• 제목/요약/키워드: PECVD (Plasma Enhanced Vapor Deposition)

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Fabrication of High Break-down Voltage MIM Capacitors for IPD Applications

  • Wang, Cong;Kim, Nam-Young
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.241-241
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    • 2009
  • For the Radio Frequency Integrated Passive Device (RFIPD) application, we have successfully developed and characterized high break-down voltage metal-insulator-metal (MIM) capacitors with 2,000 ${\AA}$ plasma-enhanced chemical vapor deposition (PECVD) silicon nitride which deposited with $SiH_4/NH_3$ gas mixing rate, working pressure, and RF power of PECVD at $250^{\circ}C$ chamber temperature. At the PECVD process condition of gas mixing rate (0.957), working pressure (0.9 Torr), and RF power (60 W), the AFM RMS value of about 2,000 ${\AA}$ silicon nitride on the bottom metal was the lowest of 0.862 nm and break-down electric field was the highest of about 8.0 MV/cm with the capacitance density of 326.5 $pF/mm^2$.

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PECVD로 증착된 금속층을 포함하는 DLC 박막의 기계적 특성 분석 (An Analysis of Tribological Properties of Metal Interlayered DLC Films Prepared by PECVD Method)

  • 전영숙;최원석;홍병유
    • 한국전기전자재료학회논문지
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    • 제19권7호
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    • pp.631-635
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    • 2006
  • The properties of metal interlayered DLC films between the Si substrate and the DLC films were studied. DC magnetron sputtering method has been used to deposit intermediate layers of metals. And RF-PECVD method has been employed to synthesize DLC onto substrates of the silicon and metal layers. After we used metal Inter-layers, such as chromium, nickel, titanium and we studied tribological properties of the DLC films. The thickness of films were observed by field emission scanning electron microscope (FE-SEM). Also the surface morphology of the films were observed by an atomic force microscope (AFM). The crystallographic properties of the films were analyzed with X-ray diffraction (XRD), the friction coefficients were investigated by AFM in friction force microscope (FFM) mode. Tribological performances of the films were estimated by nano-indenter, stress tester measurement.

PECVD 무선주파수 변화에 따른 전면 패시베이션 특성비교

  • 이경동;배수현;김성탁;박성은;이해석;김동환
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.489.1-489.1
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    • 2014
  • Plasma Enhanced Chemical Vapor Deposition (PECVD) 장치를 통하여 증착된 수소화된 질화막(SiNx:H)은 결정질 태양전지의 반사방지막과 패시베이션 층으로 널리 사용되고 있다. 본 연구에서는 PECVD 장치내에 플라즈마를 형성하는 무선주파수(Radio Frequency)를 다양하게 변화시켜 수소화된 실리콘 질화막의 경향성을 알아보고 각 무선주파수에서 최적화된 패시베이션층을 태양전지에 적용하여 그 특성들을 분석하였다. 다양한 무선주파수 범위는 고주파(High Frequency: 13.56 MHz), 저주파 (Low Frequency: 440 kHZ) 그리고 혼합주파(Dual Frequency: 13.56 MHz + 440 kHz)를 각각 이용하여 수소화된 질화막을 증착 하였으며 $156{\times}156mm$ 대면적 결정질 실리콘 태양전지를 제작하여 비교하였다.

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PECVD를 이용한 고굴절률차 SiON 평면 광도파로 박막 제작 (Fabrication of high-refractive index difference SiON planar optical waveguide film using PECVD)

  • 이노도;구영진;김영철;서화일
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2006년도 춘계학술대회
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    • pp.211-215
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    • 2006
  • 평면 광도파로 코어로 사용되는 SiON (Silicon oxynitride)과 클래딩으로 사용되는 $SiO_2$ (Silicon oxide)의 굴절률 차이가 2.5 %인 고굴절률차 평면 광도파로용 SiON 박막을 PECVD (plasma enhanced chemical vapor deposition)로 제작하였다. PECVD에 사용된 가스는 $SiH_4,\;NH_3,\;N_{2}O$이고, Si 기판의 $SiO_2$ 막은 100 nm이다. 가스의 비율에 따라 SiON 막의 굴절률은 633 nm의 파장에서 1.476에서 1.777까지 변화하였다. 코어로 사용되는 SiON의 두께는 $2.5{\mu}m$이고 클래딩과의 굴절률 차이는 2.5 %였다.

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Effect of Gas ratio on the anti-reflective properties of SiNx by PECVD

  • 허종규;;조재현;한규민;이준신
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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    • pp.200-201
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    • 2008
  • 태양전지 제작 시 반사방지막(Anti-reflection Coating)이 태양전지 효율에 미치는 영향을 알아보기 위한 실험으로 최적의 가스비를 알아보기 위하여 Plasma Enhanced Chemical Vapor Deposition(PECVD)를 이용한 Silicon nitride 증착 실험이다. SiH4 가스를 45 sccm으로 고정시킨 상태에서 NH3를 25,45,60,90,135 sccm으로 가변하여 Carrier Lifetime과 Refractive index를 측정하였다. PECVD의 조건은 기판온도 $450^{\circ}C$, Chamber 압력 1 Torr, 증착두께 $1000\AA$으로 고정하였다. 증착 후 500, 600, 700, $800^{\circ}C$로 열처리를 하고나서 Carrier Lifetime을 측정하여 열처리에 대한 효과도 알아보았다.

