• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 1996.06c
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• pp.1136-1145
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• 1996

This study was to develop the most effective cooling system which is needed to cool greenhouse during summer night to get early blooming of strawberries. Various cooling systems were designed and constructed to utilize the cool air and water from tan abandoned coal mine. Cooling systems built for this study were an evaporative cooling system with pad, cooling system using a small or large radiator , and duct cooling system using cool are drawn from coal mine. These systems were individual tested to investigate their effects on cooling greenhouse during summer night. Also, a combined cooling system was tested with operating an evaporative cooling system, small radiator, and duct cooling system simultaneously. The results in this study showed that individual cooling systems such as evaporative cooling system, small radiator, and cooling duct had about the same effect on cooling greenhouse. The combined system had little better cooling effect than that of individual cooling syst m except the large radiator . The most effective system for cooling of greenhouse was obtained with using a large a large radiator as the heat exchanger. With operating a large radiator, temperature inside the greenhouse was dropped to about 15-16$^{\circ}C$ while outside temperature was 23-24$^{\circ}C$ during summer night.

• The Korea Journal of Herbology
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• v.22 no.4
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• pp.261-270
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• 2007

Objective : The 5-HMF was not index material suitable to do the quality control of Rehmanniae Radix Preparata. In this study, We estimated the changes of oligosaccharide contents in Rehmanniae Radix Preparata using high-performance anion-exchange chromatography with pulsed amperometric detection(HPAEC-PAD). Methods : The analysis of oligosaccharide was conducted by HPAEC-PAD with Carbopac PA1, $250{\times}4mm$, 5um, and Carbopac PA1 guard column. Column temperature was kept at $30^{\circ}C$. Elution was carried out at 1000 ${\mu}l/min$ with 70mM NaOH and the injection volume was $10{\mu}l$. Each component was detected by PAD. Results : Nine constituents were found from merchandising Rehmanniae Radix Preparata(MR), while seven constituents were found in various processed Rehmanniae Radix Preparata. Not all constituents were defined but stachyose and raffinose were found in all cases. And The most common constituents of Rehmanniae radix was stachyose. In the course of processing, most of stachyose and raffinose were decreased. Stachyose was decreased slowly in the course of processing with rice wine(RR), amomi and rice wine(AR), and crataegi and rice wine(CR). However stachyose was decreased rapidly in the course of processing with fresh rehmannia juice(FR). The method with crataegi and rice wine(CR) showed the smallest decrease of stachyose. And processing method with crataegi and rice wine(CR) showed the most abundant amount for stachyose after the nineth processing. Conclusion : The changes of oligosaccharides in the course of processing were a very important direct barometers to do the quality control and set up a standard of Rehmanniae Radix Preparata.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.1
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• pp.199-207
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• 2016

In this paper, we propose efficient smart indoor emotional lighting control system based on android platform using the biological signal. The proposed smart indoor smart emotional lighting control system were configured as the biological signal measurement device and removable smart wall pad, lighting driver, luminaire. The control system was extracts the emotional language by measured the biological signal, and it was transmitted a control signal to each lighting driver using a bluetooth in the wall pad. The lighting driver were designed to control the lighting device through an expansion board by collected control signal and the illuminance information the surrounding. In this case, the wall pad can be selecting of manual control and the bio signal mode by that indoor emotional lighting control algorithms, and it was implemented the control program that possible to partial control by selecting the wanted light. Experiment results of the proposed smart indoor emotional lighting control system, it were possible to the optional control about the luminaire of required area, and the manual control by to adjustable of color temperature with that the efficiently adjustable of lighting by to biological signal and emotional language. Therefore, were possible to effective control for improvement of concentration and business capability of indoor space business conduct by controlling the color and brightness that is appropriate for your situation. And, was reduced power consumption and dimmer voltage, lighting-current than the existing-emotional lighting control system.

