• Title/Summary/Keyword: Pad Temperature

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The Effects of Graphite and Magnesium Oxide in Automotive Friction Materials on Friction and Formation of Transfer Film (자동차용 마찰재에 사용되는 흑연과 마그네시아에 따른 전이막과 마찰특성에 관한 연구)

  • Bae, Eun-Gap;Yoon, Jang-Hyuk;Jang, Ho
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2002.05a
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    • pp.226-234
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    • 2002
  • A systematic study of the role of transfer films on friction properties was performed with various temperatures in the brake system. An NAO friction material specimens containing 9 ingredients were tested using a pad-on-disk type friction tester A new method of measuring the transfer film thickness was developed by considering the electrical resistance of the transfer film using a 4-point probe technique. The properties of transfer film such as surface morphology and film distribution vaied according to the relative amount of graphite and magnesium oxide. By using SEM, it was possible to obtain information about the chemical composition of the transfer film. Results showed that there detected a threshold value of the relative amount of a two active materials to maintain a certiain thickness of a transfer film. Results also showed that formation of friction layer generated on the friction surface was strongly affected by chemical action of two ingredients during sliding due to chemical reaction of solid lubricants at different interface temperature. The results suggested that no apparent relationship between transfer film thickness and the average friction coefficient was founded and friction characteristics were affected more by the property of the solid lubricant and abrasive in the material.

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Design of a CMOS Temperature Sensor Using a Sigma-Delta Modulator (시그마-델타 변조기를 이용한 CMOS 온도센서 설계)

  • Lee, D.H.;Lee, J.S.;Kim, I.K.;Kim, K.H.;Park, D.S.;Yu, C.G.
    • Proceedings of the KIEE Conference
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    • 2008.10b
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    • pp.123-124
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    • 2008
  • 본 논문에서 설계한 온도센서는 $0.l8{\mu}m$ CMOS 공정으로 $-55^{\circ}C{\sim}125^{\circ}C$의 온도 범위에서 ${\pm}0.1^{\circ}C$의 정확도를 갖는다. 이 센서는 parasitic PNP 트랜지스터로 온도 변화에 따른 전압을 추출하고 시그마-델타 변조기를 이용하여 디지털 온도 값을 얻기 위한 비트스트림을 생성한다. 또한, 이상적이지 않은 요소로 인해 발생할 수 있는 에러를 $0.01^{\circ}C$ 레벨로 감소시키기 위해 DEM(Dynamic Element Matching)과 2차 시그마-델타 변조기를 이용하였고, Bandgap Reference 회로로 온도 변화에 상관없이 일정한 bias 전압을 생성한다. 설계된 온도센서의 면적은 PAD를 포함하여 $0.98mm{\times}0.92mm$이고, 1.8V 단일 전원에서 동작한다.

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INTERCONNECTION TECHNOLOGY IN ELECTRONIC PACKAGING AND ASSEMBLY

  • Wang, Chunqing;Li, Mingyu;Tian, Yanhong
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.439-449
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    • 2002
  • This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.

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A Study on the U-Korean Traditional Residence introduced Ubiquitous Services in a Traditional Residence (유비쿼터스 기반 U-한옥의 서비스모델 연구)

  • Joung, In-Sang;Lee, Kang-Hoon
    • Journal of the Korean Institute of Rural Architecture
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    • v.12 no.3
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    • pp.47-56
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    • 2010
  • In a study of a peculiarity of the Korean residence construction as the central Jeong Yeo Chang's Residence, we proposed varieties service models for an anthropocentric U-Korean style with "a convenience, a security, an economical, a pleasure". It was to assume for this research that was established in case of all necessity IT infrastructures, and was structural alterations to a Korean residence sectional. It was used for Wall-Pad(Home Gateway) for controlling services, gas valves, remote inspection of a meter, curtains, doorlocks, boilers, temperature controllers, indoor ventilation systems, breakers, and expansion of crime prevention, energy. With introducing various service models on U-Korean style house, removing a negative view about Korean residence, we drew the best suited residence condition combining with a merit of the Korean residence and the Ubiquitous Intelligent Home Service. In order to realize U-Korean style house at the right time at the right place, a maintenance was required to be ensured based on social infrastructures and institutions and laws.

