• Electronics and Telecommunications Trends
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• v.20 no.6 s.96
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• pp.62-69
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• 2005

세계 최고 권위의 반도체 시장 조사기관인 Gartner Dataquest는 2004년 세계 메모리시장 규모는 480억 달러로 2003년의 335억 달러 대비 43% 성장하였다고 보고하고있다[1]. 또한 DRAM은 55%, 플래시 메모리는 35%를 차지하고 있으며, 이들 두 메모리가 전체 메모리 시장을 양분하고 있다[1]. DRAM은 cost 및 random access가 가능하다는 장점을 가지고 있지만 휘발성이라는 단점을 가지고 있으며, 플래시 메모리는cost 및 비휘발성의 장점을 보유하고 있으나 random access가 불가능하다는 단점을 보유하고 있다. 하지만, PRAM은 DRAM과 플래시 메모리의 장점만을 융합한 통합형메모리로서, 현재 가장 각광받고 있으며 양산화에 가장 근접한 메모리이다. 본 고에서는 PRAM의 구조 및 동작특성, 개발동향 및 향후 전망에 대해 논의하고자 한다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.19.1-19.1
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• 2009

Phase change random access memory (PRAM)은 large sensing signal margin, fast programming speed, low operation voltage, high speed operation, good data retention, high scalability등을 가지는 가장 유망한 차세대 비휘발성 메모리이다. 현재 PRAM용 상변화 재료로는 주로 Ge2Sb2Te5가 사용되고 있지만 reset 전류가 높고 reliability 가 좋지 않아서 새로운 상변화 물질 연구가 필요하다. AgInSbTe (AIST)는 GST와 더불어 열에 의한 가역적 상변화를 하는 소재로 광기록 매체에서는 기록 속도가 빠르고 동작 특성이 우수하다는 특징이 있다. 본 연구에서는 XRD, 비저항측정등을 통해 온도에 따른 AIST의 물성 및 결정화 특성을 분석하고 나노 소자제작을 통해 그 전기적 특성을 평가하였다.

• Transactions on Electrical and Electronic Materials
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• v.7 no.1
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• pp.7-11
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• 2006

The changes of the electrical conductivity in chalcogenide amorphous semiconductors, $Ge_{1}Se_{1}Te_{2}$, have been studied. A phase change random access memory (PRAM) device without an access transistor is successfully fabricated with the $Ge_{1}Se_{1}Te_{2}$-phase-change resistor, which has much higher electrical resistivity than $Ge_{2}Sb_{2}Te_{5}$ and its electric resistivity can be varied by the factor of $10^5$ times, relating with the degree of crystallization. 100 nm thick $Ge_{1}Se_{1}Te_{2}$ thin film was formed by vacuum deposition at $1.5{\times}10^{-5}$ Torr. The static mode switching (DC test) is tested for the $100\;{\mu}m-sized$ $Ge_{1}Se_{1}Te_{2}$ PRAM device. In the first sweep, the amorphous $Ge_{1}Se_{1}Te_{2}$ thin film showed a high resistance state at low voltage region. However, when it reached to the threshold voltage, $V_{th}$, the electrical resistance of device was drastically reduced through the formation of an electrically conducting path. The pulsed mode switching of the $20{\mu}m-sized$ $Ge_{1}Se_{1}Te_{2}$ PRAM device showed that the reset of device was done with a 80 ns-8.6 V pulse and the set of device was done with a 200 ns-4.3 V pulse.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.179-179
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• 2003

현재 차세대 메모리로 연구되고 있는 것 중 가장 각광 받는 것은 PRAM 이다. MRAM의 경우 복잡한 공정 때문에 상용화에 많은 어려움이 따르는데 반해 PRAM은 DRAM과 유사한 구조를 가지고 있기 때문에 기존 DRAM의 공정라인을 사용할 수 있다는 장점을 가지고 있다. 하지만 PRAM은 높은 작동전류가 필요하다는 단점을 가지고 있다. 따라서 PRAM이 상용화 되기 위해서는 2mA 이하의 작동전류에서 상변환이 일어나야 한다. 여기서 말하는 상변환이란 결정질 상태를 비정질 상태로 변환 시키는 것을 의미한다. 본 연구에서는 우선 8F$^2$ 크기(F=0.15$\mu\textrm{m}$)의 DRAM 단위소자 메모리 구조를 이용하여 lT/lRPCRAM 모델을 구축하였다. 구축된 모델을 이용하여 요구되는 작동전류(2mA이하)에서의 PRAM의 온도 분포를 시뮬레이션을 통하여 예측하였다. 또한 단위소자를 구성하는 재료의 물성 변화가 소자 내부의 온도 분포에 미치는 영향을 분석하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.132-133
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• 2006

