Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 1999.11a
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- Pages.77-81
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- 1999
Thermal Analysis of IGBT Power Module Package by Finite Element Method
유한요소법에 의한 IGBT 전력반도체 모듈의 열해석
Abstract
Keywords