Study on a LTCC Diplexer Design for GSM/CDMA Applications (GSM/CDMA 대역용 LTCC Diplexer 설계 연구)

  • Kim, Tae-Wan;Lee, Young-Chul
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2008.10a
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    • pp.632-635
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    • 2008
  • In this paper, a diplexer circuit to separate GSM/CDMA band is designed using a LTCC (Low Temperature Cofired Ceramic) multi-layer technology. In order to increase a integration capability of the diplexer, it is designed in 6-layer LTCC sunstrate with a elative dielectric constant of 7.2 using 3-dimensional (3-D) multi-layer inductors and capacitors. The size of the designed diplexer including CB-CPW pads is $3,450{\times}4,000{\times}600{\mu}m^3$. An insertion loss (IL) and return loss of GSM band are less than -0.23dB and -10dB, respectively. In the case of CDMA band, the IL of -0.53dB and RL of below -10dB are archieved.

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A Study on the Anionisation of Cotton Fabric (면직물의 음이온화에 관한 연구)

  • Bae, Do Gyu;Lee, Tae Jung
    • Textile Coloration and Finishing
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    • v.30 no.1
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    • pp.29-37
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    • 2018
  • Cotton has no adsorption ability for the cationic dye and heavy metal but, if anionized cotton can be made, it will be possible. In this study, to enable the anionisation of cotton fabric, it was modified using sodium vinylsolfonate(SV) as the anionisation reagent, employing a pad-dry-cure(PDC) technique. The effects of curing time, treatment concentrations of urea, sodium hydroxide and SV on the weight increase were experimented and then, the physical characterizations of sulfoethyl cotton(SEC) depending on the finishing conditions were estimated, thus the application possibility of SV as anionisation reagent was investigated. It was not much changed by anionisation except wrinkle recovery. And the structure of SEC was elucidated by Raman and NMR spectoscopy. The feasibility of using Raman and NMR spectroscopy with the band at $1,043cm^{-1}$, and 50.5ppm, respectively as marker band to determine sulfoethyl group of SEC was reported. The total degree of SV substitution(DSV) was determined via elemental analysis. SEC with diverse total DSV up to 0.066 was obtained. In the thermal decomposition(pyrolysis) by DSC, it can be found that the pyrolysis temperature was about $30^{\circ}C$ lower than that of non-treated cotton fabric.

A Study on the Initial Bonding Strength of Solder Ball and Au Diffusion at Micro Ball Grid Array Package (${\mu}BGA$ 패키지에서 솔더 볼의 초기 접합강도와 금 확산에 관한 연구)

  • Kim, Kyung-Seob;Lee, Suk;Kim, Heon-Hee;Yoon, Jun-Ho
    • Journal of Welding and Joining
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    • v.19 no.3
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    • pp.311-316
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    • 2001
  • This paper presents that the affecting factors to the solderability and initial reliability. It is the factor that the coefficient of thermal expansion between package and PCB(Printed Circuit Board), the quantity of solder paste and reflow condition, and Au thickness of the solder ball pad on polyimide tape. As the reflow soldering condition for 48 ${\mu}BGA$ is changed, it is estimated that the quantity of Au diffusion at eutectic Sn-Pb solder surface and initial bonding strength of eutectic Sn-Pb solder and lead free solder. It is the result that quantitative measurement of Au diffusion quantity is difficult, but the shear strength of eutectic Sn-Pb solder joint is 842 mN at first reflow and increases 879 mN at third reflow. The major failure mode in solder is judged solder fracture. So, Au diffusion quantity is more affected by reflow temperature than by the reflow times.

