• Journal of KSNVE
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• v.4 no.3
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• pp.327-335
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• 1994

In this paper, to identify the dynamic characteristics of antenna system, the antenna is divided into 4 components and those were analyzed with a conventional FEM package MSC/NASTRAN. Using a Component Mode Synthesis Method, dynamic characteristics of total system is also identified. The Coherence of each component to total system is evaluated by using strain and kinetic component to total system is evaluated by using strain and kinetic energy. The improving strategy of dynamic characteristics is suggested by changing mass and stiffness of large coherence components.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.491-495
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• 2002

In the paper, a Visual factory model for a optical-components manufacturing process is built. The optical-components manufacturing process is composed of 3 operation processes; optical sub assembly process, package assembly process, and fiber assembly process. Each process is managed not a batch mode, which is one of most popular manufacturing styles to produce a great deal of industrial output, but though a modular cell. In the processes, a modular cell has to be processed independently of the other cells. Optimization for the composition of assembly cell in the optical-components system is made by the Visual factory model.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.636-639
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• 2002

In the paper, a Visual factory model for a optical-components manufacturing process is built. The optical-components manufacturing process is composed of 3 operation processes; optical sub assembly process, package assembly process, and fiber assembly process. Each process is managed not a batch mode, which is one of most popular manufacturing styles to produce a great deal of industrial output, but though a modular cell. In the processes, a modular cell has to be processed independently of the other cells. Optimization for the composition of assembly cell in the optical-components system is made by the Visual factory model.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.75-81
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• 2015

In this paper, numerical analysis by finite element method and parameter design by the Taguchi method were used to reduce warpage of a two passive components embedded double side substrate for PoP(Package on Package). The effect of thickness of circuit layers (L1, L2) and thickness of solder resist (SR_top, SR_BTM) were analyzed with 4 variations and 3 levels(minimum, average and maximum thickness) to find optimized thickness conditions. Also, paste effect of solder resist on unit area of top surface was analyzed. Finally, experiments was carried out to prove numerical analysis and the Taguchi method. Based on the numerical and experimental results, it was known that circuit layer in ball side of substrate was the most severe determining deviation for reducing warpage. Buried circuit layer in chip side, solder resist and were insignificant effects on warpage relatively. However, warpage decreased as circuit layer in ball side thickness increased but effect of solder resist and circuit layer in chip side thickness were conversely.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.133.4-133
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• 2001

In the paper, a Visual factory model for a optical-components manufacturing process is built. The optical-components manufacturing process is composed of 3 operation processes; optical sub assembly process, package assembly process, and fiber assembly process. Each process is managed not a batch mode, which is one of most popular manufacturing styles to produce a great deal of industrial output, but though a modular cell. In the processes, a modular cell has to be processed independently of the other cells. Optimization for the composition of assembly cell in the optical-components system is made by the Visual factory model.

• Transactions on Electrical and Electronic Materials
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• v.9 no.1
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• pp.33-37
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• 2008

This paper describes the development of a new $5.0{\times}3.2mm$ SAW filter bank which is consist of 12 L, C matching components and 4 SAW bare chips on PCB substrate with CSP technology. We improved the manufacturing cost by removing the ceramic package through direct flip bonding of $LiTaO_3$ SAW bare chip on PCB board after mounting L, C passive element on PCB board. After that we realized the hermitic sealing by laminating the epoxy film. To confirm the confidentiality and durability of the above method, we have obtained the optimum flip bonding & film laminating condition, and figured out material property and structure to secure the durability & moisture proof of PCB board. The newly developed super mini $5.0{\times}3.2mm$ filter bank shows the superior features than those of existing products in confidence, electrical, mechanical characters.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.83-87
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• 2022

Recently, as the thickness of the semiconductor package becomes thinner, warpage has become a major issue. Since the warpage is caused by differences in material properties between package components, it is essential to precisely evaluate the material properties of the EMC(Epoxy molding compound), one of the main components, to predict the warpage accurately. Especially, the cure shrinkage of the EMC is generated during the curing process, and among them, the effective cure shrinkage that occurs after the gelation point is a key factor in warpage. In this study, the gelation point of the EMC was defined from the dissipation factor measured using the dielectric sensor during the curing process similar with actual semiconductor package. In addition, DSC (Differential scanning calorimetry) test and rheometer test were conducted to analyze the dielectrometry measurement. As a result, the dielectrometry was verified to be an effective method for monitoring the curing status of the EMC. Simultaneously, the strain transition of the EMC during the curing process was measured using the FBG (Fiber Bragg grating) sensor. From these results, the effective cure shrinkage of the EMC during the curing process was measured.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1479-1487
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• 2011

In the field of the entire electronic component industry including mobile IT products, the importance of a versatile package with the multifunctional or high capacity memories is gradually increased. Multi Chip Package which has several chips in a single package is frequently used for that purpose. In MCP, epoxy adhesive films play a major role in adhesion between the chips or between chip and substrate. A series of silane coupling agents with a functional group such as epoxy, amine, mercaptan, and isocyanate were applied to the epoxy adhesives and material properties such as wettability and reliability of the adhesives were investigated. From the results, the silane coupling agent with an epoxy functional group showed highest wettability and peel strength in epoxy adhesive. For those reasons, it lead to a superior reliability in the epoxy adhesive against interfacial fracture behaviors through moisture resistance test.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.3
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• pp.276-282
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• 2015

This paper proposes a SMD (surface mounting device) classification method for the PCB assembly inspection machines. The package types of SMD components should be classified to create the job program of the inspection machine. In order to reduce the creation time of job program, we developed the automatic classification algorithm for the SMD packages. We identified the chip-type packages by color and edge distribution of the images. The input images are transformed into the HSI color model, and the binarized histroms are extracted for H and S spaces. Also the edges are extracted from the binarized image, and quantized histograms are obtained for horizontal and vertical direction. The neural network is then applied to classify the package types from the histogram inputs. The experimental results are presented to verify the usefulness of the proposed method.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.21 no.10
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• pp.883-889
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• 2011

The brand sound of vehicle diesel engine is recently one of the important advantage strategies in the automotive company. Because various noise components masked under high frequency level can be audible in quieter driving situation. Many researches have been carried out for subjective and objective assessments on vehicle sounds and noises. In particular, the interior sound quality has been one of research fields that can give high quality feature to vehicle products. Vehicle interior noise above 500 Hz is usually controlled by sound package parts. The materials and geometries of sound package parts directly affect on this high frequency noise. This paper describes the sound quality evaluation method for the vehicle diesel engine noise to establish objective criteria for sound quality assessment. Considering the sensitivity of human hearing to impulsive sounds such as diesel noise, the human auditory mechanism was simulated by introducing temporal masking in the time domain. Furthermore, each of the human auditory organs was simulated by computer codes, providing reasonable analytical explanations of typical human hearing responses to diesel noise. This method finally provides the sound quality index of vehicle diesel engine noise that includes high frequency intermittent offensive sounds caused by impacting excitations of combustion and piston slap.