Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.02a
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- Pages.17-25
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- 2004
X-RAY Inspection for PCB/SMT & Electronics Components Latest Development
Abstract
During the past few years, advances have been made in both in X-ray tube and detector technologies. The field of microfocus radioscopy has been established as an important testing process and has expanded into many new industrial applications that require quality control or process optimization. The first nanofocus and multifocus X-ray systems have become available with a focal spot of .5 micron. In the existing range of microfocus X-ray tubes, further improvements have been achieved as well, such as increased long term stability of intensity position constancy. Software, image processing and manipulation techniques have all progressed as well, allowing X-ray to become a formidable non-destructive inspection method for manufacturers in virtually every industry, especially those involved with Electronic Packaging and SMT.
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