Journal of the Korea Convergence Society (한국융합학회논문지)

Korea Convergence Society (한국융합학회)
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Development of Ultra-compact LED Package and Analysis of Defect Type

극소형 LED 패키지의 개발과 불량 유형의 분석

  • 이종찬 (청운대학교 인터넷학과)
  • Received : 2017.10.24
  • Accepted : 2017.12.20
  • Published : 2017.12.28
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Abstract

This paper introduces the mold technology for the development of ultra-compact package of less than 1mm, and also analyze the error pattern of the results using this mold technology. The existing ultra-small mold structure was one-piece, which caused the surface of EDM to be rough and increase the error rate. This has been an obstacle to further reducing the size of the mold. On the other hand, the proposed mold technology tries to overcome the limitation of the one-piece type by using the prefabricated type method. This paper also classify defect patterns in the results of the proposed mold structure and analyze the occurrence probability of each pattern to use as a basic data to develop a detector.

본 논문은 1mm 이하의 극소형 패키지 개발을 위한 금형 기술을 소개한다. 또한 이 금형 기술을 사용하여 산출된 결과들의 오류 패턴을 분석한다. 기존의 극소형 금형 구조는 일체형이었는데 EDM의 표면이 거칠어 오류율을 증가시키는 원인이 되었다. 이 원인으로 인해 금형의 크기를 더 줄이는데 방해요소로 작용하였다. 이에 반해 제안하는 금형기술은 기존의 일체형 방식에서 벋어나 조립식 방법을 사용하여 일체식의 한계를 극복하고자 한다. 또한 새로 제안된 금형 구조를 이용해 산출한 결과에 결함 패턴을 분류하고, 각 패턴의 발생 확률을 분석하여 검출기를 개발하려는 기초 자료로 사용하려 한다.

Keywords

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