• Title/Summary/Keyword: Paraffin slurry

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Effect of Chip Spacing in a Multichip Module on the Heat Transfer for Paraffin Slurry Flow

  • Choi, Min-Goo;Cho, Keum-Nam
    • Journal of Mechanical Science and Technology
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    • v.14 no.9
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    • pp.997-1004
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    • 2000
  • The experiments were conducted by using water and paraffin slurry to investigate the effect of a chip spacing in the multichip module on the cooling characteristics from an in-line $4{\times}3$ array of discrete heat sources which were flush mounted on the top wall of a channel. The experimental parameters were chip spacing in a multichip module, heat flux of simulated VLSI chip, mass fraction of paraffin slurry, and channel Reynolds number. The removable heat flux at the same chip surface temperature decreased as the chip spacing decreased at the first and fourth rows. The local heat transfer coefficients for the paraffin slurry were larger than those for water, and the chip spacing on the local heat transfer coefficients for paraffin slurry influenced less than that for water. The enhancement factor for paraffin slurry showed the largest value at a mass fraction of 5% regardless of the chip spacing, and the enhancement factors increased as the chip spacing decreased. This means that the paraffin slurry is more effective than water for cooling of the highly integrated multichip module.

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Study on the cooling performance of discrete heat sources using coolants (냉각제들에 따른 불연속 발열체의 냉각성능 연구)

  • 최민구;조금남
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.11 no.2
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    • pp.224-235
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    • 1999
  • The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water, PF-5060, and paraffin slurry. The experimental parameters were coolants including Paraffin slurry with mass fraction of 2.5~7.5%, heat flux of 10~40W/$\textrm{cm}^2$ for the simulated VLSI chips and Reynolds numbers of 3,000~20,000. The size of paraffin slurry was constant as 10~40${\mu}{\textrm}{m}$ before and after the experiment. The chip surface temperatures for paraffin slurry were lower than those for water and PF-5060. The local heat transfer coefficients for the paraffin slurry were larger than those for water and the local heat transfer coefficients reached a row-number-independent and thermally-fully-developed value approximately after the third row. The local Nusselt numbers for paraffin slurry with a mass fraction of 7.5% were larger by 20~38% than those for water. The paraffin slurry with a mass fraction of 5% shelved the best thermal and hydrodynamic characteristics when local heat transfer and pressure drop were considered simultaneously.

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Formation of a paraffin slurry and its convective heat transfer in a circular pipe (파라핀 슬러리의 생성 및 관내 대류열전달에 관한 연구)

  • Choe, Eun-Su
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.22 no.1
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    • pp.50-60
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    • 1998
  • As a method to develop an enhanced heat transfer fluid, the fine particles of a phase-change material were mixed with a conventional heat transfer fluid. Paraffin, which can be obtained easily in domestic market, was used for the phase-change material and water was used as a carrier fluid. Fine liquid particles of paraffin were formed in water as an emulsion by using an emulsifier, and they were cooled rapidly to become solid particle, resulting in paraffin slurry. The average diameter of produced solid particles was inversely proportional to the amount of the added emulsifier, which was theoretically proved. The produced paraffin slurry was tested thermally in heat transfer test section having a constant-heat-flux boundary condition. The test section was made of a circular stainless-steel pipe, which was directly heated by the power supply having a maximum of 50 Volts-500 Amperes. DSC(Differential scanning calorimeter) tests showed that two kinds of phase change were involved in the melting of paraffin, and it was explained in two different ways. A five- region-melting model was developed by extending the conventional three-region-melting model, and was used to obtain the local bulk mean temperatures of paraffin slurry in the heating test section. The local heat transfer coefficient showed a maximum where the bulk mean temperature of the paraffin slurry reached at the melting temperature of paraffin.

