• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.353-353
• /
• 2013

최근 고밀도 메모리 반도체의 재료와 빠른 응답을 요구하는 나노입자를 이용한 비휘발성 메모리 소자의 제작에 대한 연구가 활발히 진행되고 있다. 특히, 비휘발성 메모리 소자 중 하나인 저항 변화 메모리 소자는 인가되는 전압에 따라 저항이 급격히 변화하여 적어도 서로 다른 두 저항 상태를 스위칭할 수 있는 물질을 이용하는 소자이다. 따라서 본 연구에서는 화합물 중에서 비휘발성 메모리 장치의 전기적 특성을 향상시킬 수 있는 실리사이드 계열의 바나듐 실리사이드($V_3Si$) 박막을 열처리 과정을 통하여 수 nm 크기의 나노입자로 제작하여, 그래핀을 하부 전극으로 하는 저항 변화 메모리 소자를 제작하였다. p-type (100) 실리콘 기판에 단일층으로 형성되어 있는 그래핀 상에 약 10 nm 두께의 저항 변화층($SiO_2$)을 각각 초고진공 스퍼터링 방법으로 성장시킨 후 $V_3Si$ 나노입자를 제작하기 위해서 $V_3Si$ 금속 박막을 스퍼터링 방법으로 4~6 nm의 두께로 저항 변화층 사이에 증착시켰으며, 급속 열처리 방법으로 질소 분위기에서 $800^{\circ}C$로 5초 동안 열처리하여 $V_3Si$ 나노 입자를 형성하였다. 마지막으로 200 nm 두께의 Pt을 증착하였다. 하부 전극으로 형성되어 있는 그래핀은 라만 분광법을 이용하여 확인하였으며, 제작된 소자의 전기적인 측정은 Agilent E4980A LCR meter, 1-MHz HP4280A와 HP 8166A pulse generator, HP4156A precision semiconductor parameter analyzer을 이용하여 전기적인 특성을 확인하였다.

• Proceedings of the KIEE Conference
• /
• 1994.07b
• /
• pp.1454-1456
• /
• 1994

$Pb(Zr_{0.52}Ti_{0.48})O_3$ ceramic thin films were fabricated from an alkoxide-based solution by Sol-Gel method. $Pb(Zr_{0.52}Ti_{0.48})O_3$ ceramic thin films were formed by spin coating method on $Pt/SiO_2/Si$ substrate at 3000rpm for 30 seconds. The coating process was repeated 6 times and then heat-treated at temperature between 500 - $800[^{\circ}C]$ for 1 hour. The final thickness of the thin films were about 4800[A]. The 100% ferroelectric perovskite phases precipitated under the heat treated at $700[^{\circ}C]$ for 1 hour. $Pb(Zr_{0.52}Ti_{0.48})O_3$ thin films heat-treated at $700[^{\circ}C]$ for 1 hour showed good dielectric constant (812) property.

• Proceedings of the KIEE Conference
• /
• 2006.10a
• /
• pp.115-116
• /
• 2006

Dielectric PST (20/80) / PST (80/20) heterolayered thin films structures were created by a consequent deposition of the PST (20/80) and PST (80/20) thin films on the $Pt/Ti/SiO_2/Si$ substrate using alkoxide-based sol-gel method. Both structural and dielectric properties of heterolayered PST thin films were investigated for the tunable microwave device applications. As the number of coating increases, the lattice distortion decreased. It can be assumed that the lower PST layer affects a nucleation site or a seeding layer for the formation of the upper PST layer. The dielectric constant, dielectric loss and tunability of the PST-6 heterolayered structure measured at 100 kHz were 399, 0.022 and 57.9%, respectively. All these parameters showed an increase with increasing number of coatings due to the decrease in lattice distortion.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07a
• /
• pp.125-129
• /
• 2004

[ $BaTi_4O_9$ ] thin film were grown on $Pt/Ti/SiO_2/Si$ substrate using rf magnetron sputter, and the microstructure and dielectric properties of the thin films were investigated. For the film grown at $350^{\circ}C$ and rapidly thermal annealed at $900^{\circ}C$, the $BaTi_5O_{11}$ Phase was formed. However, the $BaTi_4O_9$ phase was formed when the growing temperature exceeded $450^{\circ}C$ The dielectric constant of the $BaTi_4O_9$ thin film grown at $550^{\circ}C$ and rapidly thermal annealed at $900^{\circ}C$ was about 40 at low frequency range($100kHz{\sim}1MHz$) and 36 at microwave range($1{\sim}10GHz$) which is very close to that of the bulk $BaTi_4O_9$ phase. The dissipation factor was very low, about 0.005 at low frequency as well as microwave range.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.60 no.3
• /
• pp.584-587
• /
• 2011

