• 제목/요약/키워드: Pad Temperature

검색결과 346건 처리시간 0.028초

유리 기판을 투과하는 레이저 빔을 사용한 COG(chip-on-glass) 마운팅 공정 (COG(chip-on-glass) Mounting Using a Laser Beam Transmitting a Glass Substrate)

  • 이종현;문종태;김원용;김용석
    • 마이크로전자및패키징학회지
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    • 제8권4호
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    • pp.1-10
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    • 2001
  • 유리 기판상에 증착된 패드(pad)의 접합부 가열에 의한 면배열(area array) 형태 선자 패키지의 chip-on-glass(COG) 마운팅 공정이 시도되었다. 패드는 접합층(즉, Cr 또는 Ti)과 상부 코팅층(즉, Ni 또는 Cu)으로 구성되었으며, 이 중 접합층이 유리 기판을 투과하는 UV레이저에 의해 가열되었다. 접합층에 흡수된 레이저 에너지는 열전노 과정을 통하여 패드와 물리적으로 접촉되어 있는 솔더볼의 온도를 상승시켰으며, 리플로우 과정을 통하여 솔더 범프를 형성하였다. 레이저 가열 동안 솔더볼의 온도 이력(profile)을 측정함으로써 레이저 리플로우 솔더링시 접합층 및 상부 코팅층의 영향이 조사되었다. 그 결과들은 접합층의 반사율 측정 견과에 기초하여 논의되었다. 아울러 솔더 범프의 미세구조와 기계적 특성이 조사되었다.

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DEGUMMING OF SILK FABRIC WITH AN ENZYME DEGUMMASE

  • Chopra, Sheetal;Garg, Samir;Gulrajani, M.L.
    • 한국잠사곤충학회지
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    • 제36권1호
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    • pp.44-52
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    • 1994
  • 산소정련으로 기준 정련방법이 대체될 수 있다. 마르세일비누(25% o.w.f)로 1.5시간 동안 자등하는 기존 방법으로 정련하는 경우 연감율이 24% 내외인데 비해 효소(10% o.w.f)로 5$0^{\circ}C$에서 1시간 정련하면 22%의 연감율을 얻었다. 산소정련은 기존 방법에 비해 처리온도를 현저히 낮출 수 있고 처리시간을 단축할 수 있으며 이러한 방법으로 실크의 광택과 부드러운 촉감을 얻을 수 있었다. 산소의 처리량을 절감하기 위한 Pad-store 방법이 규명되었는데 이 방법에서 효소처리 농도를 0.5%로 낮추고 5$0^{\circ}C$에 5~6시간 정련하면 연감율이 22%로 되었다. Pad-store 방법은 위의 용액처리 방법에 비하여 효소처리량을 20배 절감할 수 있었지만 처리견의 강력이 감소되므로서 5$0^{\circ}C$에서 7~8시간 처리로 정련견의 취화가 일어난것으로 보인다. Pad-store 방법에서 견의 강력이 감소된 것은 정련과정중 효소가 작용하는 부위에서 교반작용이 없기 때문이며 실크의 취화는 시간보다 온도의 영향이 큰 것으로 생각된다.

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플렉서블 타입 소결 브레이크 패드의 적용 연구 (Application of Flexible-Type Sintered Brake Pads)

  • 김성권;김상호;권석진;이희성
    • Tribology and Lubricants
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    • 제27권1호
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    • pp.19-24
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    • 2011
  • Metallic sintered brake pads are often applied to mid/high speed train due to their high strength and thermal characteristics. Imbalance contact between discs and pads can greatly influence the life span, one sided wear, discs attack/crack and threat the safety of the train during operation. In this research, we analyzed pressure/temperature distribution between brake pads and disks. Analyzed data had been verified and modified to conduct further tests of flexible brake pads with small/full-scale dynamo test. Flexible brake pads were installed to high speed train to conduct further tests to identify the differences between rigid brake pads and flexible brake pads. In result, Flexible brake pads showed outstanding disk thermal stability, one sided wear, noise and wear rate than rigid brake pad.

프로세스 대형 모터-발전기의 저어널 베어링 설계 개선 - Part I : 베어링 성능해석 (Journal Bearing Design Retrofit for Process Large Motor-Generator - Part I : Bearing Performance Analysis)

  • 이안성
    • Tribology and Lubricants
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    • 제28권5호
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    • pp.197-202
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    • 2012
  • In this study, with the purpose of fundamentally improving the unbalance response vibration of a large PRT motor-generator rotor by design, a performance improvement design analysis is carried-out by retrofitting tilting pad bearings, replacing the plain partial journal bearings that were originally applied for operation at a rated speed of 1,800 rpm. In this process, a goal of the design analysis is to obtain a design solution for maximizing the direct stiffness of the bearings while satisfying the key basic lubrication performance requirements such as the minimum lift-off speed and maximum oil-film temperature. The results show that with a careful design application of tilting pad journal bearings for operation at such a relatively low speed of 1,800 rpm, direct stiffness increment of the bearings by about two times can be effectively achieved. Prevention of pad unloading is also considered in the analysis. Moreover, the designs of elliptical and offset half journal bearings are also analyzed and reviewed.