Thermal Characteristics of Discrete Heat Sources Using Coolants

  • Choi, Min-Goo;Cho, Keum-Nam
    • International Journal of Air-Conditioning and Refrigeration
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    • v.9 no.1
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    • pp.1-10
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    • 2001
  • The present study investigated the effects of experimental parameters on the thermal characteristics of an in-line 6x1 array of discrete heat sources for a test multichip module using water, PF-5060 and paraffin slurry. The parameters were heat flux of 10-40W/$cm^2$. Reynolds number of 3,000~20,000 and mass fraction up to 10% for paraffin slurry The size of paraffin slurry was within 10~40$\mu$m before and after experiments. The local heat transfer coefficients for the paraffin slurry were larger than those for water. Thermally fully developed conditions were observed after the third or fourth row (five or seven times of the chip length) and the paraffin slurry showed effective cooling performance at the high heat flux The paraffin slurry with the mass fraction of 5% showed the most efficient cooling performance when the heat transfer and the pressure drop in the test section are considered simultaneously. The experimental data at the fourth and sixth rows are best agreed with the values predicted by the Malina and Sparrow`s correlation among other correlations, and the empirical correlations for water and 5% paraffin slurry were obtained at the first and sixth rows when the channel Reynolds number is over 3,000.

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Cooling characteristics of the multichip module using paraffin slurry (파라핀 슬러리를 사용한 다칩모듈의 냉각특성)

  • Jo, Geum-Nam;Choe, Min-Gu
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.22 no.6
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    • pp.888-898
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    • 1998
  • The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water and paraffin slurry. The experimental parameters are mass fraction of 2.5 ~ 7.5% for paraffin slurry, heat flux of 10 ~ 40 W/cm$^{2}$ for the simulated VLSI chips and Reynolds numbers of 5,300 ~ 15,900. The apparatus consisted of test section, paraffin slurry maker, pump, constant temperature baths, flowmeter, etc. The test section made of in-line, four-row array of 12 heat sources for simulating 4 * 3 multichip module which was flush mounted on the top wall of a horizontal rectangular channel with the aspect ratio of 0.2. The inlet temperature was 20 deg. C for all experiments. The size of paraffin slurry was constant as 10 ~ 40 .mu.m befor and after the experiment. The chip surface temperatures for paraffin slurry with the mass fraction of 7.5% showed lower by 16 deg. C than those for water when the heat flux is 40 W/cm$^{2}$. The local heat transfer coefficients for the paraffin slurry with the mass fraction of 7.5% were larger by 17 ~ 25% than those for water at the first and the fourth row. The local heat transfer coefficients reached to a row-number-independent, thermally fully developed value approximately after the third row. The local Nusselt numbers at the fourth row for paraffin slurry with the mass fraction of 7.5% were larger by 23 ~ 29% than those for water.

Convective Heat Transfer of a Paraffin Slurry in a Drag Reducing Carrier Fluid (유동저항 감소유체를 운반유체로 한 파라핀 슬러리의 대류 열전달에 관한 연구)

  • 정동주;최은수
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.13 no.12
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    • pp.1275-1281
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    • 2001
  • Aqueous polymer solutions are known to have small pressure reduction. Paraffin slurries are known to have high thermal capacity. Paraffin particles are mixed into an aqueous polymer solution to make a new heat transfer fluid having high thermal capacity but low pressure reduction. The heat transfer characteristics of the new slurry was tested in a circular tube having a constant heat transfer boundary condition. The new slurry was found to have high Nusselt numbers as well as high thermal capacity and low pressure reduction in the laminar flow. The trends of the Nusselt numbers along the heating test section were studied for various heating conditions.

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Thermal properties of latent heat storage microcapsule-water slurry

  • Mun, Soo-Beom
    • Journal of Advanced Marine Engineering and Technology
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    • v.39 no.8
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    • pp.807-812
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    • 2015
  • A microcapsule water slurry is a latent heat-storage material having a low melting point. In this study, the thermal properties of a microcapsule water slurry are measured. The physical properties of the test microcapsule water slurry, i.e., thermal conductivity, specific heat, latent heat, and density, are measured, and the results are discussed for the temperature region of solid and liquid phases of the dispersion material (paraffin). It is clarified that Eucken's equation can be applied to the estimation of the thermal conductivity of the microcapsule water slurry. Useful correlation equations of the thermal properties of the microcapsule water slurry are proposed in terms of the temperature and concentration ratio of the microcapsule water slurry constituents.