In this work, the $TiO_2$ and $SnO_2$ thin films as blocking layers were coated directly onto the metal-mesh electrode surface to prevent unnecessary inflow of back-transfer electrons from the electrolyte ($I^-/I_3^-$) to the metal-mesh electrode. The DSCs were fabricated with working electrode of SUS mesh coated with blocking $TiO_2$ and $SnO_2$ layers, dye-attached mesoporous $TiO_2$ film, gel electrolyte and counter electrode of Pt-deposited F:$SnO_2$. From the experimental result, it was ascertained that the efficiency of metal electrode coated with $TiO_2$ by Dip-coating was superior to that of metal electrode coated with $SnO_2$ by Dip-coating and screen printing with the results of experiments. The photo-current conversion efficiency of the cell obtained from optimum fabrication condition was 3% ($V_{oc}$=0.61V, $J_{sc}$=11.64 mA/$cm^2$, ff=0.64) under AM1.5, 100 mW/$cm^2$ illumination.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.11a
• /
• pp.394-397
• /
• 2001

In this paper, in-situ deposited Ru/RuO$_2$ bottom electrodes have been investigated as new bottom electrodes for PZT thin film capacitor application. As a comparison, structural and electrical properties of PZT thin films on Pt/Ti and RuO$_2$ bottom electrodes are also investigated. The use of Ru/RuO$_2$ hybrid electrodes showed better electrical properties in compression with RuO$_2$ bottom electrode. With increasing Ru electrode thickness, the PZT thin films showed preferred orientation along the (110) direction and leakage current of PZT thin films were improved. The PZT thin films on Ru (100nm)/RuO$_2$ electrodes exhibited excellent ferroelectric properties such as remant polarization and coercive field of 7.2 C/$\textrm{cm}^2$ and 46.35 kV/cm, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.16 no.7
• /
• pp.599-603
• /
• 2003

Ferroelectric B $i_4$$_{-x}$N $d_{x}$ $Ti_3$ $O_{12}$ (BNdT) thin films with the composition(x=0.75) were prepared on Pt/Ti/ $SiO_2$(100) substrate by metal-organic deposition. The films were annealed by various temperatures from 550 to $650^{\circ}C$ and then the electrical and structural characteristics of BNdT films were investigated for the application of FRAM. Electrical properties such as dielectric constant, 2Pr and capacitance were quite dependent on the thermal heat treatment. The measured 2Pr value on the BNdT capacitor annealed at $650^{\circ}C$ was 56$\mu$C/$\textrm{cm}^2$ at an applied voltage of 5V. In fatigue characteristics value remained constant up to 8$\times$10$^{10}$ read/write switching cycles at a frequency of 1Mhz regardless of annealing temperatures.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.16 no.5
• /
• pp.361-364
• /
• 2003

It was investigated that the structural and electrical Properties of Ce-doped Ba(Zr$_{x}$Ti$_{1-x}$ )O$_3$ (BCZT) thin films with a mole fraction of x=0.2 and a thickness about 100 nm. BCZT films were prepared on Pt/Ti/SiO$_2$/Si substrate by a RF magnetron sputtering system. We have measured the thickness profile with Ar/O$_2$ ratio and the surface roughness. It was observed that the oxygen gas, which introduced during the film deposition, have an influence on the roughness of the film and the film roughness was reduced by annealing from 2.33 nm to 2.02 nm (RMS at 500 $^{\circ}C$, Ar:6 sccm, $O_2$:6 sccm). It was found that annealing procedure after top electrode deposit can reduce the dissipation factor.

• Proceedings of the KIEE Conference
• /
• 2005.07c
• /
• pp.1835-1837
• /
• 2005

$Bi_{3.25}Y_{0.75}Ti_3O_{12}$[BYT] ferroelectric thin films were deposited by RF-Sputtering method on the $Pt/Ti/SiO_2/Si$. We investigated the effects of processing condition (especially post-annealing) on the structural and dielectric properties of the BYT thin films. The BYT thin films were crystallized well at annealing temperature of $750^{\circ}C$ for 30min. Increasing the annealing temperature, the peak intensity of (117) and c-axis orientation were increased. The calculated lattice constants of BYT thin films were a=0.539nm, b=0.536nm, c=3.288nm. The thickness of the BYT thin films were 350nm. The dielectric constant and dielectric loss at a frequency of 100KHz were 73.3 and 0.021, respectively. The BYT thin films can be used as capacitors in the Ferroelectric Random Access Memory device.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.11a
• /
• pp.45-48
• /
• 2000

High dielectric (Ba,Sr)TiO$_3$ thin films were etched in an inductively coupled plasma (ICP) as a function of C1$_2$/Ar gas mixing ratio. Under Cl$_2$(20)/Ar(80), the maximum etch rate of the BST films was 400$\AA$/min and selectivities of BST to Pt and PR were obtained 0.4 and 0.2, respectively. We investigated the etched surface of BST by x-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and x-ray diffraction (XRD). From the result of XPS analysis, we found that residues of Ba-Cl and Ti-Cl bonds remained on the surface of the etched BST for high boiling point. The surface roughness decreased as Cl$_2$ increases in Cl$_2$/Ar plasma because of non-volatile etching products. This changed the nature of the crystallinity of BST. From the result of XRD analysis, the crystalliility of etched BST film maintained as similar to as-deposited BST under Ar only and Cl$_2$(20)/Ar(80). However, (100) orientation intensity of etched BST film abruptly decreased at Cl$_2$ only plasma. It was caused that Cl compounds were redeposited on the etched BST surface and damaged to crystallinity of BST film during the etch process.