• Journal of the Korean Magnetics Society
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• v.22 no.3
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• pp.79-84
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• 2012

Nano-magnetic materials such as iron-nitrides have been actively studied as an alternative to the application of high density, high performance needs for next generation information storage and also alternative to the rare earth and neodymium magnet. $Fe_4N$ is the basic materials for magnetic storage media and is one of the important magnetic materials in focus because of its higher magnetic recording density and chemical stability. Single phase ${\gamma}^{\prime}-Fe_4N$ nanoparticles have been prepared by a PAD (Plasma Arc Discharge) method and nitriding in a $NH_3-H_2$ mixed gases at temperature, $400^{\circ}C$ for 4 hrs. Also $Fe_{17}Sm_2N_x$ powders were synthesized by nitriding after reduction/diffusion of $Fe_{17}Sm_2$ to compare the magnetic properties with nano-sized $Fe_4N$ particles. The saturation magnetization of $Fe_4N$ and $Fe_{17}Sm_2N_x$ were 149 and 117 emu/g, respectively, but the coercive force was considerably smaller than that of bulk or acicular $Fe_4N$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.1
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• pp.13-22
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• 2001

This paper presents three dimensional structure of RF packages and the improvement effect of its electrical characteristics when implementing RF transceivers. We divided RF modules into several subunits following each subunit function based on the partitioning algorithm which suggests a method of three dimension stacking interconnection, PAA(pad area array) interconnection and stacking of three dimensional RF package structures. 224MHz ITS(Intelligent Transportation System) RF module subdivided into subunits of functional blocks of a receiver(RX), a transmitter(TX), a phase locked loop(PLL) and power(PWR) unit, simultaneously meeting the requirements of impedance characteristic and system stability. Each sub­functional unit has its own frequency region of 224MHz, 21.4MHz, and 450KHz~DC. The signal gain of receiver and transmitter unit showed 18.9㏈, 23.9㏈. PLL and PWR modules also provided stable phase locking, constant voltages which agree with design specifications and maximize their characteristics. The RF module of three dimension stacking structure showed $48cm^3$, 76.9％ reduction in volume and 4.8cm, 28.4％ in net length, 41.8$^{\circ}C$, 37% in maximum operating temperature, respectively. We have found that three dimensional PAA package structure is able to produce high speed, high density, low power characteristics and to improve its functional characteristics by subdividing RF modules according to the subunit function and the operating frequency, and the features of physical volume, electrical characteristics, and thermal conditions compared to two dimensional RF circuit modules.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.25-29
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• 2022

Recently, the importance of electronic packaging technology has been attracting attention, and heterogeneous integration technology in which chips are stacked out-of-plane direction is being applied to the electronic packaging field. The 2.5D integration circuit is a technology for stacking chips using an interposer including TSV, and is widely used already. Therefore, it is necessary to make the interposer mechanically reliable in the packaging process that undergoes various thermal processes and mechanical loadings. Considering the structural characteristics of the interposer on which several thin films are deposited, thermal stress due to the difference in thermal expansion coefficients of materials can have a great effect on reliability. In this study, the mechanical reliability of the metal pad for wire bonding on the silicon interposer against thermal stress was evaluated. After heating the interposer to the solder reflow temperature, the delamination of the metal pad that occurred during cooling was observed and the mechanism was investigated. In addition, it was confirmed that the high cooling rate and the defect caused by handling promote delamination of the metal pads.

• Journal of Welding and Joining
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• v.13 no.2
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.05a
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• pp.285-290
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• 2002

Screw in injection molding machine is affected by heat flux, pressure on inside barrel, geometry of screw including flight number, pitch and flight angle. Volumetric efficiency increases as the flight number increases, but it didn't show steady tendency according to helix angle of flight. Heat flux from heating pad and injection pressure play a very important role on the thermal behavior characteristics. The increased number of multi-flight is merits and demerits for a screw efficiency. So, we have to optimize flight number of the screw considering temperature, displacement, distortion and stress of the screw.

• Proceedings of the Korean Society of Agricultural Engineers Conference
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• 1998.10a
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• pp.230-236
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• 1998

Thermal environment of greenhouse was investigated by thermo-tracer in this study. The Thermo-tracer is a high-sensitivity infrared thermometer of non-contact type. The infrared energy emitted from the measured object is converted into an electrical signal by the detector(HgCdTe) and display as a color or black & white thermal image by way of optical scanning, The experiment was conducted for Venlo-type greenhouse with pad & fan system. The temperature difference between measured by Thermo-trace and measured by HOBO sensor is maximum 0.8$^{\circ}C$. Thermo-trace is possible to use for the thermal environment analysis and diagnosis of a cooling and heating system of greenhouse.