• Tribology and Lubricants
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• v.25 no.6
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• pp.421-426
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• 2009

The brake system is important part of automobile safety system. The disc brake system is divided two parts: the rotating axisymmetrical disc and the stationary pads. During braking, the kinetic energy and potential energy of moving vehicle were converted into the thermal energy through frictional heat between the brake disc and the pads. The frictional heat, which is generated on the interface of the disc and pads, can cause high temperature during the braking process. The object of present work is to determine temperature and thermal stress, to compare to simulation results and experimental results in the disc by partial 3D model of ventilated disc brake with appropriate boundary conditions. In the simulation process, the mechanical loads were applied to the thermo-mechanical coupling analysis in order to simulate the process of heat produced by friction.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.6
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.12
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• pp.23-32
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• 2020

This study investigated the thermal degradation and fading behavior of PTT dyed with vat dye and its dyeing ability. The PTT sample was dyed with vat dye using an acid treatment and pad-steam method to improve the dyeing performance. This method made dye particle nanosize and allowed it to penetrate the polymer material easily. The sample dyed using the pad-steam method showed level dyeing and enhanced dyeing affinity, compared to the batch-dyeing method. The degradation behavior of PTT dyed with vat dye after each heat and UV treatment was examined with the change in tensile strength or K/S value on the sample. The tensile strength and K/S values of the sample dyed with vat dye after the heat and UV treatment decreased with increasing temperature and exposure time. Although they showed high degradation under severe conditions, its rate constant was improved compared to the samples dyed with disperse dye. Consequently, acid treatment and the pad-steam method resulted in the introduction of vat dye on PTT. In addition, the PTT dyed with vat dye showed enhanced thermal and UV resistance because of their high molecular weight and chemical structure for stable adsorption behavior.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.27-32
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• 2010

For the flip chip joints processed using Cu pillar bumps and Sn pads, thermal cycling and high temperature storage reliabilities were examined as a function of the Sn pad height. With increasing the height of the Sn pad, which composed of the flip chip joint, from 5 ${\mu}m$ to 30 ${\mu}m$, the contact resistance of the flip chip joint decreased from 31.7 $m{\Omega}$ to 13.8 $m{\Omega}$. Even after thermal cycles of 1000 times ranging from $-45^{\circ}C$ to $125^{\circ}C$, the Cu pillar flip chip joints exhibited the contact resistance increment below 12% and the shear failure forces similar to those before the thermal cycling test. The contact resistance increment of the Cu pillar flip chip joints was maintained below 20% after 1000 hours storage at $125^{\circ}C$.

• Tribology and Lubricants
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• v.33 no.1
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• pp.9-14
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• 2017

This paper presents a rotordynamic analysis and the operation of a power turbine applied to a 250 kW super-critical $CO_2$ cycle. The power turbine consists of a turbine wheel and a shaft supported by two fluid film bearings. We use a tilting pad bearing for the power turbine owing to the high speed operation, and employ copper backing pads to improve the thermal management of the bearing. We conduct a rotordynamic analysis based on the design parameters of the power turbine. The dynamic coefficients of the tilting pad bearings were calculated based on the iso-thermal lubrication theory and turbine wheel was modeled as equivalent inertia. The predicted Cambell diagram showed that there are two critical speeds, namely the conical and bending critical speeds under the rated speed. However, the unbalance response prediction showed that vibration levels are controlled within 10 mm for all speed ranges owing to the high damping ratio of the modes. Additionally, the predicted logarithmic decrement indicates that there is no unstable mode. The power turbine uses compressed air at a temperature of $250^{\circ}C$ in its operation, and we monitor the shaft vibration and temperature of the lubricant during the test. In the steady state, we record a temperature rise of $40^{\circ}C$ between the inlet and outlet lubricant and the measured shaft vibration shows good agreement with the prediction.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.972-975
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• 2002

An understanding of tribological behavior in CMP(Chemical Mechanical Polishing) is one of the most important things to reveal the mechanism of material removal. In CMP, the contact type is thought to be semi-direct, elastohydrodynamic contact type from the Stribeck diagram, which is a combination of solid-solid direct contact and hydrodynamic lubrication with thin liquid film. This study is focused on the decay of friction force during CMP from two points of view, one of which is change of the real contact area and the other is the decrease of the elastic modulus of the pad caused by the increase of the temperature during CMP Experiments are implemented with elastic modulus measuring system and tool dynamometer. Results show that the decay of friction force during CMP results from the decrease of the real contact pressure working on an abrasive, which is induced by the decrease of elastic modulus of pad caused by the increase of temperature. And, the phenomenon is thought to be happen specially in the case that the weight concentration of abrasive in slurry is small enough.

