• 제목/요약/키워드: Packaging method

검색결과 968건 처리시간 0.026초

PMMA 고분자 입자를 템플릿으로 이용한 실리카 중공체의 제조 (Synthesis of Hollow Silica Using PMMA Particle as a Template)

  • 황하수;조계민;박인
    • 공업화학
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    • 제21권3호
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    • pp.353-355
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    • 2010
  • 양이온성의 2,2'-azobis(2-methylpropionamidine) (AIBA) 개시제를 이용한 methylmethacrylate (MMA)의 무유화제 에멀전 중합을 통해 polymethylmethacrylate (PMMA) 입자를 합성하였다. 스퇴버 방법을 이용하여 양이온성의 PMMA 입자 표면에 실리카를 코팅하였다. 음전하의 실리카 전구체는 양이온성의 PMMA 입자 표면과의 정전기적 인력에 의해 코팅된다. 실리카 코팅 과정 중에 PMMA 입자가 용해되어 후처리 없이 실리카 중공체를 얻을 수 있었다.

무연솔더를 이용한 실리콘 압력센서의 플립칩 패키지 (Flip-Chip Package of Silicon Pressure Sensor Using Lead-Free Solder)

  • 조찬섭
    • 한국산업융합학회 논문집
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    • 제12권4호
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    • pp.215-219
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    • 2009
  • A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

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Manufacture of Water-Resistant Corrugated Board Boxes for Agricultural Products in the Cold Chain System

  • Jo, Jung-Yeon;Min, Choon-Ki;Shin, Jun-Seop
    • 한국펄프종이공학회:학술대회논문집
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    • 한국펄프종이공학회 2006년도 PAN PACIFIC CONFERENCE vol.2
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    • pp.459-463
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    • 2006
  • For the purpose of developing liner board for water-resistant corrugated board in the cold chain system, several types of base paper for corrugated board were purchased from the market and 6 different boards were produced in the paperboard mill by applying the chemicals on the base paper. Then, water-moisture resistant performance and physical properties of the boards were evaluated and compared each other. The liner board which is dried at high temperature with pressure by the Condebelt showed a superior performance in strength over conventional liner boards. Strength of the board increased by surface chemical treatment up to 60% of compressive strength and 30% of bursting strength. Starch insolubilization with Ammonium-Zirconium -Carbonate and surface coating with a surface size and a moisture resistant chemical on CK paper showed the best result. Therefore, this method was recommended to produce the outer liner board for water -resistant corrugated board.

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X-RAY Inspection for PCB/SMT & Electronics Components Latest Development

  • Maur Friendhelm W.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2004년도 국제표면실장 및 인쇄회로기판 생산기자재전:전자패키지기술세미나
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    • pp.17-25
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    • 2004
  • During the past few years, advances have been made in both in X-ray tube and detector technologies. The field of microfocus radioscopy has been established as an important testing process and has expanded into many new industrial applications that require quality control or process optimization. The first nanofocus and multifocus X-ray systems have become available with a focal spot of .5 micron. In the existing range of microfocus X-ray tubes, further improvements have been achieved as well, such as increased long term stability of intensity position constancy. Software, image processing and manipulation techniques have all progressed as well, allowing X-ray to become a formidable non-destructive inspection method for manufacturers in virtually every industry, especially those involved with Electronic Packaging and SMT.

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Work Packaging Model의 개선을 통한 공정 - 공사비 통합모델 구축 (A Study on the Cost and Schedule Integration Model based on the Improvement of Work Packaging Mode)

  • 김양택;현창택
    • 한국건설관리학회논문집
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    • 제1권4호
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    • pp.82-90
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    • 2000
  • 낙후된 국내 건설관리기술을 선진화$\cdot$합리화하기 위한 방안 중의 하나로 공정-공사비 통합관리가 많은 주목을 받고 있다. 정부에서도 공정과 공사비의 통합관리의 필요성을 인식하고 이의 도입을 적극검토하고 있다 실제로 해외공사를 통해서 양성된 국내 공정관리 전문가들의 노력으로 최근 일부 공공기관의 건설사업에서는 공정-공사비 통합관리를 부분적으로 활용하고 있는 상황이다. 그러나 그 기법 및 전산모델이 이론에 국한된 것이거나 국내의 특수한 여건을 수용하지 못하는 것이 대부분이기 때문에 활용에 많은 어려움이 있으며 국내 건설환경에 완전하게 정착되지 못하고 있다. 본 연구의 목적은 통합관리의 정착을 지연시키는 국내의 특수한 여건 및 문제점을 파악하고 이를 토대로 국내 건설현장에서 적용할 수 있도록 공정-공사비 통합모델의 개선방안을 제시하는 것이다.

