• 골판지포장물류
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• 제4권18호
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• pp.43-46
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• 1997

• 골판지포장물류
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• 제4권18호
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• pp.47-51
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• 1997

• Transactions on Electrical and Electronic Materials
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• 제15권2호
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• pp.91-95
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• 2014

This paper presents the structure and process technology of simple and low-cost wafer-level packaging (WLP) for thin film radio frequency (RF) devices. Low-cost practical micromachining processes were proposed as an alternative to high-cost processes, such as silicon deep reactive ion etching (DRIE) or electro-plating, in order to reduce the fabrication cost. Gold (Au)/Tin (Sn) alloy was utilized as the solder material for bonding and hermetic sealing. The small size fabricated WLP of $1.04{\times}1.04{\times}0.4mm^3$ had an average shear strength of 10.425 $kg/mm^2$, and the leakage rate of all chips was lower than $1.2{\times}10^{-5}$ atm.cc/sec. These results met Military Standards 883F (MIL-STD-883F). As the newly proposed WLP structure is simple, and its process technology is inexpensive, the fabricated WLP is a good candidate for thin film type RF devices.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.9-25
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• 2001

Fairchild has been developing a new class IPM called SPM consisting of dramatic Packaging technology to achieve the lowest cost rind better performance for low power home appliances and industrial AC drive applications. The first Fairchild SPM development with IGBT 600V/15A for washing machine application started in 1999 and was completed successfully. Fairchild SPMs are going to be the best solution for low power inverter-driven AC drive system after 2001. The new SPM Packages like SPM ∥ and SPIM for the next generation IPM with the highest competitiveness (cost & performance) shall be continuouslly developed.

• 마이크로전자및패키징학회지
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• 제23권3호
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• pp.1-6
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• 2016

IoT 적용을 위해서는 다종 소자를 높은 connectivity 밀도로 집적화시키는 전자패키징 기술이 매우 중요하다. FOWLP 기술은 입출력 밀도가 높고, 소자의 집적화가 우수하고, 디자인 유연성이 우수하여, 최근 개발이 집중되고 있는 기술이다. 웨이퍼나 패널 기반의 FOWLP 기술은 초미세 피치 RDL 공정 기술과 몰딩 기술 개발이 최적화 되어야 할 것이다. 3D stacking 기술 특히 웨이퍼 본딩 후 TSV를 제조하는 방법(via after bonding)은 가격을 낮추면서 connectivity를 높이는데 매우 효과적이라 하겠다. 하지만 저온 웨이퍼 본딩이나 TSV etch stop 공정과 같이 아직 해결해야할 단위 공정들이 있다. Substrate 기술은 두께를 줄이고 가격을 낮추는 공정 개발이 계속 주목되겠지만, 칩과 PCB와의 통합설계(co-design)가 더욱 중요하게 될 것이다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.257-261
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• 2004

Recently, Pb free solder technologies are developed, and start using for many packaging items. But this technology contains many problems. They are very high re-flow temperature and high cost than normal solder paste. Specially, high re-flow temperature effects heavy damage to packaging and occur many crack to packaging. We developed special ACI (anisotropic conductive ink) that becomes substitution of solder paste. This technology cans adhesive lower temperature such as $120\~150^{\circ}C$. Adhesion time is very short, too. This technology is suitable for mass production.

• 한국포장학회지
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• 제10권1호
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• pp.47-54
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• 2004

Normally, the single wall(SW) corrugated board has more advantages than double wall (DW) corrugated board in terms of the cost of the materials and logistics. For instance, the SW corrugated board has 3 layer papers whereas the DW corrugated board has 5 layer papers. The thickness of the SW is about 5mm, but that of the DW is 8mm. Accordingly, the SW corrugated board is quite more used in the developed countries than the DW corrugated board. But in Korea, the DW corrugated board is quite more used. The reason why more DW corrugated board are used than the SW corrugated in Korea is that in order that the SW corrugated board has the same box compression strength as DW corrugated board, the cost of the SW corrugated board is higher than that of the DW corrugated board because the virgin kraft liners are all imported from overseas. In this study, the physical properties such as flat crush strength and column crush strength of typical SW corrugated board and single wall dual-layer medium corrugated board and their costs were analyzed. The analysis resulted in that single wall dual-layer medium corrugated board has the same thickness as the SW corrugated board but the more flat crush strength and column crush strength and the less cost than the SW corrugated board.

• 토지주택연구
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• 제11권1호
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• pp.95-101
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• 2020

In the past few decades, the global population growth and rapid economic development have resulted in significant increases in building energy consumption. To reduce greenhouse-gas emissions and building energy consumption, building materials and energy technologies must be optimized. Building retrofitting is a more efficient method than reconstruction to improve the building energy performance. In order to improve the energy performance of existing buildings, this study proposed energy-efficiency retrofit plans and derived cost-effective retrofit plan. The energy efficient retrofit method is achieved through the packaging of energy technology and the energy and cost reduction effect of the energy efficiency retrofit package are analyzed. As a result of the study, the energy-efficiency retrofit package showed an energy reduction effect of up to 60% or more and a construction cost reduction of about 30%. This study argues that optimal energy and construction cost reduction of existing buildings are possible through the packaging of energy efficiency technology.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.163-193
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• 1999

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.27-27
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• 2000