drops of four models were also compared. It was found that the grease filter model with flat top surfaces shows highest performance among four models, having high particle collection efficiency and relatively low pressure drop. The cutoff diameter of this model representing 50-% collection efficiency is about 7.1 ${\mu}{\textrm}{m}$ for water droplets at 100 m$^3$/h.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1891-1894
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• 1999

We can classify the scratches after CMP process into micro-scratch and macro-scratches according to the scratch size, scratch intensity and defect map, etc. The micro-scratches on wafer after CMP process are discussed in this paper. From many causes, major factor that influences the formation of micro-scratch is known as particle size distribution of slurry.(1) It is indefinite what size or type of particle can cause micro-scratch on wafer surface, but there is possibility caused by large particle over 1um. The best way for controlling these large particle to inflow is to use the slurry filter on POU(Point of user). But the slurry filter(especially, depth-type filter) has sometimes the problem which makes more sever micro-scratches on wafer surface after CMP. We studied that depth-type slurry filter has what kind of week-points and the number of scratch could be reduced by lowering slurry flow rate and by using high spray bar which sprays DIW on polishing pad with high pressure.

• 한국결정성장학회지
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• 제10권4호
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• pp.309-317
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• 2000

Langasite is a promising new piezoelectric material for SAW filter application. Little was known until recently about the methods needed to mechanically polish and chemically polish/etch this material. In this experiment, polishing, slurry chemistry and chemical wet etching for langasite is described. Conventional quartz and LN ($LiNbO_3$) polishing methods did not produce satisfactory polished surfaces, and polishing with a colloidal silica slurries has shown to be most effective. The optimum condition was investigated by changing the slurry chemistry. As the planarization effect is very important in SAW filter applications, the examination of the effective particle number effect and the particle size effect was carried out. Z-cut langasite surface which had been polished with the colloidal silica slurries was etched in a variety of etchants. Conventional quartz etchants destroyed the polished surface. Other etchants formed a thin film on the surfaces. In this experiment, the reaction between langasite and a few etching solution was analysed. And an appropriate selective etchant solution for analyzing the defects was synthesized.

• 한국대기환경학회지
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• 제11권4호
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• pp.361-367
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• 1995

This study has been carried out to investigate the filteration performance of Electrostatically Stimulated Fabric Filter(ESFF) at high temperature condition. The electric field was maintained parallel to the fabric surface. The benefits of ESFF are lower residual pressure drop, improvement of fine particle removal efficiency and increasing reduced rate of pressure drop during a filteration cycle, stable operation at higher filtering velocities. According to the variance of filtering velocities and dust loadings, the results are summarized as follows; By imposing an electric field on the filter, the reduced rate of pressure drop was 7.sim.18% at room temperature, and when filtering velocity was 1.8m/min and dust loading was 1g/m$^{3}$, the value of reduced rate of pressure drop was shown the highest. Under the electric field around the filter, the reduced rate of pressure drop was 10.sim.35% at high temperature, and when filtering velocity was 1.8m/min and dust loading was 1g/m$^{3}$, the value of reduced rate of pressure drop was shown the highest. Most of all, at high temperature, the value of reduced rate of pressure drop was resulted to 25%. Also the collecting efficiency was shown clearly improved. By the SEM photo analysis, the number of penetrated particles at the Conventional Fabric Filter was approximately two times that of Electrostatically Stimulated Fabric Filter.

• 한국결정성장학회지
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• 제17권2호
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• pp.63-68
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• 2007

EMI filter와 같은 적층형 세라믹 제조 시 공정 상 많은 문제점이 야기된다. 특히 표면과 계면에서의 crack, camber, delamination 같은 결함이 없는 적층체를 얻기 위해 서로 다른 두 재료의 동시 소성에 의한 수축율 조절이 필수적이다. 본 연구에서는 ferrite의 분체 특성을 통해 varistor/ferrite의 동시소성 거동을 연구하였다. ferrite 분말을 각각 24시간, 48시간, 72시간 분쇄하여 varistor와 ferrite 각각의 슬러리를 제조하고 doctor blade법으로 green sheet를 제조하였다. 슬러리는 분말 55wt(%)에 binder solution 45wt(%)로 혼합하여 제조하였다. Varistor와 ferrite green sheet는 $80 kg/cm^2$로 적층하여 $900^{\circ}C$, $1000^{\circ}C$에서 3시간 소결 하였다. 그 결과 분쇄시간과 소결온도 조절로 결함이 없는 동시 소성된 ferrite/varistor 적층체를 제조 할 수 있었다.