• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.21 no.1
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• pp.1-10
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• 2015

Enzyme kinetics-based respiration model can be effectively used for estimating respiration rate in $O_2$ consumption and $CO_2$ production of fresh produce as a function of $O_2$ and $CO_2$ concentrations. Arrhenius equation can be applied to describe the temperature dependence of the respiration rate. Parameters of enzyme kinetics-based respiration model and activation energy of Arrhenius equation were compiled from analysis of literature data and closed system experiment. They enable to estimate the respiration rate for any modified atmosphere conditions at temperature of interest and thus can be used for design of modified atmosphere packaging of fresh produce.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.20 no.3
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• pp.113-120
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• 2014

Packaging has played important function on marketing as a silent salesman. As an interface of consumer and products, packaging fulfills several functions such as protection, sales promotion, communication and convenience during the distribution process. For the appearance of self-service sales method, packaging could be regarded as important salesman influencing consumers' preference on shelf in the shop. In this study, Vitamin water was selected as the proper target product for lower impact of prices and brands. With previous studies, Vitamin water packaging elements were classified as 'packaging material', 'packaging shape', 'label color', 'logo layout', then each packaging element was consist of details. To measure the influence of each packaging element on consumers' preference quantitatively and to minimize respondent's subjective judgment, Analytic Hierarchy Process (AHP) was used as a tool. Through AHP result, packaging element of the most influence on consumers' preference is 'label color (0.370)', and 'container shape (0.246)', 'container material (0.230)', 'logo layout (0.154)' was in order. Among the detail packaging element, 'plastic (0.405)' has the greatest influence in 'container material' and 'cylinder (0.423)' in 'container shape', 'magenta (0.329)' in 'label color', 'vertical layout (0.572)' in 'logo layout'.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.31-35
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• 2014

The thickness dependent electrical, structural, and optical properties of ZnO films grown by atomic layer deposition (ALD) at various growth temperatures were investigated. In order to deposit ZnO films, diethylzinc and deionized water were used as metal precursor and reactant, respectively. ALD process window was found at the growth temperature range from $150^{\circ}C$ to $250^{\circ}C$ with a growth rate of about $1.7{\AA}/cycle$. The electrical properties were studied by using van der Pauw method with Hall effect measurement. The structural and optical properties of ZnO films were analyzed by using X-ray diffraction, field emission scanning electron microscopy, and UV-visible spectrometry as a function of thickness values of ZnO films, which were selected by the lowest electrical resistivity. Finally, the figure of merit of ZnO films could be estimated as a function of the film thickness. As a result, this investigation of thickness dependent electrical, structural, and optical properties of ZnO films can provide proper information when applying to optoelectronic devices, such as organic light-emitting diodes and solar cells.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• Food Science of Animal Resources
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• v.34 no.1
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• pp.80-87
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• 2014

Ready-to-eat (RTE) Jokbal (Pig's trotter), which consists of pig's feet cooked in soy sauce and various spices, is a very popular and widely sold in Korean retail markets. Commercially, the anaerobically packed Jokbal have also become a popular RTE food in several convenience stores. This study evaluates the effects of storage temperature and packaging methods for the growth of C. perfringens in Jokbal. Growth kinetic parameters of C. perfringens in aerobically and anaerobically packed Jokbals are determined at each temperature by the modified Gompertz equation. The lag time, specific growth rate, and maximum population density of C. perfringens are being analyzed as a function of temperature and packaging method. The minimum growth temperature of C. perfringens in aerobically and anaerobically packed Jokbal is $24^{\circ}C$ and $18^{\circ}C$, respectively. The C. perfringens in Jokbal did not grow under conditions of over $50^{\circ}C$ regardless of the packaging methods, indicating that the holding temperature of Jokbal in markets must be maintained at above $50^{\circ}C$ or below $18^{\circ}C$. Growth of C. perfringens in anaerobically packed Jokbal is faster than in aerobically packed Jokbal when stored under the same conditions. This indicates that there are a higher risks associated with C. perfringens for anaerobically packed meat products.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.125-131
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• 2014

In order to develop stretchable substrates for wearable packaging applications, the variation behavior of elastic modulus was evaluated for transparent PDMS Sylgard 184 and black PDMS Sylgard 170 as a function of the base/curing agent mixing ratio. Both for Sylgard 184 and Sylgard 170, the true elastic modulus evaluated on a true stress-true strain curve was higher more than two times compared to the engineering elastic modulus obtained from an engineering stres-sengineering strain curve, and their difference became larger with increasing the stiffness of the PDMS. Sylgard 184 exhibited a maximum engineering elastic modulus of 1.74 MPa and a maximum true elastic modulus of 3.57 MPa at the base/curing agent mixing ratio of 10. A maximum engineering elastic modulus of 1.51 MPa and a maximum true elastic modulus of 3.64 MPa were obtained for Sylgard 170 at the base/curing agent mixing ratio of 2.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.37-42
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• 2003

In soldering of electronic packaging, the research on substituting lead-free solder materials for Pb-Sn alloys has become active due to environmental and health concerns over the use of lead. The reliability of the solder joint is very important in the development of solder materials and it is known that it is related to wettability of the solder over the substrate and microstructural evolution during soldering. It is also highly affected by type and extent of the interfacial reaction between solder and substrate and therefore, it is necessary to understand the interfacial reaction between solder and substrate completely. In order to predict the intermetallic compound (IMC) phase which forms first at the substrate/solder interface during the soldering process, a thermodynamic methodology has been suggested. The activation energy for the nucleation of each IMC phases is represented by a function of the interfacial energy and the driving force for phase formation. From this, it is predicted that the IMC phase with the smallest activation energy forms first. The grain morphology of the IMC at the solder joint is also explained by the calculations which use the energy. The Jackson parameter of the IMC grain with a rough surface is smaller than 2 but it is larger than 2 in the case of faceted grains.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.16 no.2_3
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• pp.53-58
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• 2010

Internal gas composition of single unit persimmon package was evaluated at $-1^{\circ}C$ as function of package film area and fruit weight in order to find packaging conditions to achieve the optimal modified atmosphere beneficial for keeping the freshness. With large fruit size(${\approx}230\;g$), low permeable films (LLDPE/PP in 35 or $40\;{\mu}m$ thickness and $30\;{\mu}m$ OPP) with an exact fitness to the fruit (surface area of $0.040\;m^2$) resulted in anaerobic atmosphere with occurrence of browning in long term storage. With medium (${\approx}210\;g$) and medium small (${\approx}190g$) sizes, larger surface area of low permeable $35\;{\mu}m$ LLDPE/PP film provided higher $O_2$ and lower $CO_2$ concentrations causing higher occurrence of softening and blackening discoloration. On the other hand, smaller surface area of lower $O_2$ and higher $CO_2$ concentrations had a high risk of browning. Wise combination of fruit size, packaging film and surface area is required for attaining the beneficial modified atmosphere to prevent the physiological injuries.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.