• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 추계 기술심포지움 논문집
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• pp.77-81
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• 1999

• 한국정보시스템학회:학술대회논문집
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• 한국정보시스템학회 2001년도 추계학술대회 발표논문집:차세대 전상거래 시대의 비즈니스전략
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• pp.158-165
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• 2001

The certification of software products can provide a greater level of acceptance and feeling of security to customers of these products. This paper presents a certification method for the quality of package software. First of all, the evaluation criteria are derived from ISO/1EC 9126 and 12119 standards, and then the evaluation module are designed considering the measurement scale type. The results can be applied to construct the certification scheme of software product quality for the commercial purpose.

• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2002년도 춘계학술대회
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• pp.193-197
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• 2002

The certification of software products can provide a greater level of acceptance and feeling of security to customers of these products. This paper presents a certification method for the quality of package software. First of all, the evaluation criteria are derived from IS0/1EC 9126 and 12119 standards, and then the evaluation module are designed considering the measurement scale type. The results can be applied to construct the certification scheme of software product quality for the commercial purpose.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.588-592
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• 1996

In this paper, we have constructed an expert system for semiconductor chip encapsulation which combines a knowledge-based system with CAE software. The knowledge-base module includes heuristic and pre-analysis knowledge for evaluation and redesign. Evaluation of the initial design and generation of redesign recommendations can be developed from the rules as applied to a given chip Package. The CAE programs can be used for simulating the filling and packing stage of encapsulation process. The expert system is a new tool which enables package design or process conditions with high yields and high productivity.

• 대한안전경영과학회지
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• 제4권1호
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• pp.93-103
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• 2002

The certification of software products can provide a greater level of acceptance and feeling of security to customers of these products. This paper presents a certification method for the quality of package software. First of all, the evaluation criteria are derived from ISO/IEC 9126 and 12119 standards, and then the evaluation module are designed considering the measurement scale type. The results can be applied to construct the certification scheme of software product quality for the commercial purpose.

• 한국통신학회논문지
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• 제29권1A호
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• pp.107-112
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• 2004

본 논문은 SFF/SFP 광 송수신기에 사용되는 TO-38 패키지의 대역폭 향상을 위해 여러 구조적 변수를 변화시켜 최적화하여 3dB대역폭의 성능향상을 제안하였다. 먼저 실험을 통해 PIN PD 칩에 인가된 바이어스에 따른 캐패시턴스 값을 구하였으며 TO-can 패키지의 주파수 응답을 측정하여 3.5GHz의 3dB 대역폭을 얻었다. 또한 3차원 시뮬레이션으로 측정치와의 주파수 응답 특성의 일치를 재확인하였다. 더 나은 주파수 응답을 얻기 위해 TO-can 패키지 여러 물리적 구조 변수를 변화시켜 최적화시킨 TO-38 패키지는 3dB대역폭 15GHz의 아주 우수한 성능향상을 보였으며 이는 10Gbps대의 bit rate 성능을 만족할 수 있는 SFF/SFP 광 송수신기 모듈에 적용이 가능하다.

• 대한기계학회논문집A
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• 제39권10호
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• pp.1011-1019
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• 2015

Insulated gate bipolar transistor (IGBT) 소자는 전동차, 항공기 및 전기 자동차에 가장 많이 사용되는 고전압, 고전력용 전력 반도체이다. 그러나 IGBT 전력소자는 동작 시 발열 온도가 매우 높고, 이로 인해, IGBT 소자의 신뢰성 및 성능에 큰 영향을 미치고 있다. 따라서 발열 문제를 해결하기 위한 IGBT 모듈 패키지의 방열 설계는 매우 핵심적인 기술이며, 특히, 소자가 동작 한계 온도에 올라가지 않도록 방열 설계를 적절히 수행하여야 한다. 본 논문에서는 전동차에 사용되는 1200 A, 3.3 kV 급 IGBT 모듈 패키지의 열 특성에 대해 수치해석을 이용하여 분석하였다. IGBT 모듈 패키지에 사용되는 다양한 재료 및 소재의 두께에 대한 영향을 분석하였으며, 실험계획법을 이용한 최적화 설계를 수행하였다. 이를 통하여 열 저항을 최소화하기 위한 최적의 방열 설계 가이드 라인을 제시하고자 하였다.

• 전자공학회논문지A
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• 제31A권3호
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• pp.28-39
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• 1994

We experimented on memory multichip modules to increase the packing density of memory devices and to improve their electrical characteristics. A 128K$\times$8bit SRAM module was made of four 32K$\times$8bit SRAM memory chips. The memory multichip module was constructed on a low-cost double sided PCB(printed circuit boared) substrate. In the process of fabricating a multichip module. we focused on the improvement of its electrical characteristics. volume, and weight by employing bare memory chips. The characteristics of the bare chip module was compared with that of the module with four packaged chips. We conducted circuit routing with a PCAD program, and found the followings: the routed area for the module with bare memory chips reduced to a quarter of that area for module with packaged memory chips. 1/8 in volume, 1/5 in weight. Signal transmission delay times calculated by using transmission line model was reduced from 0.8 nsec to 0.4 nsec only on the module board, but the coupling coefficinet was not changed. Thus, we realized that the electrical characteristics of multichip packages on PCB board be improved greatly when using bare memory chips.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권4호
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• pp.295-301
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• 2011

A triple-band transceiver module for 2.3/2.5/3.5 GHz mobile WiMAX, IEEE 802.16e, applications is introduced. The suggested transceiver module consists of RFIC, reconfigurable/multi-resonance MIMO antenna, embedded PCB, mobile WiMAX base band, memory and channel selection front-end module. The RFIC is fabricated in $0.13{\mu}m$ RF CMOS process and has 3.5 dB noise figure(NF) of receiver and 1 dBm maximum power of transmitter with 68-pin QFN package, $8{\times}8\;mm^2$ area. The area reduction of transceiver module is achieved by using embedded PCB which decreases area by 9% of the area of transceiver module with normal PCB. The developed triple-band mobile WiMAX transceiver module is tested by performing radio conformance test(RCT) and measuring carrier to interference plus noise ratio (CINR) and received signal strength indication (RSSI) in each 2.3/2.5/3.5 GHz frequency.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.33-49
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• 2002

$\Box$ LTCC/LTCC-M technologies are a cost-effective SOP technology $\Box$ LTCC/LTCC-M materials have good RF characteristics and the materials can be used as excellent substrates for high band width applications $\Box$ Reliability of LTCC/LTCC-M package or module can be greatly improved by embedded passive technology and CTE control of the substrates $\Box$ To expand the application area, more development is needed in realization of embedded passives with tight tolerance