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PECVD에 의해 작성된 탄소계 박막의 전계전자방출특성에 대한 RF power 의존성에 관한 연구 (RF power dependence on field emission property from carbon thin film grown by PECVD)

  • 류정탁;김연보
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 추계학술대회 논문집
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    • pp.519-523
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    • 2000
  • Using plasma-enhanced chemical vapor deposition (PECVD), carbon thin film as electron field emitter were fabricated. These carbon thin film were deposited on Si(100) substrate at several RF power. These film were estimated by raman spectroscopy, scanning electron microscopy, and field emission. The field electron emission property of these carbon thin film was estimated by a diode technique. As the result, we observed that the field emission properties of these films were promoted by higher RF power. These results are explained as change of surface morphology and structural properties of carbon thin film

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Lifetime characteristics of flexible organic light emitting diodes on PET substrate with plasma polymer barrier layers

  • Kim, Kyu-Hyung;Kho, Sam-Il;Jung, Dong-Geun;Boo, Jin-Hyo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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    • pp.41-43
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    • 2004
  • Plasma polymerized para-xylene ($PP_PX$) deposited by plasma-enhanced chemical vapor deposition (PECVD) was used as the barrier layer on the polyethylene terephthalate (PET) substrate to improve lifetime of the flexible organic light-emitting diodes (FOLEDs). The $PP_PX$ barrier layer deposited on top of the PET substrate with plasma power of 30 W at deposition pressure of 0.2 torr showed transmittance spectra good enough to be applied in FOLED on PET substrates. FOLEDs with the $PP_PX$ barrier layer (barrier-FOLEDs) showed similar I-V and B-V characteristics to FOLEDs without the $PP_PX$ layer (control-FOLEDs). The lifetime of barrier-FOLED was two times longer than that of the control-FOLED. With $PP_PX$ passivation layers, lifetimes of both control and barrier-FOLEDs were improved by more than 4 times. These results show that PECVD deposited $PP_PX$ layers can be used as barrier layers for FOLEDs on plastic substrates as well as passivation layers for general OLEDs.

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PECVD의 주파수 조건에 따른 $SiN_x$막 증착 (The Silicon Nitride Films according to The Frequency Conditions of Plasma Enhanced Chemical Vapor Deposition)

  • 최정호;노시철;정종대;서화일
    • 반도체디스플레이기술학회지
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    • 제13권4호
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    • pp.21-25
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    • 2014
  • The silicon nitride ($SiN_x$) film for surface passivation and anti-reflection coating of crystalline silicon solar cell is very important and it is generally deposited by plasma enhanced chemical vapor deposition (PECVD). PECVD can be divided into low and high frequency method. In this paper, the $SiN_x$ film deposited by low and high frequency PECVD method was studied. First, to optimize the $SiN_x$ film deposited by low frequency PECVD method, the refractive index was measured by varying the process conditions like $SiH_4$, $NH_3$, $N_2$ gas rate, and RF power. When $SiH_4$ gas rate was increased and $NH_3$ gas rate was decreased, the refractive index was increased. The refractive index was also increased with RF power decline. Second, to compare the characteristics of the low and high frequency PECVD $SiN_x$ film, the refractive index was measured by varying $NH_3/SiH_4$ gas ratio and RF power and the minority carrier lifetime of before and after high temperature treatment process was also measured. The refractive index of both low and high frequency PECVD $SiN_x$ film was decreased with increase in $NH_3/SiH_4$ gas ratio and RF power. After high temperature treatment process, the minority carrier lifetime of both low and high frequency PECVD $SiN_x$ film was increased and increased degree was similar. The minority carrier lifetime of low frequency PECVD $SiN_x$ was increased from $11.03{\mu}m$ to $28.24{\mu}m$ and that of high frequency PECVD $SiN_x$ was increased from $11.60{\mu}m$ to $27.10{\mu}m$.

Field emission from hydrogen-free DLC

  • Suk Jae chung;Han, Eun-Jung;Lim, Sung-Hoon;Jin Jang
    • Journal of Korean Vacuum Science & Technology
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    • 제3권1호
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    • pp.49-53
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    • 1999
  • We have studied the field emission characteristics of diamond-like-carbon (DLC) films deposited by a layer-by-layer technique using plasma enhanced chemical vapor deposition, in which the deposition of a thin layer of DLC and a CH4 plasma exposure on its surface were carried out alternatively. The hydrogen-free DLC can be deposited by CH4 plasma exposure for 140 sec on a 5 nm DLC layer. N2 gas-phase doping in the CH4 plasma was also carried out to reduce the work function of the DLC. The optimum [N2]/[CH4] flow rate ratio was found to be 9% for the efficient electron emission, at which the onset-field was 7.2 V/$\mu\textrm{m}$. It was found that the hydrogen-free DLC has a stable electron emitting property.

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실리콘 박막 태양전지에서 광 포획(light trapping) 개선에 관한 연구 (STUDY ON THE IMPROVEMENT OF LIGHT TRAPPING IN THE SILICON-BASED THIN-FILM SOLAR CELLS)

  • 전상원;이정철;안세진;윤재호;김석기;박병옥;송진수;윤경훈
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2005년도 춘계학술대회
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    • pp.192-195
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    • 2005
  • The silicon thin film solar cells were fabricated by 13.56 MHz PECVD (Plasma-Enhanced Chemical-Vapor Deposition) and 60 MHz VHF PECVD (Very High-Frequency Plasma-Enhanced Chemical-Vapor Deposition). We focus on textured ZnO:Al films prepared by RF sputtering and post deposition wet chemical etching and studied the surface morphology and optical properties. These films were optimized the light scattering properties of the textured ZnO:Al after wet chemical etching. Finally, the textured ZnO:Al films were successfully applied as substrates for silicon thin films solar cells. The efficiency of tandem solar cells with $0.25 cm^2$ area was $11.8\%$ under $100mW/cm^2$ light intensity. The electrical properties of tandem solar cells were measured with solar simulator (AM 1.5, $100 mW/cm^2)$ and spectral response measurements.

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