Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.09a
- /
- Pages.257-261
- /
- 2004
Solder Free Systems by ACI and NCP
- Okuno Atsushi (Sanyu Rec Co., Ltd.) ;
- Ishitani Masaki (Sanyu Rec Co., Ltd.) ;
- Kodera Yoshiaki (Sanyu Rec Co., Ltd.)
- Published : 2004.09.01
Abstract
Recently, Pb free solder technologies are developed, and start using for many packaging items. But this technology contains many problems. They are very high re-flow temperature and high cost than normal solder paste. Specially, high re-flow temperature effects heavy damage to packaging and occur many crack to packaging. We developed special ACI (anisotropic conductive ink) that becomes substitution of solder paste. This technology cans adhesive lower temperature such as
Keywords