• 제어로봇시스템학회:학술대회논문집
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• 1987.10b
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• pp.277-281
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• 1987

This paper describes the development of an expert system for control system designs. Our CACSD expert system consists of 2 parts; one is the knowledge manager and the other is the CACSD package. The knowledge manager contains the inference engine and the control experts' knowledge. The CACSD package consists of the control algorithms used by the knowledge manager. The prototype system of our CACSD expert system is implemented on the IBM PC/AT and the results of tests are given in this paper.

• 한국기계연구소 소보
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• s.16
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• pp.75-81
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• 1986

본 논문에서는 기계부품 요소의 설계와 분석에 사용되는 대화식 Graphics package KIMMPAK 을 설계.구현하였다. 2차원의 Plotting 루틴과 Device driver로 구성된 KIMMPAK은 TEKTRONIX 그래픽 터미널을 Drive할 수 있는 PLOT10-TCS와, IBM-PC용의 Multi-HALO(MHA¬LO), 그리고 HP Plotter의 PLOT-21 그래픽 라이브러리를 이용하여 Device Driver를 구축하였다. 이로 인한 KIMMPAK의 Device 독립성의 증가는 패키지 자체의 호환성 및 신뢰성을 높이고 있다. KIMMPAK은 VAX/VMS V4 . 2 운영체제하에서 FORTRAN-77의 부프로그램 형태로 구현되어 있으며, IBM-PC에서 사용 가능하도록 MS-FORTRAN으로 변화된 PC용 KIMMPAK이 따로 설계.구현되었다.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.05a
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• pp.248-251
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• 2009

20W 급 LED Tube의 개발을 위하여 LED Package의 광효율이 70lm/W이상을 갖는 Package를 자체 제작하고 이를 적용하여 LED Tube의 광학, 방열 및 기구 구조 설계를 하여 시제품을 제작하였다. 그 결과 시제품의 성능은 광속 1081 lm, 상관색온도 6818 K, Ra 75.71이 성능을 갖는 20W LED Tube를 개발하였다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.34-39
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• 2003

Seam seal welding on the semi-conductor package is a process for sealing the packages of semiconductors, crystal parts, saw filters, oscillators with lid plate by seam welding. This paper present the development process of automatic seam seal welding system. In this process, the process algorithm, high precision welding current control, design of welding head, high speed and high precision feeding mechanism, user interface process control program technologies are included.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• Journal of the Korea Convergence Society
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• v.8 no.12
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• pp.23-29
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• 2017

This paper introduces the mold technology for the development of ultra-compact package of less than 1mm, and also analyze the error pattern of the results using this mold technology. The existing ultra-small mold structure was one-piece, which caused the surface of EDM to be rough and increase the error rate. This has been an obstacle to further reducing the size of the mold. On the other hand, the proposed mold technology tries to overcome the limitation of the one-piece type by using the prefabricated type method. This paper also classify defect patterns in the results of the proposed mold structure and analyze the occurrence probability of each pattern to use as a basic data to develop a detector.

• The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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• v.19 no.2
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• pp.67-81
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• 1990

The objective of this is to develop a practical software package to calculate annual energy consumption of HVAC (Heating Ventilating, and Air Conditioning) System in a building. It can quickly estimate loads and energy consumption, and have a function of economic analysis through the estimation of operating cost. Techniques of save energy consumption used in a building are necessary from the stage of design process to operation. The single most significant task is on HVAC Systems. Their installation costs, and related operating costs have enormous influence upon initial and maintenance costs. HVAC designers and engineers now have a wide variety of software choices available, but only a few of them have been developed in this country and no source program has been disclosed. Neither load culculation nor estimation of energy consumption is systematically made by the domestic HVAC design firms. Even though computer improved over the years with a trend of large scale load calculation and system selection through simulaion, the utilization of software nowadays does not make good progress due to lack of working environment. Therefore, it is necessary to develop a practical software package with which load calculation can be made with ease and kind manner. This study concerns the development of a software package which makes it possible to design HVAC system and save energy consumption in operation. The algorithm used in this program is a Modified Bin Method widely known as a simplified energy analysis means.

• The Journal of the Korea Contents Association
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• v.16 no.1
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• pp.42-51
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• 2016

For changes in the distribution structure these days, consumer demand is moving rapidly from offline to online. The consumers' mentality to purchase products conveniently is reflected in this phenomenon. Also for agricultural products, safety to protect contents, brand and design which can provide credibility to consumers are recognized as most important than ever. Especially, strawberry is thin-skinned so that the quality of product may deteriorate even with weak impact and shaking, so it is significantly influenced by the structural packaging or material. Also, strawberry is frequently distributed through direct trading, it is the reality that the package design of strawberry is less competitive than that of other products due to inadequate environments of commercial farms. That is, the demand of strawberry increases everyday but the strawberry package cannot fulfill the needs of producers and consumers. In order to reinforce competitiveness in strawberry sales, it is urgent to carry out fundamental studies regarding the development of package. Therefore, the purpose of this study is to supplement and improve issues arising from the usage of current strawberry package. Through the analysis of strawberry package elements (shape, material, design) and understand the points of improvement sought by producers and consumers through IPA MAP (importance, satisfaction level) analysis.

• The Journal of the Acoustical Society of Korea
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• v.38 no.2
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• pp.200-206
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• 2019

In this paper, the characteristics of receiving voltage sensitivity about acoustic package in towed array sonar is analyzed through the numerical simulation and design of experiments. Simulation results show that the variation of receiving voltage sensitivity is caused by the structural resonance mode shape on baseline acoustic package. The effect of design parameters of the acoustic package are analyzed through the design of experiments to reduce the deviation of receiving voltage sensitivity. A change of hydrophone shield can thickness (t) is the greatest effect on the deviation of receiving voltage sensitivity. As a result of water tank test, the acoustic package derived from the design of experiments has reduced deviation of receiving voltage sensitivity.

• Composites Research
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• v.34 no.1
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• pp.47-50
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• 2021

In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.