• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.221-221
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• 2006

The SMD type P-N junction diode with ceramic package for diode case were fabricated. It was made this diode with simple process from $Al_2O_3$ ceramic chip, solder preform, diode chip, coating reagent and conductive paste for chip terrmination. Its merit is small size, easy manufacture. fast cooling with ceramic case. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5 28ns, 1322V, 1.08V, $0.45{\mu}A$.

• 마이크로전자및패키징학회지
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• 제29권1호
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• 대한전자공학회논문지SD
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• 제41권12호
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• pp.21-26
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• 2004

본 논문에서는 package된 BJT의 RF 등가회로 모델을 optimization과정 없이 직접 추출하는 방법을 개발하였다. 먼저, open 과 short package 구조를 사용하여 plastic package의 기생성분을 측정된 S-파라미터로부터 정확히 제거하였다. 이와 같이 package do-embedding된 S-파라미터로부터 package lead와 chip pad 사이의 bonding wire 인덕턴스와 chip pad 캐패시턴스를 직접 추출하는 간단한 방법을 구축하였다. 그 후에 내부 BJT소자의 소신호 모델변수들은 RF 등가회로로부터 유도된 Z나 Y-파라미터 방정식을 이용하여 결정하였다. 이 방법으로 모델화된 packaged BJT의 S-파라미터는 측정 데이터와 아주 잘 일치하였으며 이는 새로운 추출방법의 정확성을 증명한다.

• 경영과학
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• 제15권2호
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• pp.59-70
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• 1998

According to the Gartner Group, the market for ERP software in Korea is growing rapidly. However, the number of successful ERP implementations is quite few. Standard(unmodified) ERP's are built based on best practices. Improvements expected from successful implementation are based on best practices built into the software. Many improvements are lost through modification to "standard" software. Even minor changes in software can significantly reduce benefits. Both implementation time and risk factors are increased with modifications. We introduce a methodology, called package Enable Re-engineering (PER) and the main components of change management program by Ernst & Young. "To-Be" model could be developed through the software capabilities. And change management processes such as continuous education and self-developments are required. The philosophy of the change management processes is to let the software package drive the re-engineering practices and avoid moving the software toward the "As-IS" process. Extensive top management involvement, major focus on speed, extensive communication program, and "clear" picture of the future are essential components of change management. We are sure that the complied experiences and model have implications for practice and for academicians for their endeavors in their fields.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 추계학술대회 논문집
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• pp.751-755
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• 1995

It become more difficult to anticipate the performance of fluid power systems as the number of components increases because of nonlinearrities inherent in hydraulic components. In this situation, the computer simulation technique can be an effective tool in the analysis and design of fluid power systems. In this paper, simulation results are presented for dynamic characteriatics of a knuckle crane. Simple models for hydraulic components and relatively detailed motion equations for attachments are used. the simulation reaults are very close to those of experiments. The simulation is performed using a simulation package developed with object-oriented method. This package provides the encironment that user can construct desirct desired circuits form the component library, checks the continuity and compatibility conditions automatically and executes simulation

• 전기학회논문지
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• 제58권1호
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

• 한국정보처리학회논문지
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• 제7권9호
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• pp.2783-2796
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• 2000

전자상거래 시스템에서 패키지 상품의 구매가 이루어지기 위해서는 패키지 상품을 구성하는 상품들이 구비되어 있어야 할뿐만 아니라 충분한 수량이 확보되어 있어야만 구매자의 요구가 있을 때 이를 실시간으로 처리할 수 있게 된다. 그리고 다수의 사용자가 동시에 가상쇼핑몰에 접근하여 패키지 상품을 구매하고자 할 때에도 상품에 대한 동시성 제어가 효율적으로 이루어져야만 한다. 본 논문에서는 고정형 패키지와 맞춤형 패키지상품 구매 시 상품선택과 구매가 효율적으로 이루어지도록 하기 위해서 모든 상품에 대한 실 수량과 판매가능 수량정보를 유지토록 함으로써 구매자의 요구를 실시간으로 처리할 수 있도록 하였고, 트랜잭션의 처리율이 향상되도록 하였다. 그리고 트랜잭션의 동시성 제어를 효율적으로 하기 위해서 잠금을 기반으로 한 동시성제어 알고리즘을 제시하였다.

• 한국멀티미디어학회논문지
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• 제6권4호
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• pp.668-675
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• 2003

Now a days many industries and bigger organisation (Indian Railways, Bharat Heavy Electricals Ltd.) are facing difficulties in implementing the new technology because of non-availability of fully trained staff. Also for the employed technical and other staff lot of resistance management has to face to get them trained for adoption of new technology. There are also very less organisations who can design effective training programmes and at the same time develop course material specially multimedia packages and computer base training (CBT) which can satisfy the need of different target groups of industries. Indian Railways was also facing similar situation while implementing the Air Brake System technology In Indian Railways. TTTI Bhopal took that challenge and designed, developed and trained Indian Railways trainer for implementation of the package on different target group. The present paper offers a case study on the same.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2004년도 전력전자학술대회 논문집(1)
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• pp.321-324
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• 2004

This paper presents a package IC containing some components of DC/DC converter block for mobile phone's sub OLED(Organic Light Emitting Display). Package IC contains a load switch, a control IC, a diode, a switch for on/off operation, and a switch for changing output voltage. It operates with switching frequency of 100kHz, within the range of input voltage, $3.2V\~5.5V$. Duty ratio can be changed up to $93\%$, and maximum power efficiency is $85\%$. This package IC is loaded onto three model of 1.2W mobile phone's sub-OLED.

• 대한전기학회논문지:전력기술부문A
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• 제55권10호
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• pp.418-425
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• 2006

This paper describes a simulation package for a power system using objected-oriented programming. The package includes four parts which are a power flow, a short circuit calculation, a transient simulation program, and an economic dispatch. The graphical user interface(GUI) is designed as a common platform which allows the user to create one-line diagrams of systems, specify components of power systems as well as simulation parameters, and view the output produced by the chosen application. The paper presents the data structure of the functional modules such as the draw module, power system data module, the power system simulation module, and the utility module using the object oriented programming. This package may be useful for educational and research purposes.