A Study on Thermo-Physical Properties of Microencapsulated Phase Change Material Slurry (마이크로캡슐 잠열 축열재 혼합수의 열물성에 관한 연구)

  • 임재근;최순열;김명준
    • Journal of Advanced Marine Engineering and Technology
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    • v.28 no.6
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    • pp.962-971
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    • 2004
  • This paper has dealt with thermo-physical properties of microencapsulated phase change material slurry as a latent heat storage material having a low melting point. The measured results of the thermo-physical properties of the test microencapsulated phase change material slurry, those are, density, specific heat, thermal conductivity and viscosity, were discussed for the temperature region of solid and liquid phases of the dispersion material (paraffin). The measurements of these properties of microencapsulated phase change material slurry have been carried out by using a specific-gravity meter, a water calorimeter, a differential scanning calorimeter(DSC), a transient hot wire method and rotating type viscometer, respectively. It was clarified that the additional properties law could be applied to the estimation of the density and specific heat of microencapsulated phase change material slurry and also the Euckens equation could be applied to the estimation of the thermal conductivity of this slurry.

A Study on the Heat Release Characteristics of Gel Type Micro Size Latent Heat Storage Material Slurry with Direct Contact Heat Exchange Method (겔 상태의 미세 잠열 축열재 혼합수의 기액직접접촉식 열교환법에 의한 방열 특성)

  • 김명준
    • Journal of Advanced Marine Engineering and Technology
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    • v.28 no.4
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    • pp.618-623
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    • 2004
  • This paper has dealt with the heat storage characteristics of gel type micro size latent heat storage material slurry. The heat release operation to the gel type micro size latent heat storage material slurry was carried out using hot air bubbles by direct contact heat exchange. This experiment was carried out using phase change material of n-paraffin so the heat release amount is higher than cold water system. The parameters of this experiment were concentration of latent heat phase change material, height of heat release bath and inlet velocity of hot air. The main results obtained are as follows : (1) The effect of concentration of latent heat phase change material dispersed with water is very affective to the direct contact heat exchange between hot air and gel type micro size latent heat storage material slurry. (2) It is clarified that the most effective concentration of latent heat phase change material dispersed with water exists around 20mass% at this type of direct heat exchange model experiment.

An Experimental Study for Manufacturing MPCM Slurry and Its Application to a Cooling System (미립캡슐잠열재 제조 및 축열식 냉방기 적용실험)

  • 이효진;최준규;이재구
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.15 no.5
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    • pp.352-359
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    • 2003
  • The present study has been conducted for manufacturing MPCM (microencapsulated phase change material) slurry with in-situ polymerization and proving their applicabilities for tooling system. The surface of MPCM is composed of melamine, while tetradecane, paraffin wax, is centered in the MPCM. The produced capsules are observed by the optical microscope and SEM for superficial shapes. Their thermal properties are measured by DSC. Their size distributions are observed by FA particle analyzer. A narrow size distribution from 1 to 10 ${\mu}{\textrm}{m}$ with 5 ${\mu}{\textrm}{m}$ of average diameter was observed. Melting temperature was 6.7$^{\circ}C$. The durability of MPCM was tested with various types of pump such as centrifugal, peristaltic, and mono pumps. During 10000 cycles the fraction of broken capsules was smaller than 6% for the centrifugal and peristaltic pumps, while bigger value of 8% for the mono pump. A cooling system, which adopted MPCM slurry as a media for transporting cold thermal energy, was designed to investigate the performance of the MPCM. The discharging times of 10 and 20 wt% MPCM slurry were lasted up to 105 and 285 minutes longer, respectively, than the water cooling system.