• Tribology and Lubricants
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• v.36 no.2
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• pp.82-87
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• 2020

In thrust bearings, the thrust collar and bearing surface need to be parallel to each other to ensure that all pads share the same load. In rotating machines, the shaft system cannot achieve perfect alignment. Misalignment of the thrust collar results in some pads supporting a higher load than others and excessive loads being placed on some pads. Consequently, high loads and high temperatures may occur in the bearing. Thus, in this study, we aim to analytically evaluate the performance of a misaligned non-equalizing direct lubricated tilting pad thrust bearing. We define the oil film thickness of the misaligned thrust bearing using the Byrant angle. Additionally, we calculate the pressure distribution and temperature distribution of the thrust bearing using the generalized Reynolds equation and energy equation. The design limit of the thrust bearing is defined by the load and temperature. Therefore, we evaluate the allowable misalignment angle as the limit of the maximum load and temperature. The analysis results demonstrate that an increase in the speed and load corresponds to a smaller allowable misalignment angle. However, as this is not the same for all thrust bearings, evaluating the allowable misalignment angle at each thrust bearing is essential.

• Journal of the Korean Burn Society
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• v.22 no.2
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• pp.21-24
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• 2019

Incidence of low-temperature contact burn by use of an electric pad is increased recently, especially in depressed sensory. Acquired immune deficiency syndrome patient using antiretroviral agent suffered with sensory depression as side effect. There are many limitations in wounds treatment of these patients. These patients are vulnerable to infection due to their weak immunity, so it is necessary to keep them in a state of isolation when a wound occurs. We report a case of a third degree burn by electric pad with a surface area of approximately 5% of the body surface of a patient who underwent a sensory depression, which is a side effect of antiretroviral drugs used for treatment in patients with AIDS. In this regard, we report the case with literature review, which is safely recovered using negative-pressure wound therapy and split-thickness skin graft.

• Journal of the Korea Convergence Society
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• v.9 no.1
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• pp.283-289
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• 2018

In automotive disc brake systems, frictional heat is not uniformly dispersed for reasons such as heat flux and thermal deformation. The thermoelastic deformation due to the frictional heat affects the contact pressure distribution and the contact load may be concentrated on the contact portion on the the disc brake surface, resulting in thermoelastic instability. In this study, thermal analysis and thermal deformation analysis considering the contact between disk and pad occurred during braking through 3D axial symmetry model with reference to the experimental equation and Kao's analysis method of contact pressure of disk and pad. ANSYS is used to analyze the thermal and elastic instability problems occurring at the contact surface between the disk and the pad, considering both the thermal and mechanical loads. A 3D axisymmetric model with direct contact between the disk and the pad was constructed to more accurately observe the thermal behavior of the disk by observing the frictional surface temperature, thermal deformation and contact thermal stress of the disk.

• Transactions on Electrical and Electronic Materials
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• v.8 no.2
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• pp.67-72
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• 2007

High Pressure Micro Jet (HPMJ) pad conditioning system was investigated as an alternative to diamond disc conditioning in copper CMP. A series of comparative 50-wafer marathon runs were conducted at constant wafer pressure and sliding velocity using Rohm & Haas IC1000 and Asahi-Kasei EMD Corporation (UNIPAD) concentrically grooved pads under ex-situ diamond conditioning or HPMJ conditioning. SEM images indicated that fibrous surface was restored using UNIPAD pads under both diamond and HPMJ conditioning. With IC1000 pads, asperities on the surface were significantly collapsed. This was believed to be due to differences in pad wear rates for the two conditioning methods. COF and removal rate were stable from wafer to wafer using both diamond and HPMJ conditioning when UNIPAD pads were used. Also, HPMJ conditioning showed higher COF and removal rate when compared to diamond conditioning for UNIPAD. On the other hand, COF and removal rates for IC1000 pads decreased significantly under HPMJ conditioning. Regardless of pad conditioning method adopted and the type of pad used, linear correlation was observed between temperature and COF, and removal rate and COF.