• Corrosion Science and Technology
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• 제6권2호
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• 대한간호학회지
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• 제30권3호
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• pp.741-749
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• 2000

This study was performed to investigate the relationship between reversed circadian blood pressure and risk factors of peripheral vascular disease in non-insulin-dependent diabetes mellitus (NIDDM) subjects. The subjects in this study were 18 NIDDM patients who were hospitalized in a medical unit of an university medical center located in Incheon, Korea, between November, 1998 and March, 1999. Blood pressure was measured with a mercury sphygmomanometer by 2 trained examiners every 2 hours during 24 hours. NIDDM subjects were divided into a dipper group and non-dipper group. Dippers are defined as those who show a mean nighttime blood pressure(BP) drop of more than 10% compared with daytime BP. Non-dippers are defined as those who show a mean nighttime BP drop of less than 10%, or an elevation in BP compared with daytime BP. Daytime BP included values obtained between 6 a.m. and 10 p.m. Night time BP included values obtained between 10 p.m. and 6 a.m. Data was analyzed by SPSS/PC package. Chi-square( $^2$) test was used for the comparison of sex between The dipper group and non-dipper group. Mann-Whitney test was used for comparisons of values of the risk factors of peripheral vascular disease and the frequency of complications of diabetes between the dipper group and non-dipper group. The results are as follows. There were no significant differences in daytime systolic, diastolic, and mean blood pressures between the dipper group and non-dipper group. However, night time systolic, diastolic, and mean blood pressures in the non-dipper group were significantly nigher than those in the dipper group (p=.021). There were no differences in sex, age, body, weight, duration of diabetes, serum lipid levels, BUN and HbA1c between the two groups. On the contrary, 87.5% of non-dipper group subjects showed having hypertension, 30% of dipper group subjects showed having hypertension and this difference was statistically significant (p=.018). All of the non-dipper group subjects (N=8) showed having at least one diabetic complication. However, 40% of the dipper group subjects (N=10) showed having no diabetic complication at all and this difference was also statistically significant (p=.049). There were no significant differences in frequency of nephropathy, neuropathy and retinopathy between the dipper group and non-dipper group.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Korean Chemical Engineering Research
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• 제60권2호
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• pp.308-312
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• 2022

3D 프린팅 기술은 다양한 재료를 적층하여 구조물을 제작할 수 있으며, 다양한 장점을 바탕으로 최근 제조분야에 널리 활용되고 있다. 특히 고해상도의 액적 기반 3D 프린팅 기술은 주로 광경화성 물질을 사용하여 액적을 증착해 나가며 최종 구조물을 형성한다. 물질의 광경화 특성으로 인해 프린팅 과정에서 발생할 수 있는 빛 노출에 따라 액적의 물성 및 증착 특성이 달라질 수 있다. 이에 본 연구에서는 광경화성 하이드로겔 액적의 빛에너지 조사 조건에 따른 액적의 점도변화 및 표면과의 퍼짐 거동에 관해 실험적으로 관찰 및 분석을 수행하였다.

• 대한치과기공학회지
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• 제36권2호
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• pp.83-89
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• 2014

Purpose: This study is to evaluate the effect of modeling liquid on the shear-bond strength between zirconia core and veneering ceramic. Methods: Disk-shaped (diameter: 12.0mm; height: 3.0mm) zirconia were randomly divided into six groups according to the surface conditioning method and whether modeling liquid is used or not to be applied (N=60, n=10 per group): group 1-control group with distilled water(ZD); group 2-control group with modeling liquid(ZM); group 3-airborne particle abrasion with $110-{\mu}m$ $Al_2O_3$(AD) with distilled water; group 4-airborne particle abrasion with $110-{\mu}m$ $Al_2O_3$ with modeling liquid(AM); group 5-liner with distilled water(LD); group $6{\pounds}{\neq}liner$ with modeling liquid(LM). Contact angles were determined by the sessile drop method at room temperature using a contact angle measurement apparatus. The specimens were prepared using dentin veneering ceramics, veneered, 3mm high and 2.8mm in diameter, over the cores. The shear bond strength test was performed in a Shear bond test machine. Load was applied at a cross-head speed of 0.50mm/min until failure. The fractured zirconia surfaces were evaluated by using stereomicroscope (${\times}30$). Collected data were analyzed using SPSS(Statistical Package for Social Sciences) Win 12.0 statistics program. Results: ZD showed the highest contact angle($50.6{\pm}5.4^{\circ}$) and LD showed the lowest value($6.7{\pm}1.3^{\circ}$). Control groups and zirconia liner groups were significantly higher contact angle than liner groups(p<0.05). LD was the highest shear bond strength($43.9{\pm}3.8MPa$) and ZD was the lowest shear bond strength($24.8{\pm}4.9MPa$). Shear bond strengths of control groups and contact angle of liner groups were not significantly different((p>0.05). Liner groups presented adhesive failures. The others groups showed cohesive and adhesive failures. Conclusion: Modeling liquid groups showed lower contact angles and lower shear bond strength compared to those of distilled water groups.