PRAM (phase-change random access memory)은 전류 펄스 인가에 따른 기록매질의 비정질-결정질 간 상변화와 그에 동반되는 저항변화를 이용하는 차세대 비휘발성 메모리 소자로서 연구되어지고 있다. 본 논문에서는 $(GeTe)_x(Sb_2Te_3)$ pseudobinary line을 따르는 조성(x=0.5, 1, 2, 8)의 벌크 및 박막시료를 제작하고 원자-스케일의 구조적 상변화를 분석하였다. 열증착을 이용하여 Si 기판위에 200nm 두께의 박막을 형성, 질소분위기 하에서 100-450도 범위에서 열처리 하였다. XRD를 통해 열처리 온도에 따른 구조적 분석을 실시하였다. x=8의 조성을 제외한 전체 박막에 대해 열처리 온도 증가에 따라 fcc와 hexagonal 구조가 순차적으로 나타났으며 일부에서는 혼종의 상구조를 보였다. 특히, $Ge_2Sb_2Te_5$ 박막에 대하여 EXAFS (extended x-ray absorption fine structure) 및 XPS를 이용하여 상변화의 원자-스케일 구조분석을 하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.118-119
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• 2005

PRAM (Phase Change Random Access Memory) is well known to use reversible phase transition between amorphous (high resistance) and crystalline (low resistance) states of chalcogenide thin film by electrical Joule heating. In this paper, we introduce a stack-type PRAM device with a novel GST/TiAlN structures (GST and a heating layer of TiAlN), and report its electrical switching properties. XRD analysis result of GST thin film indicates that the crystallization of the GST film start at about $200^{\circ}C$. Electrical property results such as I-V & R-V show that the phase change switching operation between set and reset states is observed, as various input electrical sources are applied.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.52-52
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• 2009

To date, chalcogenide alloy such as $Ge_2Sb_2Te_5$(GST) have not only been rigorously studied for use in Phase Change Random Access Memory(PRAM) applications, but also temperature gap to make different states is not enough to apply to device between amorphous and crystalline state. In this study, we have investigated a new system of phase change media based on the In-Sb-Te(IST) ternary alloys for PRAM. IST chalcogenide thin films were prepared in trench structure (aspect ratio 5:1 of length=500nm, width=100nm) using Tri methyl Indium $(In(CH_3)_4$), $Sb(iPr)_3$ $(Sb(C_3H_7)_3)$ and $Te(iPr)_2(Te(C_3H_7)_2)$ precursors. MOCVD process is very powerful system to deposit in ultra integrated device like 100nm scaled trench structure. And IST materials for PRAM can be grown at low deposition temperature below $200^{\circ}C$ in comparison with GST materials. Although Melting temperature of 1ST materials was $\sim 630^{\circ}C$ like GST, Crystalline temperature of them was ~$290^{\circ}C$; one of GST were $130^{\circ}C$. In-Sb-Te materials will be good candidate materials for PRAM applications. And MOCVD system is powerful for applying ultra scale integration cell.

• Journal of the Korean Ceramic Society
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• v.42 no.5 s.276
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• pp.326-332
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• 2005

Phase transformation effects on mechanical properties of $Ge_2Sb_2Te_5$, which is a promising candidate material for Phase Change Random Access Memory (PRAM), were studied. $Ge_2Sb_2Te_5$ thin films, which was thermally annealed with different conditions, were analyzed using XRD, AFM, 4-point probe method and reflectance measurement. As the temperature and the dwelling time increased, crystallity and grain size increased, which enhanced elastic modulus and hardness. Furthermore, N2 doping, which was used for better electrical properties, was proved to decrease elastic modulus and hardness of $Ge_2Sb_2Te_5$.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1329-1330
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• 2007

Phase-change random access memory(PRAM) has many advantages compare with the existing memory. For example, fast programming speed, low programming voltage, high sensing margin, low power consume and long cyclability of read/write. Though it has many advantages, there are some points which must be improved. So, we invented and studied new constitution of $Ge_{1}Se_{1}Te_{2}$ chalcogenide material. Actually, the performance properties have been improved surprisingly. However, crystallization time was as long as ever for amorphization time. In this paper, we studied in order to make set operation time and reset operation voltage reduced. In the present work, by alloying Sb in $Ge_{1}Se_{1}Te_{2}$. we could confirm that improved its set operation time and reset operation voltage. As a result, the method of Sb-alloyed $Ge_{1}Se_{1}Te_{2}$ can be solution to decrease the set operation time and reset operation voltage.

• Transactions on Electrical and Electronic Materials
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• v.9 no.6
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• pp.223-226
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• 2008

$Ge_1Se_1Te_2$ chalcogenide amorphous materials was prepared by the conventional melt-quenching method. Samples were processed bye-beam evaporator systems and RF-sputtering systems. Phase change characteristics were analyzed by measuring glassification temperature, crystallization temperature and density of bulk material. The thermal characteristics were measured at the temperature between 300 K and 700 K, and the electrical characteristics were studied within the range from 0 V to 3 V. The obtained results agree with the electrothermal model for Phase-Change Random Access Memory.