• 한국전자파학회지:전자파기술
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• 제24권2호
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• pp.3-14
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• 2013

In this paper, key design issues and considerations for Signal Integrity(SI) and Power Integrity(PI) of a TSV-based 3D IC are introduced. For the signal integrity and power integrity of a TSV-based 3-D IC channel, analytical modeling and analysis results of a TSV-based 3-D channel and power delivery network (PDN) are presented. In addition, various design techniques and solutions which are to improve the electrical performance of a 3-D IC are investigated.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.1195-1196
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• 2008

It is difficult to solve PCB(Printed Circuit Board) Noise problem. Because Electronic circuit system operates very high frequency. Resonance analysis of PCB layout by PI(Power Integrity) Simulation method visualizes distribution of Switching noise between VDD and GND. By using de-cap, we reduce impedance and solve the EMI problems.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.27-33
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• 2010

We have successfully demonstrated a high-pin-count and thin embedded-LSI package to realize next generation's mobile terminals. The following three design key points were applied: (i) Using Cu posts, (ii) Using the coreless structure, (iii) Using a Cu plate as the ground plane. In order to quantitatively determine the contribution of the three points, the five-stage process for reducing the number of metal layers is described by means of the electrical simulation. The point-(i) and (ii) are effective from the viewpoint of the power integrity (PI); that is, these points play important roles in reducing the number of metal layers, and especially the point-(ii) contributes at least twice as the point-(i). The point-(iii) is not effective in the PI, but has a few effects on the signal integrity (SI). For reducing the number of metal layers, we should, at first, pay attention whether the PI characteristics fulfill the specification, and then we should confirm the SI characteristics.

• 전기학회논문지
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• 제63권12호
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• pp.1716-1721
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• 2014

In this paper, a study on automation method for the circuit/EM (Electro-Magnetic) simulation is carried out to analyze effectively the SI/PI (Signal Integrity/Power Integrity) issues which occur on circuits and/or PCBs (Printed Circuit Boards). For the automation of the circuit/EM simulation, algorithms performing each process of the SI/PI analysis automatically (such as ports setup, circuit definition and SI/PI evaluation) are developed; thereby automation system for the SI/PI analysis is constructed with the algorithms. The automation of the circuit/EM simulation is accomplished in the environment of the C/S (Client/Server) architecture in order to reduce resources such as high cost computers demanded for the SI/PI analysis. The automation method for the SI/PI analyses proposed in this paper reduces effort, time, and cost spent on the environment setup for simulation and the SI/PI analysis process. In addition, the proposed method includes automation of the documenting process, which organizes, records and displays the SI/PI analysis results automatically for users.

• Journal of international Conference on Electrical Machines and Systems
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• 제3권3호
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• pp.248-251
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• 2014

As more vehicles become equipped with advanced electronic control systems, more consideration is needed with regards to automotive safety issues related to the effects of electromagnetic waves. Unwanted electromagnetic waves from the antenna, electricity and other electronic devices cause the performance and safety problem of automotive components. In general, Power Integrity and Signal Integrity analysis have been widely used, but these analyses have stayed PCB level. PCB base analysis is different from radiated emission TEST condition so its results are used just for reference. This paper proposes EMC optimization technology using module level 3-dimensional radiation simulation process closed to fundamental test conditions. If module level EMC analysis, which is proposed in this study, is applied to all automotive electronics systems, unexpected EMC noise will be prevented.

• ETRI Journal
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• 제32권2호
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• pp.265-272
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• 2010

To supply a power distribution network with stable power in a high-speed mixed mode system, simultaneous switching noise caused at the multilayer PCB and package structures needs to be sufficiently suppressed. The uni-planar compact electromagnetic bandgap (UC-EBG) structure is well known as a promising solution to suppress the power noise and isolate noise-sensitive analog/RF circuits from a noisy digital circuit. However, a typical UC-EBG structure has several severe problems, such as a limitation in the stop band's lower cutoff frequency and signal quality degradation. To make up for the defects of a conventional EBG structure, a partially located EBG structure with decoupling capacitors is proposed in this paper as a means of both suppressing the power noise propagation and minimizing the effects of the perforated reference plane on the signal quality. The proposed structure is validated and investigated through simulation and measurement in both frequency and time domains.