• 핵의학기술
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• 제14권2호
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• pp.26-32
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• 2010

핵의학 체내검사 업무 단계 별 작업종사자의 피폭선량을 측정 및 분석하여 환자 검사 및 업무효율 저하를 발생시키지 않는 범위 내에서 종사자의 피폭선량을 최소로 감소할 수 있는 방법을 알아보고자 하였다. 방사성동위원소를 이용한 핵의학 체내검사 업무는 방사성 동위원소 분배, 방사성동위원소 주사($^{99m}Tc$, $^{18}F$-FDG), 환자 안내 및 검사로 이루어진다. RadEye-G10 측정기기(Thermo SCIENTIFIC)를 이용하여 각 업무 단계 별 피폭선량을 측정 및 분석 하였다. 방사성동위원소를 환자에게 주사하는 과정에서 많은 피폭이 발생하므로 작업종사자의 피폭선량을 최소로 줄일 수 있도록 외부피폭 방어에 대한 교육과 방사성동위원소 주사 시 보호구를 착용하도록 하였으며 주사 전 검사에 대한 설명 및 주의사항을 교육하여 주사 후 환자와의 대면시간을 단축하여 피폭선량을 줄이도록 하였다. 방사성동위원소 주사 시 보호구 착용 유무에 따른 피폭선량과 주사 전 검사에 대한 설명 및 주의사항 교육 유무에 따른 피폭선량을 측정하였다. 총 피폭선량은 icrosoft office Excel 2007을 이용하여 그래프로 나타내었으며 피폭선량의 차이는 SPSS program 12.0을 이용하여 wilcoxon signed ranks test로 분석 하였다. 이 때 p값이 0.01 이하인 경우 통계적으로 유의 하다고 판단하였다. $^{99m}Tc$-DPD 20 mCi를 보호구를 착용하고 주사 시 피폭되는 선량은 보호구를 착용하지 않고 주사 시 피폭되는 선량보다 88% 감소하였으며 통계적으로 유의한 차이가 있었다 (p<0.01). $^{18}F$-FDG 10 mCi를 보호구를 착용하고 주사 시 피폭되는 선량은 보호구를 착용하지 않고 주사 시 피폭되는 선량보다 26% 감소하였으나 통계적으로 유의한 차이는 없었다(p>0.01). $^{99m}Tc$-DPD 20 mCi를 주사 전 검사에 대한 설명 및 주의사항 교육 시 피폭되는 선량은 주사 후 검사에 대한 설명 및 주의사항 교육 시 피폭되는 선량보다 63% 감소하였으며 통계적으로 유의한 차이가 있었다(p<0.01). $^{18}F$-FDG 10 mCi를 주사 전 검사에 대한 설명 및 주의사항 교육 시 피폭 되는 선량은 주사 후 검사에 대한 설명 및 주의사항 교육 시 피폭되는 선량보다 52% 감소하였으며 통계적으로 유의한 차이가 있었다(p<0.01). 방사성동위원소 $^{99m}Tc$을 이용하는 검사에서는 보호구 착용이 피폭선량을 줄이는데 더 효과적이고 $^{18}F$-FDG를 이용하는 검사에서는 주사 후 환자와의 대면시간을 단축하는 것이 피폭선량을 줄이는데 더 효과적이다. 그러므로 이러한 방사성동위원소의 특성에 따라 차폐 방안을 모색한다면 더욱 더 효과적이고 적극적인 방사선 차폐가 될 것으로 사료된다.