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Nonlinear rheology of polymer melts: a new perspective on finite chain extensibility effects

  • Wagner Manfred H.
    • Korea-Australia Rheology Journal
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    • v.18 no.4
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    • pp.199-207
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    • 2006
  • Measurements by Luap et al. (2005) of elongational viscosity and birefringence of two nearly monodisperse polystyrene melts with molar masses $M_{w}$ of $206,000g{\cdot}mol^{-1}$ (PS206k) and $465,000g{\cdot}mol^{-1}$ (PS465k) respectively are reconsidered. At higher elongational stresses, the samples showed clearly deviations from the stress optical rule (SOR). The elongational viscosity data of both melts can be modeled quantitatively by the MSF model of Wagner et al. (2005), which is based on the assumption of a strain-dependent tube diameter and the interchain pressure term of Marrucci and Ianniruberto (2004). The only nonlinear parameter of the model, the tube diameter relaxation time, scales with $M_{w}^{2}$. In order to get agreement with the birefringence data, finite chain extensibility effects are taken into account by use of the $Pad\'{e}$ approximation of the inverse Langevin function, and the interchain pressure term is modified accordingly. Due to a selfregulating limitation of chain stretch by the FENE interchain pressure term, the transient elongational viscosity shows a small dependence on finite extensibility only, while the predicted steady-state elongational viscosity is not affected by non-Gaussian effects in agreement with experimental evidence. However, deviations from the SOR are described quantitatively by the MSF model by taking into account finite chain extensibility, and within the experimental window investigated, deviations from the SOR are predicted to be strain rate, temperature, and molar mass independent for the two nearly monodisperse polystyrene melts in good agreement with experimental data.

Development of Dry Forming Mold for the Feasibility Study of Dry Forming of Paper (건식초지기술의 가능성 평가를 위한 건식초지기 개발)

  • Kim, Jong-Min;Youn, Hye-Jung;Lee, Hak-Lae
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.39 no.2 s.120
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    • pp.1-8
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    • 2007
  • To examine the feasibility of dry forming technology for papermaking, a dry forming mold (DFM) was developed and evaluated. Main fanning section of DFM was a cylindrical tube, and at the top of the mold a stirring equipment was placed to disperse dry fibers. These fibers were screened using a hole type screen plate placed just under the stirring equipment and dropped freely on the fanning wire located 0.9 m below of the screen plate to form a dry fiber pad. The vertical and horizontal velocity of air flow in the forming cylinder were evaluated and analyzed to find the most effective method of air flow control in the cylinder. Humidification and pressing conditions to obtain a decent dry fanned papers were examined. Results showed dry fanned papers can be prepared with this dry forming mold. And this mold can be used to examine the effect of the papermaking process factors including pressing pressure, drying temperature, humidification on sheet quality of dry formed papers.

Study on the Physical Properties and Flame Retardancy of Tencel FR/Cotton Complex Knit Fabrics (Tencel FR/Cotton 복합원단의 물리적 특성 및 난연성에 관한 연구)

  • Kim, Hyun-Ah;Kim, Hyun-Chel
    • Journal of the Korean Society of Clothing and Textiles
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    • v.36 no.7
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    • pp.703-713
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    • 2012
  • This study analyzed the physical properties and flame retardancy of Tencel FR/Cotton complex knit fabrics in order to satisfy two aspects of eco-friendliness and functionality. The flame retardant (FR) treatment of complex knit fabrics was applied by a pad-dry-cure method for additional functionality. Tensile strength, extension, bursting strength, LOI, and flame retardancy were measured by the KS (Korean Standard) K manual. The hand value knit fabrics were measured by KES-FB system. Subsequently, tensile strength and extension of wale and tensile strength of course increased in tandem with the Tencel FR yarn content. Tencel FR/Cotton complex knit fabrics were suitable for summer-weight and for baby clothes through the KES-FB system measurements. The bursting strength of Tencel FR/Cotton complex knit fabrics decreased as the contents of the Tencel FR increased; in addition, LOI increased as the contents of Tencel FR increased. This was due to the Tencel FR flame resistance function; however, the tensile strength decreased. The optimum fiber content of Tencel FR/cotton content was 1:1. The optimum conditions of flame retardant treatment were a treatment temperature $130^{\circ}C$ and the concentration of finishing agent and assistance binder (AR4260) was 35% and 1%, respectively.