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기판단위 밀봉 패키징을 위한 내압 동공열의 설계 및 강도 평가 (Design and Strength Evaluation of an Anodically Bonded Pressurized Cavity Array for Wafer-Level MEMS Packaging)

  • 강태구;조영호
    • 대한기계학회논문집A
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    • 제25권1호
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    • pp.11-15
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    • 2001
  • We present the design and strength evaluation of an anodically bonded pressurized cavity array, based on the energy release rate measured from the anodically bonded plates of two dissimilar materials. From a theoretical analysis, a simple fracture mechanics model of the pressurized cavity array has been developed. The energy release rate (ERR) of the bonded cavity with an infinite bonding length has been derived in terms of cavity pressure, cavity size, bonding length, plate size and material properties. The ERR with a finite bonding length has been evaluated from the finite element analysis performed for varying cavity and plate sizes. It is found that, for an inter-cavity bonding length greater than the half of the cavity length, the bonding strength of cavity array approaches to that of the infinite plate. For a shorter bonding length, however, the bonding strength of the cavity array is monotonically decreased with the ratio of the bonding length to the cavity length. The critical ERR of 6.21J/㎡ has been measured from anodically bonded silicon-glass plates. A set of critical pressure curves has been generated for varying cavity array sizes, and a design method of the pressurized cavity array has been developed for the failure-free wafer-level packaging of MEMS devices.

3전극형 반사형 디스플레이에서 패키징 방법에 의한 광특성 개선에 관한 연구 (A Study on Improvement of Optical Characteristics by Packaging Methods in Three Electrode-Type Reflective Display)

  • 박상현;김영조
    • 한국전기전자재료학회논문지
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    • 제30권3호
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    • pp.170-174
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    • 2017
  • In 3 electrode reflective displays using a plastic substrate, unstable packaging induces particle clumping and optical degradation due to external air inflow and electronic ink evaporation. In this work, we fabricate 3 electrode electronic paper using glass wafer, ITO/plastic film, and ITO/glass/gas barrier film as an upper substrate after injecting electronic ink onto the lower substrate. Then, we studied its properties. After operating under stress conditions for 336 hours at $85^{\circ}C$ and 75% humidity, the reflectivity of driven e-paper panels with white color was 25.5% for the panels using glass wafer, 22.5% for plastic film including a gas barrier layer, and 16% for plastic film only. From these optical properties, we conclude that gas barrier film improves upper film isolation as a desirable packaging method.

디지털 FID용 패널제작과 패키 방법에 관한 연구 (A Study on Panel Manufacture and Packaging Method for Digital FED)

  • 김수용
    • 조명전기설비학회논문지
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    • 제23권5호
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    • pp.29-35
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    • 2009
  • FED는 잠재적인 평판기술에 따라 현재 연구되고 있다. 이 논문의 제안은 FED 핵심적인 개발을 위한 진공 패키징 기술에 대한 연구결과를 보여준다. FED 진공 패키징을 위해서는 유리/유리 접합, 진공배기, 게터기술, 그리고 시뮬레이션, 진공패키징 기술을 연구하였다. 유리/유리 접합은 프릿 글래스를 사용하므로 형태에 따르고, 내부 압력은 $2{\times}10^{-5}$[Torr]이며 패널로서 완성을 보여준다. 게터의 결과에 따라 그것은 압력의 증가는 박막 게터에 의해 불순기체가 줄어드는 것을 보여주었다.

Qualitative Research on Decisive Issues of Halal Logistics In India

  • Potluri, Rajasekhara Mouly;Potluri, Lohith Sekhar
    • Asian Journal of Business Environment
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    • 제7권4호
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    • pp.27-33
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    • 2017
  • Purpose - The paper aims to explore the critical and uncover issues encountered to the supply-chain companies in launching halal based services in India. Research design, data, and methodology - After a meticulous review of relevant literature on the halal concept and halal logistics, researchers involved in a data collection by conducting semi-structured focus group interviews. Four groups with a maximum of 5 members each have chosen from the areas of transportation, warehousing, certification, and packaging. A total of 20 questionnaires were collected by applying purposive sampling method. Results - More than 95 percent of the chosen focus groups agreed that they know only about halal but don't have any exposure to halal logistics. The discussion has revealed that the adoption rate for halal transportation, warehousing, halal certification, and packaging is almost zero. The respondents were chosen only from transportation, warehousing, certification and packaging companies from south India which are operating throughout India. This research never attempts to be acquainted with the opinions of channel members who directly or indirectly involved in meeting customer demands. Conclusions - This is a ground-breaking effort aimed to study the critical issues related to Indian halal logistics which is beneficial to both logistic companies as well as to the academic world.

Microbial changes under packaging conditions during transport and comparison between sampling methods of beef

  • Yim, Dong-Gyun;Jin, Sang-Keun;Hur, Sun-Jin
    • Journal of Animal Science and Technology
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    • 제61권1호
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    • pp.47-53
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    • 2019
  • This study was performed to evaluate the microbial and temperature changes of boxed beef during transport and distribution under vacuum and modified atmosphere packaging (MAP), and to compare between excision and swab sampling for 15 days. The top round and striploin (quality grade 1) from Hanwoo steers at 2 days post-slaughter were obtained from a local meat processing plants and chilled at $4{\pm}2^{\circ}C$ in a cold room. The boxes were transported under refrigeration ($4{\pm}2^{\circ}C$) to the laboratory within half an hour. Vacuum and MAP packs were subsequently taken out from cool boxes, and microbiological examinations were carried out at 0, 6, 12, and 24 h of storage time. MAP was more effective than vacuum packaging for the inhibition of total aerobic, lactic acid bacteria and Pseudomonas (p < 0.05). Microbial loads of swab methods were slightly lower than those of excision ones (p < 0.05). The results of this study could be utilized by meat consumers in future studies as well as by manufacturers to determine the ideal storage conditions for cool boxed meat, thus ensuring reduced economic losses due to spoilage.