• 정보통신설비학회논문지
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• 제8권1호
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• pp.1-5
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• 2009

In this paper, we propose a method that applies Vector Fitting (VF) technique to the equivalent circuit model for RF passive components. These days wireless communication system is getting smaller and smaller. So EMI/EMC is an issue in RF. We can solve PI/SI (Power Integrity/Signal Integrity) that one of EMI/EMC problem apply IFFT for 3D EM simulation multiple with input signal. That is time consuming task. Therefore equivalent circuit model using RF passive component is important. VF schemes are implemented to obtain the rational functions. S parameters of the equivalent circuit model is compared to those of EM simulation in case of the microstrip line structure.

• 한국정보통신설비학회:학술대회논문집
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• 한국정보통신설비학회 2009년도 정보통신설비 학술대회
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• pp.281-284
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• 2009

In this paper, we propose a method that applies Adaptive Frequency Sampling(AFS) technique to the equivalent circuit model for RF passive components. Thes days wireless communication system is getting smaller and smaller. So EMI/EMC is an issue in RF. We can solve PI(Power Integrity)/SI(Signal Integrity) that one of EMI/EMC problem apply IFFT for 3D EM simulation multiple with input signal. That is time comuming task. Therefore equivalent circuit model using RF passive component is important. AFS schemes are implemented to obtain the rational functions. S parameters of the equivalent circuit moldel is compared to those of EM simulation in case of the microstrip line structure.

• Biomolecules & Therapeutics
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• 제26권4호
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• pp.409-416
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• 2018

Vasicinone, a quinazoline alkaloid from Adhatoda vasica Nees. is well known for its bronchodilator activity. However its anti-proliferative activities is yet to be elucidated. Here-in we investigated the anti-proliferative effect of vasicinone and its underlying mechanism against A549 lung carcinoma cells. The A549 cells upon treatment with various doses of vasicinone (10, 30, 50, $70{\mu}M$) for 72 h showed significant decrease in cell viability. Vasicinone treatment also showed DNA fragmentation, LDH leakage, and disruption of mitochondrial potential, and lower wound healing ability in A549 cells. The Annexin V/PI staining showed disrupted plasma membrane integrity and permeability of PI in treated cells. Moreover vasicinone treatment also lead to down regulation of Bcl-2, Fas death receptor and up regulation of PARP, BAD and cytochrome c, suggesting the anti-proliferative nature of vasicinone which mediated apoptosis through both Fas death receptors as well as Bcl-2 regulated signaling. Furthermore, our preliminary studies with vasicinone treatment also showed to lower the ROS levels in A549 cells and have potential free radical scavenging (DPPH, Hydroxyl) activity and ferric reducing power in cell free systems. Thus combining all, vasicinone may be used to develop a new therapeutic agent against oxidative stress induced lung cancer.

• 전자공학회논문지
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• 제50권9호
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• pp.201-208
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• 2013

본 논문에서는 USB(Universal Serial Bus) 케이블 전원선에서의 방사성 EMI(Electro-Magnetci Interference) 개선 방안을 제시한다. 케이블 전원선에서의 EMI 방사현상을 확인하기 위해 무선 비디오 액세스 시스템을 이용하여, 방사성 EMI 결과를 분석하고 초기 측정 결과 규제치 대비 약 3 [dBuV/m]~15 [dBuV/m]를 초과함을 확인한다. 방사성 EMI 원인 분석을 위해, 먼저 USB 케이블 전원선에서의 S-파라미터 측정을 수행하여 케이블의 고주파수 대역에서의 규칙적인 공진현상과 방사성 EMI 주파수의 연관성을 분석한다. 그리고, 전원 회로 임피던스 관리 기법을 응용하여 캐패시터의 개수 선정, 비드를 이용한 저역통과 대역 필터를 구성을 통해 케이블 전원선의 공진현상을 저감하는 개선방법을 적용한다. 결론적으로 개선된 회로를 시스템에 적용하여 케이블의 규칙적 공진의 저감방법을 제시하여, 방사성 EMI 테스트 결과 규제치 대비 약 3 [dBuV/m]~20 [dBuV/m] 마진의 마진을 확보하여 제시한 방법의 적합성 확인한다.