• Journal of the Korean Society for Precision Engineering
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• v.13 no.5
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• pp.44-52
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• 1996

A procedure predicting warpage and post-deformation due to heat resistance test is presented. The procedure is applied to the injection molding processes of automotive plastic components, which are the door trim and the instrument pannel. The warpage of products is obtained from the residual stress after filling, packing and cooling process, and the post deformation due to the heat resistance test is calculated in the structural analysis of the product at the ejection temperature with the initial condition of residual stress, the boundary conditions and heat resistance conditions. The analyses give some useful guide lines in the design of automotive plastic parts which should satisfy heat resistance regulation.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.2
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• pp.110-116
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• 2009

The prominent advantages of Dual Material Surrounding Gate (DMSG) MOSFETs are higher speed, higher current drive, lower power consumption, enhanced short channel immunity and increased packing density, thus promising new opportunities for scaling and advanced design. In this Paper, we present Transconductance-to-drain current ratio and electric field distribution model for dual material surrounding gate (DMSGTs) MOSFETs. Transconductance-to-drain current ratio is a better criterion to access the performance of a device than the transconductance. This proposed model offers the basic designing guidance for dual material surrounding gate MOSFETs.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.8 no.6
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• pp.64-70
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• 1999

Family injection molding of plastic is widely used to enhance productivity. Runners for molded products in fami-ly injection molding have to be balanced so that each of the producs is filled completely at the same time,. In this study computer simulations were performed to determine balanced circular section runners in family injection molding with two cavities where each of he cavity shapes is like a case. It was found from the computer simula-tions that runner balance could be fulfilled only by modifying runner diameters. But in order to get more quality molded products other process factors such as flow length flow resistance shapes of products and etc, should be taken in to consideration for the design of a family injection molding process.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.18 no.2
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• pp.207-213
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• 2009

The bundling process is the final step in vegetable manufacturing, however, the process is a little difficult to be automatized, because vegetable has the physical properties of roughness, softness, and fragility etc. In this paper, we proposed an automatic bundling mechanism for vegetable based on the heat melt sticking. The proposed mechanism consists of three modules, one module is the moving part for aligning of the vegetable shape and adjusting of the vegetable tension, second module is the arm driving part for the vegetable binding and the band roll releasing, and third module is band joining, band cutting, and band feeding part for the vegetable binding continuously. Through this research, Using the SMO(SimDesigner Motion) module, we optimize condition of mechanical movement of the bundling mechanism. This bundling system designed in order to binding 288 bundle/hour.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1107-1112
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• 2008

The objective of this paper is to investigate into the influence of the injection conditions on the insert deformation and the wall thickness of the injection part using the three-dimensional injection molding analysis. Full three-dimensional insert model was added to the injection molding analysis model to consider the effects of insert deformation during the injection molding process. In order to obtain the optimum injection molding condition with a minimum insert deformation, degree of experiments were utilized. From the results of the analyses, it was shown that the optimum injection condition is injection time of 1.6 sec, injection pressure of 30 MPa and packing time of 15 sec. In addition it was shown that the wall thickness is approached to target thickness when the core deformation is considered in the injection molding analysis.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.129-134
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• 2000

Recently, HIPS(High Impact Polystyrene) materials are spot-lighted as office equipment, home electronics, electronics appliances housing, packing containers, etc. But its using are occur to problem caused by fatigue fracture. However, its strength is larged affected by environmental conditions. So, in this paper it tried to analyze the effect of temperature by tensile test and fatigue test. It was observed that yield strength and ultimate strength, fatigue life of same stress decreased relatively with increase temperature. Further, this paper predict S-N curve using the result of tensile test and micro vickers hardness test. For this purpose, the management in the engineering department is able to design the fatigue life of HIPS(HR-1360) materials.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.9-9
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• 2000

Accurate counting and packaging pills is one of the most fundamental works of the pharmaceutical industry. But it is so labor consuming and very hard to be automated. As the pharmaceutical industry is growing bigger, the need of counting and packaging automation is increasing to obtain effective mass production. Precise and quick sensing is required in the counting and processing of quickly dropping pills to improve the productivity. There are many trials for this automation and automatic machine. But the performance of the existing counting machine varies with the size, shape and the dispersion degree of pills In this research, authors design the counting and packing machine of medicinal pills that is more accurate and highly trustworthy After getting analog signal from optical sensor, pill passage is discriminated from chosen characteristic feature using microprocessor.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.4
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• pp.375-380
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• 2009

In this paper, it has been proposed an automatic vegetable bundling mechanism that makes use of heat melt sticking. The proposed mechanism is consisted of three modules for the rationality of manufacture. Design specification has been determined by the bundling mechanism that was optimized mechanically. And, it has been manufactured the prototype of the automatic bundling machine. It has been carried out directly the field test for verification of performance in farmhouse which produces vegetable. In field test, this bundling machine showed efficiency of about 3.6 times than the manual working by manpower, and other performance it got satisfied result. This automatic vegetable-bundling machine was already registered as the agricultural machine. and This machine will be commercialized soon.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1259-1260
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• 2006

Intensive technological research on the Dry-bag CIP equipment was carried out to improve the dimensional accuracy and the productivity. The rubber mold design technology using FEM simulation during pressing was introduced, in order to achieve higher dimensional preciseness, and criteria for the selection of the In-line type or Off-line type, were established based on the powder flowability index proposed by Carr. Based on these research results, high productivity Off-line Dry-bag CIP equipment, which can realize good dimensional accuracy with high productivity, was developed even for non-granulated powders with poor packing density.

• Journal of the Korean Institute of Telematics and Electronics
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• v.23 no.6
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• pp.741-746
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• 1986

A novel n-p-n bipolar transistor of which emitter is self-aligned with base contact by polyilicon is developed for using in high speed and high packing density LSI circuits. The emitter of this transistor is separated less than 0.4 \ulcorner with base contact by self-aligh technology, and the emitter feature size is less than 3x5 \ulcorner\ulcorner Because the active region of this transistor is not damaged through all the process, it has excellent electric properties. Using the n-p-n transistors by 3.0\ulcorner design rules, a NTL ring oscillator has 380 ps, a CML ring oscillator has 390ps, and a I\ulcorner ring oscillator has 5.6ns of per-gate minimum propagation delay time.