등온시효에 따른 Sn-3.5Ag 솔더 접합부의 금속간 화합물 성장에 관한 연구 (Growth Kinetics of Intermetallic Compound on Sn-3.5Ag/Cu, Ni Pad Solder Joint with Isothermal Aging)

  • 이인영;이창배;정승부;서창제
    • Journal of Welding and Joining
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    • 제20권1호
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    • pp.97-102
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    • 2002
  • The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.

Development of Multiple CMP Monitoring System for Consumable Designs

  • Park, Sun-Joon;Park, Boum-Young;Kim, Sung-Ryul;Jeong, Hae-Do;Kim, Hyoung-Jae
    • Transactions on Electrical and Electronic Materials
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    • 제8권1호
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    • pp.11-14
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    • 2007
  • Consumables used in Chemical Mechanical Polishing (CMP) have been played important role to improve quality and productivity. Since the properties of consumables constantly change with various reasons, such as shelf time, manufactured time, lot to lot variation from supplier and so on, CMP results are not constant during the process. Also, CMP process results are affected by multiple sources from wafer, conditioner, pad and slurry. Therefore, multiple sensing systems are required to monitor CMP process variation. In this paper, the authors focus on development of monitoring system for CMP process which consist of force, temperature and displacement sensor to measure the signal from CMP process. With monitoring systems mentioned above, complex CMP phenomena can be investigated more clearly.

Au wire와 Al pad사이의 IMC(Intermetallic Compound) 형성에 의한 수명예측 (Lifetime Estimation due to IMC(Intermetallic Compound) formation between Au wire and Al pad)

  • 손정민;장미순;곽계달
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1295-1300
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    • 2008
  • During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at $175^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ are meticulously investigated. Thermal exposure resulted in the IMC growth, Kirkendall void and the crack of the Au-Al phases. The crack propagation occurs resulting in the failure of the Au-Al ball bonds. As the IC was exposed at the high temperature, decreased in the lifetime.

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유한요소법에 의한 드럼 브레이크의 열응력 해석 (Thermal Stress Analysis of Drums Brakes by Finite Element Method)

  • 구병춘;서정원
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집A
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    • pp.831-836
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    • 2001
  • In the case of axisymmetric thermal analysis of drum brakes, the distribution of frictional heat produced on the interface and temperature difference between mating frictional faces are very interesting problems to computational researchers. In this paper, heat conduction from the interface to the pad and the drum was modeled by using a thin interface element, so artificial division of the generated frictional heat between pad and drum is not necessary. Temperature difference between mating frictional faces is successfully modeled by using the interface element. The influence of some parameters on tile thermal stress was checked. The analysis was performed by ABAQUS/Standard code.

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Mg 온간성형을 위한 십자형상 금형의 가열/냉각 채널 설계 (Heating and Cooling Channel Design of Cross-Shaped Die for Warm Forming of Magnesium Alloy Sheet)

  • 최선철;고동선;김헌영;김형종;홍석무;유수열;신용승
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2008년도 춘계학술대회 논문집
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    • pp.370-373
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    • 2008
  • It is known that the temperatures of die, punch, holder and punch pad need to be kept different to get better formability in Mg sheet forming processes. Heating and cooling channels are usually equipped in each tool to assign different temperature. This study focused on the optimal design of the heating and cooling channels for a cross-shaped deep drawing die set. While the die and blankholder were heated to and kept at $250^{\circ}C$ by using heat cartridges, the punch and punch pad were kept at much lower temperature than that of the die and blankholder by water circulating through cooling channels. All the approaches were done by numerical analyses, aiming to maximize the cup height and to minimize the punch corner radius without any failure.

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EFFECT OF LOAD ANGLE ON THE OPERATION OF TILTING 12-PADS proceeding BEARING

  • Strzelecki, S.;Someya, T.
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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    • pp.113-114
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    • 2002
  • Radial, tilting 12-pad proceeding bearings are applied as the radial bearings of vertical rotors of water turbines. The mean loads are stable at the peripheral speeds of proceeding reaching 50 m/s. The operation of tilting 12-pads proceeding bearing has been introduced at the assumption of adiabatic oil film. The oil film pressure, temperature and viscosity distributions have been obtained by iterative solution of the Reynolds', energy and viscosity equations. The resulting oil film force, minimum oil film thickness, power loss, oil flow, maximum oil film pressure, maximum temperature have been computed for different load angle of bearing.

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