• Communications for Statistical Applications and Methods
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• v.28 no.4
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• pp.369-391
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• 2021

The vlda is an R (R Development Core team et al., 2011) package which provides functions for visualization of multidimensional longitudinal data. In particular, the R package vlda was developed to assist in producing a plot that more effectively expresses changes over time for two different types (long format and wide format) and uses a consistent calling scheme for longitudinal data. The main features of this package allow us to identify the relationship between categories and objects using an indicator matrix with object information, as well as to cluster objects. The R package vlda can be used to understand trends in observations over time in addition to identifying relative relationships at a simple visualization level. It also offers a new interactive implementation to perform additional interpretation, therefore it is useful for longitudinal data visual analysis. Due to the synergistic relationship between the existing VLDA plot and interactive features, the user is empowered by a refined observe the visual aspects of the VLDA plot layout. Furthermore, it allows the projection of supplementary information (supplementary objects and variables) that often occurs in longitudinal data of graphs. In this study, practical examples are provided to highlight the implemented methods of real applications.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.219-225
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• 2002

This paper presents a novel "bumpless flip chip package"for cost! performance driven devices. Using the conventional electroplating and etching processes, this package enables the production of fine pitch BGA up to 256 I/O with single layer routing. An array of circuitry down to $25-50{\mu}{\textrm}{m}$ line/space is fabricated to fan-in and fan-out of the bond pads without using bumps or substrate. Various types of joint methods can be applied to connect the fine trace and the bond pad directly. The resin-filled terminal provides excellent compliancy between package and the assembled board. More interestingly, the thin film routing is similar to wafer level packaging whereas the fan-out feature enables high lead count devices to be accommodated in the BGA format. Details of the design concepts and processing technology for this novel package are discussed. Trade offs to meet various cost or performance goals for selected applications are suggested. Finally, the importance of design integration early in the technology development cycle with die-level and system-level design teams is highlighted as critical to an optimal design for performance and cost.

• Journal of Industrial Convergence
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• v.17 no.4
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• pp.9-14
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• 2019

This paper presents several problems that can occur in the development of the ultra-compact LED package of less than 1.0mm and introduces the solution to them. In the existing mold structure, since the upper and lower core parts are integrated, various errors have occurred due to the roughness of EDM in the small model, which is a limiting factor in further reducing the mold size. As a countermeasure, the prefabricated model was presented in an earlier study to overcome the obstacles to the development of a ultra-compact LED package. In this paper, several problems have been found during the fabrication of prototypes as a starting work to produce the results for the presented model. The types are suggested and the solutions are discussed. And by changing the existing 2-row structure to 3-row structure in the same size lead frame, the aspect of efficient production is considered. The experimental procedure verifies the proposed solution and conducts a test to produce a prototype to confirm that a good product can be produced.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.27 no.3
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• pp.203-210
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• 2021

With the development of package printing technology, the package has expanded from the basic function of protecting products to the marketing function through package design. Color, the visual element that composes the package design, is delivered to the consumer most quickly and effectively. As color marketing of these package designs expands, accurate color reproduction that the product wants to express is becoming more important. The color of an object is transmitted by absorption and scattering of light. Spectral reflectance refers to the intensity of light reflected by an object at different wavelengths by the spectral effect. As a result, the color of the object is expressed in various colors. Packaged printing inks have their own absorption and scattering coefficients, and the Kubelka-Munk model for color reproduction and prediction defines the relationship between these correlation coefficients through reflectance. In the Kubelka-Munk model for color reproduction and prediction, the relationship between the absorption and scattering coefficients (K/S) of printed material is predicted as the sum of the K/S values according to the mixing ratio of all color ink used. In this study, the reflectance of the measured print is reversely calculated at the mixing ratio of print ink using the Kubelka-Munk model. Through this, the relationship value of the ink-specific absorption/scattering coefficient constituting the final printed material is predicted. Delta E is derived through the predicted reflectance, and the similarity between the measured value and the predicted value is confirmed.

• Journal of Agricultural Extension & Community Development
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• v.16 no.3
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• pp.615-641
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• 2009

This study aims to develop Semangum tourism package that can be most suitable for the tourist. The data were obtained by a survey carried out between August, 17 and August, 24, 2009 with a sample of latent tourist of Semangum. Conjoint analysis has been used to estimate the relative importance of attributes. Four main attributes and two or three attributes levels for each determinant were chosen for conjoint analysis. Eleven model package were made using fractional factorial design, and presented to the latent tourist, who were asked to reply in order of their like. Results show that the most important attributes for tourist were in order of cost, connected tourism, accommodation and report activity.

• Computers and Concrete
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• v.9 no.4
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• pp.293-310
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• 2012

This paper discusses a new constitutive model called the high-rate brittle microplane (HRBM) model and also presents the details of a new software package called the Virtual Materials Laboratory (VML). The VML software package was developed to address the challenges of fitting complex material models such as the HRBM model to material property test data and to study the behavior of those models under a wide variety of stress- and strain-paths. VML employs Continuous Evolutionary Algorithms (CEA) in conjunction with gradient search methods to create automatic fitting algorithms to determine constitutive model parameters. The VML code is used to fit the new HRBM model to a well-characterized conventional strength concrete called WES5000. Finally, the ability of the new HRBM model to provide high-fidelity simulations of material property experiments is demonstrated by comparing HRBM simulations to laboratory material property data.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1702-1703
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• 2011

MEMS 소자의 Wafer level Package 관련하여 Deep cavity를 가진 Cap Wafer와 Polymer bonding 중 cavity 단차로 인한 Polymer Patterning 및 접합 불량의 어려움을 극복할 수 있는 새로운 공정 flow를 제안하였다. Cavity를 형성할 때 사용하는 Si deep etching Mask인 기존의 Photoresist를 접합용 감광성 Polymer로 대체하고, cavity 형성 후, 별도의 추가 공정 없이 이 Polymer를 이용해 Wafer bonding을 진행하였다. 이를 통해 cavity 단차에 따른 문제를 해결함과 동시에 공정이 단순하고 제작 비용이 저렴하며, 신뢰성 있는 Wafer level Package를 구현하였다.

• The monthly packaging world
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• s.147
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• pp.80-84
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• 2005

• The monthly packaging world
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• s.197
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• pp.88-93
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• 2009

• The monthly packaging world
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• s.233
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• pp.96-100
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• 2012